Electric power converter

Patent metadata

Field	Value
Publication number	US-9773759-B2
Application number	US-201615353009-A
Country	US
Kind code	B2
Filing date	Nov 16, 2016
Priority date	Nov 17, 2015
Publication date	Sep 26, 2017
Grant date	Sep 26, 2017

Abstract

An electric power converter includes a semiconductor module, an electronic component, a plurality of cooling tubes, a case, a main pressure member for pressing a stacked semiconductor section in a stacking direction, and a sub-pressure member for pressing a stacked component section in the stacking direction. The stacked semiconductor section and the stacked component section are stacked in line. A pressing force of the main pressure member is greater than a pressure pressing force of the sub-pressure member. The main pressure member is disposed at an end portion of the stacked component section far from the stacked semiconductor section. A supporting portion that supports the stacked semiconductor section from the stacked component section side is disposed in the case so as to prevent the pressing force of the main pressure member from acting on the stacked component section.

First claim

What is claimed is:

1. An electric power converter comprising:
a semiconductor module with a built-in switching element;
an electronic component electrically connected to the semiconductor module;
a plurality of cooling tubes for cooling the semiconductor module and the electronic component by sandwiching them from both sides;
a case for accommodating the semiconductor module, the electronic component, and the cooling tubes;
a main pressure member for pressing a stacked semiconductor section formed by stacking the semiconductor module and the cooling tubes in a stacking direction; and
a sub-pressure member for pressing a stacked component section formed by stacking the electronic component and the cooling tubes in the stacking direction; wherein,
the stacked semiconductor section and the stacked component section are stacked in line;
a pressing force of the main pressure member is greater than a pressing force of the sub-pressure member;
the main pressure member is disposed at an end portion of the stacked semiconductor section far from the stacked component section; and
a supporting portion that supports the stacked semiconductor section from the stacked component section side is disposed in the case so as to prevent the pressing force of the main pressure member from acting on the stacked component section.

2. The electric power converter according to claim 1 , wherein,
the supporting portion is formed unitarily with the case.

3. The electric power converter according to claim 1 , wherein,
the supporting portion includes a load withstanding portion formed unitarily in the case and a supporting plate which is a component separated from the case; and
the supporting plate is interposed between the load withstanding portion and the stacked semiconductor section.

4. The electric power converter according to claim 1 , wherein,
the supporting portion is interposed between the electronic component and the cooling tubes.

5. The electric power converter according to claim 1 , wherein,
the supporting portion is interposed between a pair of the cooling tubes.

6. The electric power converter according to claim 1 , wherein,
the sub-pressure member is disposed on a surface of the cooling tube opposite to the electronic component side.

7. The electric power converter according to claim 1 , wherein,
the sub-pressure member having a thermal conductivity is disposed between the cooling tubes and the electronic component.

8. The electric power converter according to claim 1 , wherein,
the sub-pressure member is disposed at an end portion of the stacked component section far from the stacked semiconductor section.

9. The electric power converter according to claim 1 , wherein,
the sub-pressure member is disposed at an end portion of the stacked component section in the stacked semiconductor section side.

10. The electric power converter according to claim 1 , wherein,
the stacked component section is formed by stacking a plurality of types of the electronic components together with the cooling tubes; and
the cooling tube is interposed between the plurality of types of electronic components adjacent in the stacking direction.

Assignees

• Denso Corp

Inventors

• Hirasawa Naoki
• Tanabe Ryota
• Ichijo Hiromi
• Kawashima Takashi

Classifications

• F28F9/0075

  Supports for plates or plate assemblies · CPC title

• B60L58/26

  by cooling · CPC title

• H02M7/003

  Constructional details, e.g. physical layout, assembly, wiring or busbar connections · CPC title

• H02M1/00 Primary

  Details of apparatus for conversion · CPC title

• H05K7/20927

  Liquid coolant without phase change · CPC title