Three-surface wide field-of-view lens system

US9778443B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9778443-B2
Application numberUS-201514875012-A
CountryUS
Kind codeB2
Filing dateOct 5, 2015
Priority dateOct 5, 2015
Publication dateOct 3, 2017
Grant dateOct 3, 2017

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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Abstract

Official abstract text for this publication.

A three-surface wafer-level lens system for imaging a wide field-of-view scene onto an image plane includes (a) a first wafer-level lens with (i) a first substrate having a first planar surface facing the image plane, and (ii) a first lens element bonded to the first planar surface and having a first lens surface facing the image plane, and (b) a second wafer-level lens with (i) a second substrate having a second planar surface facing away from the image plane, (ii) a third substrate bonded to the second substrate and having a third planar surface facing the image plane, (iii) a second lens element bonded to the second planar surface and having a second lens surface facing away from the image plane, and (iv) a third lens element bonded to the third planar surface and having a third lens surface facing the image plane.

First claim

Opening claim text (preview).

What is claimed is: 1. A three-surface wafer-level lens system for imaging a wide field-of-view scene onto an image plane, comprising: a first wafer-level lens including a first substrate having a first planar surface facing the image plane, and a first lens element bonded to the first planar surface and having a first lens surface facing the image plane; a second wafer-level lens including a second substrate having a second planar surface facing away from the image plane, a third substrate bonded to the second substrate and having a third planar surface facing the image plane, a second lens element bonded to the second planar surface and having a second lens surface facing away from the image plane, and a third lens element bonded to the third planar surface and having a third lens surface facing the image plane; wherein total track length TTL and image circle diameter IC of the three-surface wafer-level lens system are characterized by TTL/IC<1.45. 2. The three-surface lens system of claim 1 , the first lens surface being concave, each of the second lens surface and the third lens surface being convex. 3. The three-surface lens system of claim 1 , the first lens surface and the second lens surface being separated from each other by an air gap; and the second lens surface and the third lens surface being separated from each other by a second solid portion. 4. The three-surface lens system of claim 3 , comprising an aperture stop located between the second lens surface and the third lens surface. 5. The three-surface lens system of claim 4 , the second solid portion including a second planar substrate and a third planar substrate having an interface with the second planar substrate, the aperture stop being located at the interface. 6. The three-surface wafer-level lens system of claim 1 , IC being greater than diameter of each of the first wafer-level lens and the second wafer-level lens. 7. The three-surface wafer-level lens system of claim 1 , having effective focal length EFFL, the first lens surface having radius of curvature R1, the second lens surface having radius of curvature R2, the first lens surface and the second lens surface being separated from each other by an air gap of length GAP at optical axis of the three-surface wafer-level lens system, wherein R1<0.45 millimeters, R2<1.0 millimeters, GAP>0.3 millimeters, and EFFL<0.95 millimeters. 8. The three-surface wafer-level lens system of claim 7 , having field of view angle of at least 145 degrees. 9. The three-surface wafer-level lens system of claim 1 , the first lens surface and the second lens surface being separated from each other by an air gap of length GAP at optical axis of the three-surface wafer-level lens system, wherein 0.45 millimeters<GAP*(TTL/IC)<0.55.

Assignees

Inventors

Classifications

  • employing wafer level optics · CPC title

  • having two lenses · CPC title

  • having two components only · CPC title

  • Lenses · CPC title

  • at least one element being a compound optical element, e.g. cemented elements · CPC title

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What does patent US9778443B2 cover?
A three-surface wafer-level lens system for imaging a wide field-of-view scene onto an image plane includes (a) a first wafer-level lens with (i) a first substrate having a first planar surface facing the image plane, and (ii) a first lens element bonded to the first planar surface and having a first lens surface facing the image plane, and (b) a second wafer-level lens with (i) a second substr…
Who is the assignee on this patent?
Omnivision Tech Inc
What technology area does this patent fall under?
Primary CPC classification G02B13/0085. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Oct 03 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).