Method and apparatus for measuring asymmetry of a microstructure, position measuring method, position measuring apparatus, lithographic apparatus and device manufacturing method

US9778025B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9778025-B2
Application numberUS-201314421434-A
CountryUS
Kind codeB2
Filing dateJul 17, 2013
Priority dateAug 16, 2012
Publication dateOct 3, 2017
Grant dateOct 3, 2017

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Abstract

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A lithographic apparatus includes an alignment sensor including a self-referencing interferometer for reading the position of an alignment target comprising a periodic structure. An illumination optical system for focusing radiation into a spot on said structure. An asymmetry detection optical system receives a share of positive and negative orders of radiation diffracted by the periodic structure, and forms first and second images of said spot on first and second detectors respectively, wherein said negative order radiation is used to form the first image and said positive order radiation is used to form the second image. A processor for processing together signals from said first and second detectors representing intensities of said positive and negative orders to produce a measurement of asymmetry in the periodic structure. The asymmetry measurement can be used to improve accuracy of the position read by the alignment sensor.

First claim

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The invention claimed is: 1. An apparatus for method of measuring an asymmetry dependent parameter of a periodic structure on a substrate, the apparatus comprising: an illumination optical system for focusing radiation into a spot on said structure; first and second detectors of radiation; a detection optical system for receiving radiation diffracted by the periodic structure, including at the same time both positive and negative higher orders of diffracted radiation, and forming first and second images of said spot on first and second detectors respectively, wherein said negative order radiation is used to form the first image and said positive order radiation is used to form the second image; a processor for processing together signals from said first and second detectors representing intensities of said positive and negative orders to produce a measurement of said asymmetry dependent parameter in the periodic structure; and a position sensing optical system, the position sensing optical system and detection optical system each receiving a share of said positive and negative orders of diffracted radiation, the position sensing optical system comprising an interferometer for generating a position-sensitive signal that varies as the spot of radiation traverses the periodic structure, the processor further processing the position-sensitive signal to calculate a position of the substrate relative to the apparatus. 2. An apparatus as claimed in claim 1 wherein said illumination optical system is operable in an on-axis illumination mode in which said spot is formed by a beam radiation aligned with an optical axis of said detection optical system. 3. An apparatus as claimed in claim 1 wherein said illumination system is operable in an off-axis mode of illumination in which said spot is formed by at least two beams of radiation incident from directions symmetrically opposite one another with respect to an optical axis of said detection optical system. 4. An apparatus as claimed in claim 1 wherein said illumination optical system is selectively operable in an on-axis illumination mode in which said spot is formed by a beam radiation aligned with an optical axis of said detection optical system and an off-axis mode of illumination in which said spot is formed by at least two beams of radiation incident from directions symmetrically opposite one another with respect to an optical axis of said detection optical system. 5. An apparatus as claimed in claim 1 wherein said first and second detectors can resolve different wavelengths of radiation and said processor compares signals captured at more than one wavelength for each of said positive and negative orders to provide said measure of an asymmetry dependent parameter. 6. An apparatus as claimed in claim 1 wherein said detection optical system comprises a splitting element located in a pupil plane for diverting opposite portions of a radiation field in different directions, whereby diffraction orders passing through one half of the pupil plane are deflected differently to diffraction orders passing through the other half. 7. An apparatus as claimed in claim 6 wherein said splitting element has portions formed to allow one or more zero order beams to pass undiverted. 8. An apparatus as claimed in claim 6 wherein said splitting element comprises a one or more prismatic refracting elements provided upstream from a focusing element which forms the separate images of the spot on the first and second detectors. 9. An apparatus as claimed in claim 6 wherein said splitting element is combined with a focusing element which forms the separate images of the spot on the first and second detectors. 10. An apparatus as claimed in claim 6 wherein said splitting element comprises one or more reflectors. 11. An apparatus as claimed in claim 1 wherein said detection optical system is operable also to form an image of said spot using zeroth order diffracted radiation received from the structure on a third detector. 12. An apparatus as claimed in claim 1 wherein said illumination system is operable in an off-axis mode of illumination in which said spot is formed by at least two beams of radiation incident from directions symmetrically opposite one another with respect to an optical axis of said detection optical system, wherein said detection optical system is operable also to form separate images of said spot using zeroth order diffracted radiation of said two beams on third and fourth detectors. 13. An apparatus as claimed in claim 1 wherein said detection optical system and detectors are arranged to process different polarization components of said diffracted radiation separately, and said processor is arranged to process signals representing intensities of said positive and negative diffraction orders in said different polarizations together. 14. An apparatus as claimed in claim 1 wherein said processor is arranged to use said measurement of an asymmetry dependent parameter when calculating said position, to correct at least partially for asymmetry sensitivity in the position-sensitive signal. 15. A lithographic apparatus comprising: a patterning subsystem for transferring a pattern to a substrate; a measuring subsystem for measuring positions of said substrate in relation to the patterning subsystem, wherein the patterning subsystem is arranged to use the positions measured by the measuring subsystem to apply said pattern at a desired position on the substrate and wherein the measuring subsystem includes an apparatus as claimed in claim 1 . 16. A method of measuring an asymmetry dependent parameter of a periodic structure formed on a substrate, the method comprising the steps of: (a) focusing radiation into a spot on said structure; (b) receiving radiation diffracted by the periodic structure, including at the same time both positive and negative higher orders of diffracted radiation, (c) forming first and second images of said spot on first and second detectors respectively, wherein said negative order radiation is used to form the first image and said positive order radiation is used to form the second image; (d) processing together signals from said first and second detectors representing intensities of said positive and negative orders to produce a measurement of an asymmetry dependent parameter in the periodic structure; and (f) using a share of said positive and negative orders of diffracted radiation for generating a position-sensitive signal that varies as the spot of radiation traverses the periodic structure, and (g) processing the position-sensitive signal to calculate a position of the substrate relative to the apparatus. 17. A method as claimed in claim 16 wherein said spot is formed by a beam radiation aligned with an optical axis of an optical system used to form said images of said spot. 18. A method as claimed in claim 16 wherein said spot is formed by at least two beams of radiation incident from directions symmetrically opposite one another with respect to an optical axis of an optical system used to form said images of said spot. 19. A method as claimed in claim 16 wherein, depending on a pitch of the periodic structure being measured, said spot is either formed by a beam radiation aligned with an optical axis of an optical system used to form said spot or said spot is formed by at least two beams of radiation incident from directions symmetrically opposite one another with respect to the optical axis of said optical system. 20. A method as claimed in cl

Assignees

Inventors

Classifications

  • Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection · CPC title

  • Overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the same layer in multiple exposures or stitching · CPC title

  • for testing the alignment of axes {(means for centering or aligning a light guide within a ferrule G02B6/3834)} · CPC title

  • Dimensions, e.g. line width, critical dimension [CD], profile, sidewall angle or edge roughness · CPC title

  • G01B11/14Primary

    for measuring distance or clearance between spaced objects or spaced apertures (G01B11/26 takes precedence; rangefinders G01C3/00) · CPC title

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What does patent US9778025B2 cover?
A lithographic apparatus includes an alignment sensor including a self-referencing interferometer for reading the position of an alignment target comprising a periodic structure. An illumination optical system for focusing radiation into a spot on said structure. An asymmetry detection optical system receives a share of positive and negative orders of radiation diffracted by the periodic struct…
Who is the assignee on this patent?
Asml Netherlands Bv
What technology area does this patent fall under?
Primary CPC classification G03F7/70633. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Oct 03 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).