Pin connector structure and method

Patent metadata

Field	Value
Publication number	US-9775242-B2
Application number	US-201615005589-A
Country	US
Kind code	B2
Filing date	Jan 25, 2016
Priority date	Jun 26, 2012
Publication date	Sep 26, 2017
Grant date	Sep 26, 2017

Abstract

Embodiments pin connections, electronic devices, and methods are shown that include pin configurations to reduce voids and pin tilting and other concerns during pin attach operations, such as attachment to a chip package pin grid array. Pin head are shown that include features such as convex surfaces, a number of legs, and channels in pin head surfaces.

First claim

What is claimed is:

1. A pin grid array, comprising;
a substrate, including a number of electrical connections;
a matrix material forming an interface with the electrical connections on the substrate; and
a number of pins including pin shafts, and having pin heads embedded in the matrix, wherein one or more pins includes a pin head having at least three legs extending at an angle with respect to the pin shaft between, but not including 0 and 90 degrees.

2. The pin grid array of claim 1 , wherein the pin head includes a textured top surface.

3. The pin grid array of claim 2 , wherein the textured top surface includes one or more channels.

4. The pin grid array of claim 1 , wherein the matrix material includes solder.

5. The pin grid array of claim 4 , wherein the solder includes a tin-antimony solder.

6. A method of forming a pin connection, comprising:
forming a pin, including a pin head having at least three legs extending at an angle with respect to the pin shaft between, but not including 0 and 90 degrees;
placing the pin head in contact with an electrical connection on a substrate surface; and
flowing solder around the pin head and in contact with the electrical connection to embed the pin head.

7. The method of claim 6 , further including channeling gas bubbles from beneath the pin head using gaps formed by the at least three legs.

8. The method of claim 6 , further including forming one or more channels in the top surface.

9. The method of claim 6 , wherein the pin grid connection is formed as part of a pin grid array.

Assignees

• Intel Corp

Inventors

• Chen Tsung-Yu
• Shia Rebecca

Classifications

• H05K2201/10787

  Leads having protrusions, e.g. for retention or insert stop · CPC title

• H05K3/103

  by bonding or embedding conductive wires or strips · CPC title

• H01R13/04

  Pins or blades for co-operation with sockets · CPC title

• H05K2201/1081

  Special cross-section of a lead; Different cross-sections of different leads; Matching cross-section, e.g. matched to a land · CPC title

• H05K2203/1178

  Means for venting or for letting gases escape · CPC title