Multilayer ceramic component having metal frames connected to external electrodes thereof and board having the same

Patent metadata

Field	Value
Publication number	US-9775244-B2
Application number	US-201514940946-A
Country	US
Kind code	B2
Filing date	Nov 13, 2015
Priority date	Jan 26, 2015
Publication date	Sep 26, 2017
Grant date	Sep 26, 2017

Abstract

A multilayer ceramic component includes a multilayer ceramic capacitor including a ceramic body including a plurality of first and second internal electrodes having respective dielectric layers interposed therebetween, and first and second external electrodes respectively including first and second connection portions, and first and second band portions extended from the first and second connection portions, and first and second metal frames respectively including first and second upper horizontal portions, first and second lower horizontal portions, and first and second inclined support portions diagonally connecting the first and second upper horizontal portions and the first and second lower horizontal portions, respectively.

First claim

What is claimed is:

1. A multilayer ceramic component comprising:
a multilayer ceramic capacitor including a ceramic body including a plurality of first and second internal electrodes having respective dielectric layers interposed between the plurality of first and second internal electrodes, to be alternately exposed to opposite surfaces of the ceramic body in a length direction, and first and second external electrodes respectively including first and second connection portions formed on the opposite surfaces of the ceramic body in the length direction, and connected to the first and second internal electrodes, respectively, and first and second band portions extended from the first and second connection portions, respectively, to cover portions of surfaces of the ceramic body in a width direction and a thickness direction; and
first and second metal frames respectively including first and second upper horizontal portions disposed on first and second surfaces of the first and second band portions in the thickness direction, respectively, first and second lower horizontal portions disposed to be spaced apart from the first and second upper horizontal portions, respectively, in a direction away from the first and second band portions, and first and second inclined support portions diagonally connecting the first and second upper horizontal portions and the first and second lower horizontal portions to each other, respectively,
wherein in the first and second metal frames, the first and second inclined support portions are inclined in the width direction of the ceramic body.

2. The multilayer ceramic component of claim 1 , further comprising first and second conductive adhesive layers disposed between the first and second surfaces of the first and second band portions in the thickness direction and the first and second upper horizontal portions, respectively.

3. The multilayer ceramic component of claim 2 , wherein the first and second conductive adhesive layers are formed of a solder or a conductive paste.

4. The multilayer ceramic component of claim 1 , wherein the first and second inclined support portions are formed in directions opposing each other.

5. The multilayer ceramic component of claim 1 , wherein the ceramic body includes a plurality of the dielectric layers stacked in parallel with a direction in which the first and second metal frames are disposed.

6. The multilayer ceramic component of claim 5 , wherein the ceramic body further includes cover layers disposed on a first or second internal electrode positioned at an uppermost side of the ceramic body and beneath a first or second internal electrode positioned at a lowermost side of the ceramic body, respectively.

7. The multilayer ceramic component of claim 1 , wherein the ceramic body includes a plurality of the dielectric layers stacked perpendicularly to a direction in which the first and second metal frames are disposed.

8. The multilayer ceramic component of claim 7 , wherein the ceramic body further includes cover layers disposed on outer surfaces of outermost first or second internal electrodes of the ceramic body, respectively.

9. A board having a multilayer ceramic component, comprising:
a circuit board on which first and second electrode pads are disposed;
a multilayer ceramic capacitor including:
a ceramic body having a plurality of first and second internal electrodes alternately exposed to opposite surfaces of the ceramic body in a length direction, and

first and second external electrodes respectively including first and second connection portions formed on the opposite surfaces of the ceramic body in the length direction and connected to the first and second internal electrodes, respectively, and first and second band portions extended from the first and second connection portions, respectively, to cover portions of surfaces of the ceramic body in a width direction and a thickness direction;
first and second metal frames respectively including first and second upper horizontal portions disposed on first and second surfaces of the first and second band portions in the thickness direction, respectively, first and second lower horizontal portions disposed to be spaced apart from the first and second upper horizontal portions, respectively, in a direction away from the first and second band portions, and first and second inclined support portions diagonally connecting the first and second upper horizontal portions and the first and second lower horizontal portions to each other, respectively; and
first and second solders electrically connecting the first and second metal frames to the first and second electrode pads, respectively,
wherein the first and second solders are spaced-apart from any of the first and second external electrodes of the multilayer ceramic capacitor, and contact with the first and second inclined support portions, respectively, and
wherein in the first and second metal frames, the first and second inclined support portions are inclined in the width direction of the ceramic body.

10. A multilayer ceramic component comprising:
a multilayer ceramic capacitor including a plurality of first and second internal electrodes having respective dielectric layers interposed between the plurality of first and second internal electrodes, to be alternately exposed to opposite surfaces of a ceramic body in a length direction, and first and second external electrodes respectively including first and second connection portions formed on the opposite surfaces of the ceramic body in the length direction, and connected to the first and second internal electrodes, respectively, and first and second extended portions extended from the first and second connection portions, respectively, to cover portions of a third surface of the ceramic body which is parallel to the length direction; and
first and second metal frames each having a Z-shape disposed, in a thickness direction of the ceramic body, on the first and second extended portions of the first and second external electrodes, respectively,
wherein a diagonal portion of the Z-shape of each of the first and second metal frames is inclined in a width direction of the ceramic body.

11. The board of claim 9 , further comprising first and second conductive adhesive layers disposed between the first and second surfaces of the first and second band portions in the thickness direction and the first and second upper horizontal portions, respectively.

12. The board of claim 11 , wherein the first and second conductive adhesive layers are formed of a solder or a conductive paste.

13. The board of claim 9 , wherein in the first and second metal frames, the first and second inclined support portions connect inner ends of the first and second upper horizontal portions in the length direction and outer ends of the first and second lower horizontal portions in the length direction to each other, respectively.

14. The board of claim 9 , wherein in the first and second metal frames, the first and second inclined support portions connect outer ends of the first and second upper horizontal portions in the length direction and inner ends of the first and second lower horizontal portions in the length direction to each other, respectively.

15. The board of claim 9 , wherein in the first and second metal frames, the first and second inclined support portions are inclined in the width direction of the ceramic body.

16. The board of claim 15 , wherein the first and second inclined support portions are formed in directions opposing each other.

17. The board of claim 9 , where

Assignees

• Samsung Electro Mech

Inventors

• Park Heung Kil
• Ahn Young Ghyu
• Park Sang Soo
• Lee Soon Ju
• Jun Kyoung Jin
• Song So Yeon

Classifications

• H01G2/06 Primary

  specially adapted for mounting on a printed-circuit support · CPC title

• H05K1/111 Primary

  Pads for surface mounting, e.g. lay-out · CPC title

• H01G4/228

  Terminals · CPC title

• H05K2201/10015

  Non-printed capacitor · CPC title

• H01G4/30

  Stacked capacitors (H01G4/33 takes precedence) · CPC title