Multi-layered 3D printed laser direct structuring for electrical interconnect and antennas

Patent metadata

Field	Value
Publication number	US-9777380-B2
Application number	US-201615202936-A
Country	US
Kind code	B2
Filing date	Jul 6, 2016
Priority date	Jul 7, 2015
Publication date	Oct 3, 2017
Grant date	Oct 3, 2017

Abstract

A multi-layered 3D printed laser direct structuring method and apparatus for electrical interconnect and antennas. 3D printed components can be configured with structurally integrated metal connections (e.g., bulk highly conductive metal) that traverse multiple layers (some embedded and others external) of a structure fabricated using an additive manufacturing system enhanced with an iterative laser activated plating processes, which includes a novel well side-wall vertical interconnect.

First claim

What is claimed is:

1. A method of making a three-dimensional electronic or electromechanical component/device, said method comprising: configuring with a 3D printer at least two layers of a three-dimensional substrate of a structure activated by a laser; selectively activating at least one interconnect utilizing traces of said at least one interconnect by said laser with respect to said structure; electrolessly plating said structure to provide a new electrical interconnect that is highly conductive and densely routed; re-inserting said structure with registration into said 3D printer; depositing an additional dielectric with a majority of said new electrical interconnect covered and embedded, but with at least some of said new electrical interconnect exposed at a bottom of at least one well having sidewalls; and activating said sidewalls of said at least one well and providing a connection between said at least two layers.

2. The method of claim 1 wherein said at least one interconnect comprises a horizontal interconnect.

3. The method of claim 1 wherein said at least one interconnect comprises a vertical interconnect.

4. The method of claim 1 wherein said at least one interconnect comprises a horizontal interconnect and a vertical interconnect.

5. The method of claim 1 wherein said structure comprises a dielectric structure.

6. The method of claim 1 wherein said connection between said at least two layers is provided after a subsequent electroless plating operation.

7. The method of claim 1 wherein activating said sidewalls of said at least one well, further comprises activating said sidewalls of said at least one well with said laser.

8. A three-dimensional electronic or electromechanical apparatus, comprising: at least two layers of a three-dimensional substrate of a structure activated by a laser, said at least two layers created with a 3D printer; at least one interconnect selectively activated using traces of said at least one interconnect by said laser with respect to said structure; a new electrical interconnect that is highly conductive and densely routed, said new electrical interconnect provided by electrolssly plating said structure, wherein said structure is re-inserted with registration into said 3D printer; an additional dielectric deposited with a majority of said new electrical interconnect covered and embedded, but with at least some of said new electrical interconnect exposed at a bottom of at least one well having sidewalls; and wherein said sidewalls of said at least one well are activated and a connection provided between said at least two layers.

9. The apparatus of claim 8 wherein said at least one interconnect comprises a horizontal interconnect.

10. The apparatus of claim 8 wherein said at least one interconnect comprises a vertical interconnect.

11. The apparatus of claim 8 wherein said at least one interconnect comprises a horizontal interconnect and a vertical interconnect.

12. The apparatus of claim 8 wherein said structure comprises a dielectric structure.

13. The apparatus of claim 8 wherein said connection between said at least two layers is provided after a subsequent electroless plating operation.

14. The apparatus of claim 8 wherein activation of said sidewalls of said at least one well, comprises: activation of said sidewalls of said at least one well with said laser.

15. A three-dimensional electronic or electromechanical apparatus, comprising: at least two layers of a three-dimensional substrate of a structure activated by a laser, said at least two layers created with a 3D printer; a horizontal and vertical interconnect selectively activated using traces of said horizontal and vertical interconnect by said laser with respect to said structure; a new electrical interconnect that is highly conductive and densely routed, said new electrical interconnect provided by electrolessly plating said structure, wherein said structure is re-inserted with registration into said 3D printer; an additional dielectric deposited with a majority of said new electrical interconnect covered and embedded, but with at least some of said new electrical interconnect exposed at a bottom of at least one well having sidewalls; and wherein said sidewalls of said at least one well are activated and a connection provided between said at least two layers.

16. The apparatus of claim 15 wherein said structure comprises a dielectric structure.

17. The apparatus of claim 15 wherein said connection between said at least two layers is provided after a subsequent electroless plating operation.

18. The apparatus of claim 15 wherein activation of said sidewalls of said at least one well, comprises: activation of said sidewalls of said at least one well with said laser.

19. The apparatus of claim 15 wherein said structure comprises a dielectric structure and wherein said connection between said at least two layers is provided after a subsequent electroless plating operation.

20. The apparatus of claim 19 wherein activation of said sidewalls of said at least one well, comprises: activation of said sidewalls side of said at least one well with said laser.

Assignees

• Univ Texas

Inventors

• Macdonald Eric
• Espalin David
• Wicker Ryan

Classifications

• H05K3/422

  characterised by electroless plating method; pretreatment therefor · CPC title

• C23C18/1612

  through irradiation means · CPC title

• H05K2203/107

  Using laser light · CPC title

• H05K2203/0759

  Forming a polymer layer by liquid coating, e.g. a non-metallic protective coating or an organic bonding layer · CPC title

• H05K2203/072

  Electroless plating, e.g. finish plating or initial plating · CPC title