Solder joint flip chip interconnection having relief structure

Patent metadata

Field	Value
Publication number	US-9773685-B2
Application number	US-201213529794-A
Country	US
Kind code	B2
Filing date	Jun 21, 2012
Priority date	Nov 10, 2003
Publication date	Sep 26, 2017
Grant date	Sep 26, 2017

Abstract

A flip chip interconnect has a tapering interconnect structure, and the area of contact of the interconnect structure with the site on the substrate metallization is less than the area of contact of the interconnect structure with the die pad. A solder mask has an opening over the interconnect site, and the solder mask makes contact with the interconnect structure at the margin of the opening. The flip chip interconnect is provided with an underfill. During the underfill process, the contact or near proximity of the solder mask with the interconnect structure interferes with flow of the underfill material toward the substrate adjacent the site, resulting in formation of a void left unfilled by the underfill, adjacent the contact of the interconnect structure with the site on the substrate metallization. The void can help provide relief from strain induced by changes in temperature of the system.

First claim

What is claimed:

1. A semiconductor device, comprising:
a substrate including an interconnect site;
a semiconductor die including an interconnect pad, the semiconductor die disposed over the substrate; and
a bump material disposed between the interconnect pad and interconnect site in contact with the interconnect site at a contact surface, wherein a width of the contact surface of the interconnect site in a direction across the interconnect site is less than a length of the contact surface of the interconnect site in a direction along the interconnect site.

2. The semiconductor device of claim 1 , wherein a length of the bump material in the direction along the interconnect site is about 1.5 to 4 times a width of the bump material in the direction across the interconnect site.

3. The semiconductor device of claim 1 , further including an insulating layer formed over the substrate including an opening over the interconnect site.

4. The semiconductor device of claim 3 , wherein the bump material contacts the insulating layer while leaving a void between the insulating layer and interconnect site.

5. The semiconductor device of claim 1 , wherein the bump material includes a composite interconnect structure comprising a non-collapsible portion and collapsible portion.

6. The semiconductor device of claim 5 , wherein the non-collapsible portion includes lead-tin alloy, copper, gold, or nickel.

7. A semiconductor device, comprising:
a substrate including an interconnect site;
a semiconductor die including an interconnect pad; and
a bump material formed between the interconnect pad and interconnect site in contact with the interconnect site at a contact surface, wherein a width of the bump material at the contact surface in a direction across the interconnect site is less than a length of the bump material at the contact surface in a direction along the interconnect site.

8. The semiconductor device of claim 7 , wherein the length of the bump material in the direction along the interconnect site is about 1.5 to 4 times the width of the bump material in the direction across the interconnect site.

9. The semiconductor device of claim 7 , further including an insulating layer formed over the substrate including an opening over the interconnect site.

10. The semiconductor device of claim 9 , wherein the bump material contacts the insulating layer while leaving a void between the insulating layer and interconnect site.

11. The semiconductor device of claim 7 , wherein the bump material includes a composite interconnect structure comprising a non-collapsible portion and collapsible portion.

12. The semiconductor device of claim 11 , wherein the non-collapsible portion includes lead-tin alloy, copper, gold, or nickel.

13. A semiconductor device, comprising:
a substrate including an interconnect site; and
a bump formed over the interconnect site, wherein a width of the bump at the interconnect site in a direction across the interconnect site is less than a length of the bump at the interconnect site in a direction along the interconnect site.

14. The semiconductor device of claim 13 , wherein the length of the bump in the direction along the interconnect site is about 1.5 to 4 times the width of the bump in the direction across the interconnect site.

15. The semiconductor device of claim 13 , further including an insulating layer formed over the substrate including an opening over the interconnect site.

16. The semiconductor device of claim 15 , wherein the bump contacts the insulating layer while leaving a void between the insulating layer and interconnect site.

17. A semiconductor device, comprising:
a substrate including an interconnect site; and
a bump formed over the interconnect site, wherein a width of the bump in a direction across the interconnect site is less than a length of the bump in a direction along the interconnect site and wherein the bump includes a composite interconnect structure comprising a non-collapsible portion and collapsible portion.

18. The semiconductor device of claim 17 , wherein the non-collapsible portion includes lead-tin alloy, copper, gold, or nickel.

19. The semiconductor device of claim 17 , wherein the collapsible portion includes eutectic solder.

20. A semiconductor device, comprising:
a substrate including an interconnect site; and
a bump formed over the interconnect site, wherein an interface surface between the bump and interconnect site includes a width in a direction across the interface surface less than a length in a direction along the interface surface.

21. The semiconductor device of claim 20 , further including an insulating layer formed over the substrate including an opening over the interconnect site, wherein the bump contacts the insulating layer and leaves a void between the insulating layer and interconnect site.

22. The semiconductor device of claim 20 , wherein the length of the interface surface in the direction along the interconnect site is about 1.5 to 4 times the width of the interface surface in the direction across the interconnect site.

23. The semiconductor device of claim 20 , wherein the bump includes a composite interconnect structure comprising a non-collapsible portion and collapsible portion.

24. The semiconductor device of claim 23 , wherein the collapsible portion includes eutectic solder.

Assignees

• Pendse Rajendra D
• Kim Kyungoe
• Kang Taewoo
• Stats Chippac Pte Ltd

Inventors

• Pendse Rajendra D
• Kim Kyungoe
• Kang Taewoo

Classifications

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/9415

  relative to the surface, e.g. recessed, protruding · CPC title

• H10W72/07236

  Soldering or alloying · CPC title

• H10W72/07234

  Using a reflow oven · CPC title

• H10W72/01255

  by using masks · CPC title