Method for manufacturing silicon carbide epitaxial substrate, and silicon carbide epitaxial substrate

Patent metadata

Field	Value
Publication number	US-9777404-B2
Application number	US-201515114017-A
Country	US
Kind code	B2
Filing date	May 21, 2015
Priority date	Nov 12, 2014
Publication date	Oct 3, 2017
Grant date	Oct 3, 2017

Abstract

A method for manufacturing a silicon carbide epitaxial substrate includes: a step of placing a silicon carbide single crystal substrate within a chamber and reducing a pressure within the chamber; a step of increasing a temperature within the chamber to a first temperature; a step of introducing hydrogen gas into the chamber and adjusting the pressure within the chamber; a step of introducing hydrocarbon gas into the chamber; a substrate reforming step of increasing the temperature within the chamber to a second temperature and holding the temperature at the second temperature for a predetermined time, with the adjusted pressure within the chamber and a flow rate of the hydrogen gas being maintained and the hydrocarbon gas being introduced; and a step of growing an epitaxial layer on the silicon carbide single crystal substrate by introducing silane gas into the chamber with the second temperature being maintained.

First claim

The invention claimed is:

1. A silicon carbide epitaxial substrate, comprising:
a silicon carbide single crystal substrate having a main surface inclined relative to a {0001} plane by more than or equal to 1° and less than or equal to 8°; and
an epitaxial layer formed on the silicon carbide single crystal substrate,
trapezoidal defects disposed in a surface of the epitaxial layer, the trapezoidal defects, which are trapezoidal depressions, having a defect density of less than or equal to 1/cm 2 ,
the trapezoidal defects each including an upper base portion and a lower base portion intersecting with a <11-20>direction when viewed in plan view,
the upper base portion having a width of more than or equal to 0.1 μm and less than or equal to 100 μm,
the lower base portion having a width of more than or equal to 50 μm and less than or equal to 5000 μm,
the upper base portion including a protruding portion,
the lower base portion including a plurality of step bunchings,
wherein the defect density of the trapezoidal defects is more than zero.

2. The silicon carbide epitaxial substrate according to claim 1 , wherein the silicon carbide single crystal substrate has a diameter of more than or equal to 100 mm.

3. The silicon carbide epitaxial substrate according to claim 1 , wherein the epitaxial layer has a thickness of more than or equal to 5 μm and less than or equal to 30 μm.

4. A silicon carbide epitaxial substrate, comprising:
a silicon carbide single crystal substrate having a main surface inclined relative to a {0001} plane by more than or equal to 1° and less than or equal to 8° and having a diameter of more than or equal to 100 mm; and
an epitaxial layer formed on the silicon carbide single crystal substrate and having a thickness of more than or equal to 5 μm and less than or equal to 30 μm,
trapezoidal defects disposed in a surface of the epitaxial layer, the trapezoidal defects, which are trapezoidal depressions, having a defect density of less than or equal to 1/cm 2 ,
the trapezoidal defects each including an upper base portion and a lower base portion intersecting with a <11-20>direction when viewed in plan view,
the upper base portion having a width of more than or equal to 0.1 μm and less than or equal to 100 μm,
the lower base portion having a width of more than or equal to 50 μm and less than or equal to 5000 μm,
the upper base portion including a protruding portion,
the lower base portion including a plurality of step bunchings,
wherein the defect density of the trapezoidal defects is more than zero.

Assignees

• Sumitomo Electric Industries

Inventors

• Wada Keiji
• Nishiguchi Taro
• Genba Jun

Classifications

• H10P14/3408

  Silicon carbide · CPC title

• H10P14/2926

  Crystal orientations · CPC title

• H10P14/2904

  Silicon carbide · CPC title

• H10P14/24

  using chemical vapour deposition [CVD] · CPC title

• C23C16/46

  characterised by the method used for heating the substrate (C23C16/48, C23C16/50 take precedence) · CPC title