Chip parts

Patent metadata

Field	Value
Publication number	US-9773588-B2
Application number	US-201514713684-A
Country	US
Kind code	B2
Filing date	May 15, 2015
Priority date	May 16, 2014
Publication date	Sep 26, 2017
Grant date	Sep 26, 2017

Abstract

A chip part is provided that includes a substrate 2 in which an element region 5 and an electrode region 16 are set, an insulating film (a first insulating film 9 and a second insulating film 3 ) which is formed on the substrate 2 and which selectively includes an internal concave/convex structure 18 in the electrode region 16 on a surface, a first connection electrode 3 and a second connection electrode 4 which include, at a bottom portion, an anchor portion 24 entering the concave portion 17 of the internal concave/convex structure 18 and which include an external concave/convex structure 6, 7 on a surface on the opposite side and a circuit element which is disposed in the element region 5 and which is electrically connected to the first connection electrode 3 and the second connection electrode 4.

First claim

What is claimed is:

1. A chip part comprising:
a substrate in which an element region and an electrode region are set;
an insulating film which is formed on the substrate and which selectively includes an internal concave/convex structure in the electrode region on a surface;
an electrode which includes, at a bottom portion, an anchor portion that enters a concave portion of the internal concave/convex structure and which includes an external concave/convex structure in a surface on an opposite side; and
a circuit element which is disposed in the element region and which is electrically connected to the electrode.

2. The chip part according to claim 1 ,
wherein the external concave/convex structure includes a concave portion in a position opposite the concave portion of the internal concave/convex structure.

3. The chip part according to claim 1 ,
wherein an amount of recess of the concave portion in the external concave/convex structure is less than an amount of recess of the concave portion in the internal concave/convex structure.

4. The chip part according to claim 1 , further comprising:
a wiring film in contact with the circuit element,
wherein the anchor portion is formed with an extending portion of the wiring film.

5. The chip part according to claim 4 ,
wherein the anchor portion includes an intermediate concave/convex structure in a surface thereof.

6. The chip part according to claim 5 ,
wherein the anchor portion integrally includes an embedding portion which fills the convex portion in the internal concave/convex structure and a surface layer portion which is disposed along a surface of the insulating film to cover the internal concave/convex structure, and
the intermediate concave/convex structure is formed in a surface of the surface layer portion.

7. The chip part according to claim 5 ,
wherein the anchor portion is formed along a recess and a projection in the internal concave/convex structure.

8. The chip part according to claim 4 ,
wherein the electrode includes an external connection portion which is formed on the anchor portion and which is formed of a material different from the anchor portion.

9. The chip part according to claim 8 ,
wherein the anchor portion is formed of an Al—Cu alloy, and the external connection portion is formed with a Ni—Pd—Au laminated structure.

10. The chip part according to claim 4 ,
wherein the insulating film includes a first insulating film and a second insulating film,
the chip part further includes:
a first wiring film disposed between the first insulating film and the second insulating film; and
a second wiring film formed on the second insulating film,
the circuit element is a resistor element which includes a resistor body formed with the first wiring film and
the wiring film forming the anchor portion includes at least a pair of resistor wiring films which are formed with the second wiring film and which are connected to the resistor body via the second insulating film.

11. The chip part according to claim 10 ,
wherein the concave portion in the internal concave/convex structure penetrates the second insulating film and is formed part-way along a direction of thickness of the first insulating film.

12. The chip part according to claim 4 ,
wherein the insulating film includes a first insulating film and a second insulating film,
the chip part further includes:
a first wiring film disposed between the first insulating film and the second insulating film; and
a second wiring film formed on the second insulating film,
the circuit element is a capacitor which includes a lower electrode formed with the first wiring film, a dielectric film formed with the second insulating film, and an upper electrode formed with the second wiring film and
the wiring film forming the anchor portion includes a lower wiring film which is formed with the second wiring film and which is connected to the lower electrode via the second insulating film.

13. The chip part according to claim 12 ,
wherein the concave portion in the internal concave/convex structure entered by the lower wiring film penetrates the second insulating film and is formed part-way along a direction of thickness of the first insulating film.

14. The chip part according to claim 12 ,
wherein the insulating film further includes a third insulating film formed on the second wiring film,
the chip part further includes a third wiring film formed on the third insulating film and
the wiring film forming the anchor portion includes an upper wiring film which is formed with the third wiring film and which is connected to the upper electrode via the third insulating film.

15. The chip part according to claim 14 ,
wherein the concave portion in the internal concave/convex structure entered by the upper wiring film penetrates the third insulating film and the second insulating film and is formed part-way along a direction of thickness of the first insulating film.

16. The chip part according to claim 4 , further comprising:
a pn bonding portion formed on the substrate; and
a first wiring film which is formed on the insulating film and which includes a p-side film and an n-side film connected to the pn bonding portion via the insulating film,
the circuit element is a diode which includes the pn bonding portion and
the wiring film forming the anchor portion includes at least a pair of films formed with the p-side film and the n-side film.

17. The chip part according to claim 1 ,
wherein concave portions in the external concave/convex structure are regularly arrayed in plan view.

18. The chip part according to claim 17 ,
wherein the concave portions in the external concave/convex structure are arrayed, in plan view, in a matrix.

19. The chip part according to claim 17 ,
wherein the concave portions in the external concave/convex structure are arrayed, in plan view, in a staggered shape.

20. The chip part according to claim 1 ,
wherein the external concave/convex structure is formed substantially over an entire region of a surface of the electrode.

Assignees

• Rohm Co Ltd

Inventors

• Shimoichi Takuma
• Kondo Yasuhiro
• Watanabe Keishi
• Torii Takamichi
• Matsuura Katsuya

Classifications

• H10W20/498

  Resistive arrangements or effects of, or between, wiring layers · CPC title

• H01G4/30 Primary

  Stacked capacitors (H01G4/33 takes precedence) · CPC title

• H01F27/292

  Surface mounted devices · CPC title

• H01F27/2804

  Printed windings · CPC title

• H01C1/01 Primary

  Mounting; Supporting · CPC title