Method for manufacturing ink jet head

Patent metadata

Field	Value
Publication number	US-9776406-B2
Application number	US-201615046361-A
Country	US
Kind code	B2
Filing date	Feb 17, 2016
Priority date	Sep 17, 2013
Publication date	Oct 3, 2017
Grant date	Oct 3, 2017

Abstract

Provided are a method for manufacturing an ink jet head and an ink jet head. The method includes: arranging a vibrating plate on lower surface of a substrate; arranging a piezoelectric actuator on surface of the vibrating plate; arranging a protective film on surface of the piezoelectric actuator for sealing the piezoelectric actuator along with the vibrating plate, thus preventing the piezoelectric actuator from corrosion; etching the substrate and the vibrating plate to form a groove on the substrate at a position corresponding to the piezoelectric actuator, and form a liquid feeding hole on the substrate and vibrating plate; forming a pressure chamber and a nozzle orifice on lower surface of the vibrating plate, allowing the pressure chamber to cover the position where the piezoelectric actuator is arranged in the vibrating plate, enabling communication of the pressure chamber with the nozzle orifice and the liquid feeding hole.

First claim

What is claimed is:

1. A method for manufacturing an ink jet head, comprising:
arranging a vibrating plate on a lower surface of a substrate;
arranging a piezoelectric actuator on a surface of the vibrating plate;
arranging a protective film on a surface of the piezoelectric actuator for sealing the piezoelectric actuator along with the vibrating plate, so as to prevent the piezoelectric actuator from corrosion;
etching the substrate and the vibrating plate, so as to form a groove on the substrate at a position corresponding to the piezoelectric actuator, and to form a liquid feeding hole on both the substrate and the vibrating plate; and
after the groove and the liquid feeding hole are formed, forming a pressure chamber and a nozzle orifice on a lower surface of the vibrating plate, allowing the pressure chamber to cover a position at which the piezoelectric actuator is arranged in the vibrating plate and enabling communication of the pressure chamber with the nozzle orifice and the liquid feeding hole.

2. The method for manufacturing an ink jet head according to claim 1 , wherein the arranging the piezoelectric actuator on the surface of the vibrating plate comprises:
arranging the piezoelectric actuator on the lower surface of the vibrating plate.

3. The method for manufacturing an ink jet head according to claim 2 , wherein the protective film is made of silicon nitride or silicon oxide material.

4. The method for manufacturing an ink jet head according to claim 2 , wherein the vibrating plate is made of silicon nitride.

5. The method for manufacturing an ink jet head according to claim 2 , wherein the forming the pressure chamber and the nozzle orifice on the lower surface of the vibrating plate, allowing the pressure chamber to cover the position at which the piezoelectric actuator is arranged in the vibrating plate and enabling communication of the pressure chamber with the liquid feeding hole and the liquid feed hole comprises:
forming a pressure chamber layer on the lower surface of the vibrating plate;
exposing via a first mask to cure side walls of the pressure chamber layer;
arranging a nozzle plate layer on a lower surface of the pressure chamber;
exposing via a second mask to cure the nozzle plate layer except for the position of the nozzle orifice; and
developing to form the pressure chamber and the nozzle orifice, allowing the pressure chamber to be communicated with the nozzle orifice and the liquid feeding hole.

6. The method for manufacturing an ink jet head according to claim 5 , wherein the pressure chamber layer and the nozzle plate layer are made of SU8 photoresist.

7. The method for manufacturing an ink jet head according to claim 2 , further comprising:
arranging a cover plate on an upper surface of the substrate after forming the pressure chamber and the nozzle orifice on the lower surface of the vibration plate, wherein the cover plate is provided with an opening which is communicated with the liquid feeding hole.

8. The method for manufacturing an ink jet head according to claim 1 , wherein the protective film is made of silicon nitride or silicon oxide material.

9. The method for manufacturing an ink jet head according to claim 1 , wherein the vibrating plate is made of silicon nitride.

10. The method for manufacturing an ink jet head according to claim 1 , wherein the forming the pressure chamber and the nozzle orifice on the lower surface of the vibrating plate, allowing the pressure chamber to cover the position at which the piezoelectric actuator is arranged in the vibrating plate and enabling communication of the pressure chamber with the liquid feeding hole and the liquid feed hole comprises:
forming a pressure chamber layer on the lower surface of the vibrating plate;
exposing via a first mask to cure side walls of the pressure chamber layer;
arranging a nozzle plate layer on a lower surface of the pressure chamber;
exposing via a second mask to cure the nozzle plate layer except for the position of the nozzle orifice; and
developing to form the pressure chamber and the nozzle orifice, allowing the pressure chamber to be communicated with the nozzle orifice and the liquid feeding hole.

11. The method for manufacturing an ink jet head according to claim 10 , wherein the pressure chamber layer and the nozzle plate layer are made of SU8 photoresist.

12. The method for manufacturing an ink jet head according to claim 1 , further comprising:
arranging a cover plate on an upper surface of the substrate after forming the pressure chamber and the nozzle orifice on the lower surface of the vibration plate, wherein the cover plate is provided with an opening which is communicated with the liquid feeding hole.

Assignees

• Univ Dalian Tech
• Zhuhai Seine Tech Co Ltd

Inventors

• Zou Helin
• Sun sha
• Zhou Yi

Classifications

• B41J2/14233 Primary

  of film type, deformed by bending and disposed on a diaphragm · CPC title

• Y10T29/42

  Piezoelectric device making · CPC title

• B41J2/1623

  bonding and adhesion · CPC title

• B41J2/1646

  thin film formation by sputtering · CPC title

• Y10T29/49083

  Heater type · CPC title