Conductive composition and conductive molded body

Patent metadata

Field	Value
Publication number	US-9773582-B2
Application number	US-201314430406-A
Country	US
Kind code	B2
Filing date	Jan 11, 2013
Priority date	Sep 27, 2012
Publication date	Sep 26, 2017
Grant date	Sep 26, 2017

Abstract

The present invention relates to a conductive composition containing a conductive metal powder and an epoxy resin component in which the conductive metal powder contains a metal flake and the epoxy resin component contains a polyfunctional epoxy resin having three or more epoxy groups.

First claim

The invention claimed is:

1. A conductive composition comprising a conductive metal powder and an epoxy resin component,
wherein the conductive metal powder comprises a metal flake and the epoxy resin component comprises a polyfunctional epoxy resin having three or more epoxy groups, and
when the average particle diameter of the metal flake is taken as A (μm) and the BET specific surface area of the metal flake is taken as B (m 2 /g), the value of A×B 2 is from 7 to 18.

2. The conductive composition according to claim 1 , wherein the metal flake has an average particle diameter of 0.7 to 10 μm, a BET specific surface area of 1 to 5 m 2 /g, and a tap density of 0.5 to 4.5 g/cm 3 .

3. The conductive composition according to claim 1 , wherein the metal flake has an average particle diameter of 0.5 to 3.5 μm, a BET specific surface area of 1 to 4.5 m 2 /g, and a tap density of 1.2 to 3.5 g/cm 3 .

4. The conductive composition according to claim 1 , wherein the metal flake is a flaked product of an aggregated powder of a spherical metal fine particle.

5. The conductive composition according to claim 1 , wherein the conductive metal powder further comprises a spherical metal nanoparticle.

6. The conductive composition according to claim 5 , wherein the ratio of the metal flake to the spherical metal nanoparticle is as follows: the former/the latter (weight ratio)=99/1 to 50/50.

7. The conductive composition according to claim 1 , wherein the polyfunctional epoxy resin is an aromatic epoxy resin.

8. The conductive composition according to claim 1 , wherein the polyfunctional epoxy resin has an epoxy equivalent of 350 g/eq or less.

9. The conductive composition according to claim 1 , wherein the polyfunctional epoxy resin is a glycidyl ether type aromatic epoxy resin having an epoxy equivalent of 140 to 320 g/eq.

10. The conductive composition according to claim 1 , wherein the epoxy resin component comprises a curing agent composed of an aromatic amine-based curing agent.

11. The conductive composition according to any claim 1 , wherein the ratio of the conductive metal powder to the epoxy resin component is as follows: the former/the latter (weight ratio)=99/1 to 50/50.

12. The conductive composition according to claim 1 , which is a conductive adhesive.

13. The conductive composition according to claim 1 , which is a conductive adhesive for bonding a lead frame with a semiconductor chip.

14. A conductive molded body comprising at least a conductive region formed of the conductive composition described in claim 1 .

15. The conductive molded body according to claim 14 , which is a molded body comprising a conjugated base material composed of two base materials and a conductive adhesive that intervenes between the base materials and bonds the two base materials each other,
wherein the conductive adhesive is formed of a conductive composition comprising a conductive metal powder and an epoxy resin component, wherein the conductive metal powder comprises a metal flake, and the epoxy resin component comprises a polyfunctional epoxy resin having three or more epoxy groups, and
when the average particle diameter of the metal flake is taken as A (μm) and the BET specific surface area of the metal flake is taken as B (m 2 /g), the value of A×B 2 is from 7 to 18.

Assignees

• Mitsuboshi Belting Ltd

Inventors

• Iseda Taisuke
• Iwamoto Masahiro

Classifications

• C08K2201/002

  Physical properties · CPC title

• Y10T428/31515

  As intermediate layer · CPC title

• H01B1/22 Primary

  the conductive material comprising metals or alloys · CPC title

• C08K3/08

  Metals · CPC title

• C09J9/02

  Electrically-conducting adhesives · CPC title