Creating antennas connected to printed chips by post processing with a laser or other cutting device

US9773203B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9773203-B2
Application numberUS-201414583257-A
CountryUS
Kind codeB2
Filing dateDec 26, 2014
Priority dateDec 26, 2014
Publication dateSep 26, 2017
Grant dateSep 26, 2017

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An RFID antenna structure for use with an RFID device is disclosed. A printed electronic circuit (PEC) is assembled onto an area of a conductor that is initially substantially flat, with minimal apertures cut into it. The substantially flat conductor makes the printing of the functional chip/circuit easier. Then, the conductor is cut post process with a laser or other cutting tool to create the interconnection. In another embodiment, the conductors of the PEC bridge the position where an aperture should be to create part of an RFID antenna. Further, the conductive layer and the PEC are then cut post process to create an antenna for the RFID device.

First claim

Opening claim text (preview).

What is claimed is: 1. A radio-frequency identification (RFID) antenna structure for use with a RFID device, comprising: a conductive layer; an aperture formed in the conductive layer, approximately bisecting the conductive layer into halves; a printed electronic circuit (PEC) comprising first and second connection points assembled onto the conductive layer, such that the first and second connection points are each positioned on opposite sides of the aperture; and wherein the conductive layer is cut by a laser to create an antenna for the RFID device and focusing the laser is dependent on depth, such that energy at a height above a surface where a PEC conductor is placed is relatively diffuse compared to concentrated energy at surface of the conductive layer. 2. The RFID antenna structure of claim 1 , wherein the conductive layer is aluminum foil. 3. The RFID antenna structure of claim 2 , wherein the conductive layer is substantially flat. 4. The RFID antenna structure of claim 3 , wherein the aperture is a narrow aperture formed using a laser. 5. The RFID antenna structure of claim 4 , wherein the PEC is designed to function as an ultra-high frequency (UHF) RFID chip. 6. The RFID antenna structure of claim 5 , wherein the conductive layer is cut post process to create an antenna for the RFID device. 7. A radio-frequency identification (RFID) antenna structure for use with a RFID device, comprising: a conductive layer; a printed electronic circuit (PEC) comprising first and second connection points and a plurality of conductors assembled onto the conductive layer, such that the plurality of conductors bridge a position to create part of a RFID antenna; and wherein the conductive layer is cut to create an antenna for the RFID device and the plurality of conductors are transparent at a frequency of operation of a laser, such that the conductive layer is cut without damaging the plurality of conductors. 8. The RFID antenna structure of claim 7 , wherein the conductive layer is aluminum foil. 9. The RFID antenna structure of claim 8 , wherein the conductive layer is substantially flat. 10. The RFID antenna structure of claim 9 , wherein the conductive layer is cut using a laser. 11. The RFID antenna structure of claim 10 , wherein the conductive layer is cut post process to create an antenna for the RFID device. 12. The RFID antenna of claim 11 , wherein cutting of antennas is done through the PEC. 13. The RFID antenna of claim 7 , wherein focusing the laser is dependent on depth, such that energy at a height above a surface where PEC conductor is placed is relatively diffuse compared to concentrated energy at surface of the aluminum foil. 14. The RFID antenna structure of claim 13 , wherein the PEC is designed to function as an ultra-high frequency (UHF) RFID chip. 15. A radio-frequency identification (RFID) antenna structure for use with a RFID device, comprising: a substantially flat conductive layer comprising aluminum foil; a printed electronic circuit (PEC) comprising first and second connection points and a plurality of conductors assembled onto the conductive layer, such that the plurality of conductors bridge a position to create part of an RFID antenna; and wherein the conductive layer is cut post process to create an antenna for the RFID device; and wherein cutting of antennas is done through the PEC, and wherein the plurality of conductors in the PEC are transparent at a frequency of a laser, such that the aluminum foil is cut without damaging the plurality of conductors. 16. The RFID antenna structure of claim 15 , wherein the conductive layer is cut using a laser. 17. The RFID antenna of claim 16 , wherein focusing the laser is dependent on depth, such that energy at a height above a surface where PEC conductor is placed is relatively diffuse compared to concentrated energy at surface of the aluminum foil. 18. The RFID antenna structure of claim 17 , wherein the PEC is designed to function as one of a high frequency (HF), low frequency (LF), or ultra-high frequency (UHF) RFID chip.

Assignees

Inventors

Classifications

  • Planar dipole (H01Q9/065 takes precedence; patch antenna H01Q9/0407) · CPC title

  • H01Q1/2225Primary

    used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal · CPC title

  • the record carrier being manufactured in a continuous process, e.g. using endless rolls · CPC title

  • the antenna being of the HF type, such as a dipole · CPC title

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Frequently asked questions

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What does patent US9773203B2 cover?
An RFID antenna structure for use with an RFID device is disclosed. A printed electronic circuit (PEC) is assembled onto an area of a conductor that is initially substantially flat, with minimal apertures cut into it. The substantially flat conductor makes the printing of the functional chip/circuit easier. Then, the conductor is cut post process with a laser or other cutting tool to create the…
Who is the assignee on this patent?
Avery Dennison Retail Information Services Llc
What technology area does this patent fall under?
Primary CPC classification H01Q1/2225. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Sep 26 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).