Hand member and hand

Patent metadata

Field	Value
Publication number	US-9776333-B2
Application number	US-201615337073-A
Country	US
Kind code	B2
Filing date	Oct 28, 2016
Priority date	Nov 24, 2015
Publication date	Oct 3, 2017
Grant date	Oct 3, 2017

Abstract

A hand member forms a hand of a robot arm for transferring a semiconductor wafer. The hand member is a U-shaped member on which the semiconductor wafer is placed. The hand member includes at least one fitting portion on which a frictional holding member for holding the semiconductor wafer is fitted sideways, on each of an inner edge and an outer edge.

First claim

What is claimed is:

1. A hand member forming a hand of a robot arm for transferring a semiconductor wafer, wherein
the hand member is a U-shaped member on which the semiconductor wafer is placed,
the hand member comprises at least one fitting portion on which a frictional holding member for holding the semiconductor wafer is fitted sideways with respect to the hand member, on each of an inner edge and an outer edge, and
the at least one fitting portion includes:
a first recess on an upper surface of the hand member;
a second recess on an lower surface of the hand member; and
a third recess on a side surface of the hand member so as to connect the first and second recesses.

2. The hand member according to claim 1 , wherein
at least three fitting portions are formed on the outer edge, and
at least three fitting portions are formed on the inner edge.

3. The hand member according to claim 1 , further comprising a chucking portion.

4. A hand of a robot arm for transferring a semiconductor wafer, comprising:
a U-shaped hand member on which the semiconductor wafer is placed; and
a plurality of frictional holding members configured to hold the semiconductor wafer,
wherein the hand member comprises fitting portions on which the plurality of frictional holding members are fitted sideways with respect to the hand member, on an inner edge and an outer edge,
each frictional holding member includes an upper wall portion, a lower wall portion, and a side wall portion connecting the upper wall portion and the lower wall portion,
the lower wall portion is inclined to approach the upper wall portion from the side wall portion to a distal end portion, and
a space surrounded by the upper wall portion, the lower wall portion, and the side wall portion is fitted on one of the fitting portions.

5. The hand according to claim 4 , wherein each frictional holding member includes a friction member configured to hold the semiconductor wafer, on an upper surface of the upper wall portion.

6. The hand according to claim 5 , wherein the friction member is formed on a portion of the upper surface of the upper wall portion, except for an edge of the upper wall portion.

7. The hand according to claim 4 , wherein each fitting portion is a portion thinner than a periphery thereof.

8. The hand according to claim 4 , wherein at least three fitting portions in total are formed.

9. The hand according to claim 4 , wherein
at least three fitting portions are formed on the outer edge of the hand member, and
at least three fitting portions are formed on the inner edge of the hand member.

10. The hand according to claim 4 , wherein the hand member is made of a difficult-to-cut material.

11. The hand according to claim 4 , further comprising a chucking portion formed in the hand member.

Assignees

• Hirata Spinning

Inventors

• Sakai Tetsuya
• Sakaue hideki

Classifications

• H10P72/7602

  the wafers being placed on a robot blade or gripped by a gripper for conveyance · CPC title

• H10P72/70 Primary

  for supporting or gripping · CPC title

• B65G49/061

  Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames (suction means as load-engaging elements attached to the lifting or lowering gear of cranes B66C1/02; suction cups for attaching purposes F16B47/00; suction cups on gripping heads B25J15/0616; suction cups in general B65G47/91; suction cups combined with cutting means on vertical conveyors C03B33/00 - C03B33/10; devices for turning sheets B65G49/067; suspending devices B65G49/066) · CPC title

• B65G2201/022

  Flat · CPC title

• B25J11/0095

  Manipulators transporting wafers · CPC title