Multiplexed heater array using AC drive for semiconductor processing

Patent metadata

Field	Value
Publication number	US-9775194-B2
Application number	US-201615070919-A
Country	US
Kind code	B2
Filing date	Mar 15, 2016
Priority date	Feb 28, 2012
Publication date	Sep 26, 2017
Grant date	Sep 26, 2017

Abstract

A heating plate for a substrate support assembly in a semiconductor plasma processing apparatus, comprises multiple independently controllable heater zones arranged in a scalable multiplexing layout, and electronics to independently control and power the heater zones. A substrate support assembly in which the heating plate is incorporated includes an electrostatic clamping electrode and a temperature controlled base plate. Methods for manufacturing the heating plate include bonding together ceramic or polymer sheets having heater zones, branch transmission lines, common transmission lines and vias. The heating plate is capable of being driven by AC current or direct current phase alternating power, which has an advantage of minimizing DC magnetic field effects above the substrate support assembly and reduce plasma non-uniformity caused by DC magnetic fields.

First claim

We claim:

1. A heating plate for a substrate support assembly used to support a semiconductor substrate in a semiconductor processing apparatus, the heating plate comprising:
a plurality of heater zones comprising at least first, second, third and fourth heater zones, the heater zones laterally distributed across the heating plate;
a first group of power lines comprising at least a first electrically conductive power line electrically connected to the first and second heater zones and a second electrically conductive power line electrically connected to the third and fourth heater zones;
a second group of power lines comprising at least a third electrically conductive power line electrically connected to the first and third heater zones and a fourth electrically conductive power line electrically connected to the second and fourth heater zones,
wherein the first and second groups of power lines are spatially arranged to minimize electromagnetic fields above the heating plate and reduce plasma non-uniformity caused by such electromagnetic fields; and
a plurality of diodes including at least first, second, third, fourth, fifth, sixth, seventh and eighth diodes;
wherein the first group of power lines are branch transmission lines comprising first, second, third and fourth electrically conductive branch transmission lines;
wherein the second group of power lines are common transmission lines comprising first and second electrically conductive common transmission lines;
wherein (i) the heater zones are in a first electrically insulating layer in a first plane, (ii) the common transmission lines are in a second electrically insulating layer in a second plane different from and parallel to the first plane, (iii) the plurality of diodes and the branch transmission lines are in a third electrically insulating layer in a third plane different from and parallel to the first plane, (iv) the second plane is located between the first plane and the third plane, (v) the first, second and third planes are separated from one another by the second electrically insulating layer and the third electrically insulating layer, (v) the common transmission lines are electrically connected to the heater zones by vias extending vertically in the second electrically insulating layer, and (vi) the branch transmission lines are electrically connected to the heater zones by vias extending vertically in the second and third electrically insulating layers; and
wherein the branch transmission lines include forward branch transmission lines and respective reverse branch transmission lines (i) in the third electrically insulating layer and (ii) connected to a same one of the plurality of heater zones.

2. The heating plate of claim 1 , wherein:
an anode of the first diode is connected to the first branch transmission line and a cathode of the first diode is connected to the first heater zone;
an anode of the second diode is connected to the first heater zone and a cathode of the second diode is connected to the third branch transmission line;
an anode of the third diode is connected to the first branch transmission line and a cathode of the third diode is connected to the second heater zone;
an anode of the fourth diode is connected to the second heater zone and a cathode of the fourth diode is connected to the third branch transmission line;
an anode of the fifth diode is connected to the second branch transmission line and a cathode of the fifth diode is connected to the third heater zone;
an anode of the sixth diode is connected to the third heater zone and a cathode of the sixth diode is connected to the fourth branch transmission line;
an anode of the seventh diode is connected to the second branch transmission line and a cathode of the seventh diode is connected to the fourth heater zone;
an anode of the eighth diode is connected to the fourth heater zone and a cathode of the eighth diode is connected to the fourth branch transmission line;
the first common transmission line is connected to both the first and third heater zones; and
the second common transmission line is connected to both the second and fourth heater zones.

3. The heating plate of claim 2 , wherein the heater zones are sized such that:
an area of each heater zone is 2 to 3 cm 2 , or
the heating plate includes 100 to 400 heater zones, or
the area of each heater zone is 1 to 15 cm 2 , or
the area of each heater zone is 16 to 100 cm 2 .

4. The heating plate of claim 1 , wherein: (a) the second electrically insulating layer comprises a polymer material, a ceramic material, or a combination thereof; or (b) a total area of the heater zones is from 50% to 90% or over 90% of an upper surface of the heating plate; or (c) the heater zones are arranged in a rectangular grid, hexagonal grid or polar arrays and the heater zones are separated from each other by gaps at least 1 millimeter in width and at most 10 millimeters in width.

5. The heating plate of claim 2 , wherein the heating plate is configured to rectify a power signal, such that the heating plate is capable of being driven by AC current.

6. The heating plate of claim 1 , wherein current on the first group of power lines is committed in an opposite direction of current committed on the second group of power lines.

7. The heating plate of claim 6 , wherein: (a) each heater zone is electrically connected to a diode which is electrically connected to a power line; or (b) a segment of one power line is above a segment of another power line in a vertical plane; or (c) a segment of one power line is parallel and adjacent to the segment of another power line; or (d) each heater zone is electrically coupled to three power lines; or (e) the first and second groups of power lines are each configured to conduct at least approximately one kilowatt of power to the heater zones; or (f) at least one power line is configured to be a high current carrying bus.

8. The heating plate of claim 6 , wherein: (a) the heater zones are arranged in a pattern selected from the group consisting of: a rectangular grid; a hexagonal grid; a polar array and concentric rings; or (b) each heater zone is separately addressable by a power source; or (c) a power line which is electrically connected to a heater zone on a first half of the heating plate is not electrically coupled to any heater zones not on the first half of the heating plate; or (d) the heater zones are coupled to more power lines than twice a square root of the number of heater zones.

9. A substrate support assembly comprising:
an electrostatic chuck (ESC) including an electrostatic clamping layer having at least one clamping electrode configured to electrostatically clamp a semiconductor substrate on the substrate support assembly;
the heating plate of claim 1 arranged below the electrostatic clamping layer;
a cooling plate attached to a lower side of the heating plate by a thermal barrier layer.

10. The substrate support assembly of claim 9 , wherein the first group of power lines are branch transmission lines and the second group of power lines are common transmission lines:
(a) the branch transmission lines are connected to leads electrically insulated from each other and extended through at least one branch transmission conduit in the cooling plate and the common transmission lines are connected to leads electrically insulated from each other and extended through at least one common transmission conduit in the cooling plate; or
(b) the branch transmission lines and the common transmission lines are connected to terminal connectors embedded in the cooling plate.

11. The substrate support assembly of claim 9 , further comprising a controller operable to

Assignees

• Lam Res Corp

Inventors

• Pease John
• Benjamin Neil

Classifications

• H10P72/0432 Primary

  mainly by conduction · CPC title

• H10P72/72 Primary

  using electrostatic chucks · CPC title

• H01L21/67103

  Electricity · mapped topic

• H05B1/0233 Primary

  for semiconductors manufacturing · CPC title

• H01L21/6831

  Electricity · mapped topic