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Heat dissipation simulator
US9773084B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9773084-B2 |
| Application number | US-201414314462-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 25, 2014 |
| Priority date | Jun 26, 2013 |
| Publication date | Sep 26, 2017 |
| Grant date | Sep 26, 2017 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
A heat dissipation simulator of a component on a printed circuit board (PCB) includes a simulation board and a simulated heat source. The simulation board includes an iron layer and a plastic layer. The simulated heat source includes a simulation chip, a thermal, and a heat sink. The simulation chip, the thermal piece, and the heat sink are mounted on the simulation board in that order. The heat dissipation simulator replaces a sample of the PCB with the component for simulating working states of the component on the PCB.
First claim
Opening claim text (preview).
What is claimed is: 1. A heat dissipation simulator configured to simulate a heat dissipation of a component on a printed circuit board, the heat dissipation simulator comprising: a simulation board comprising an iron layer; and a plastic layer; and a simulated heat source positioned and mounted on the simulation board, the simulated heat source comprising: a simulation chip configured to simulate the component, wherein a magnet is buried in a bottom of the simulation chip, wherein the simulation chip is mounted on the simulation board, base on the magnet attracts the iron layer of the simulation board separated by plastic layer; a thermal piece mounted on the simulation chip and configured to produce heat to simulate the heat of the component; and a heat sink mounted on the thermal piece and configured to dissipate the heat. 2. The heat dissipation simulator of claim 1 , wherein a plurality of location holes, for fastening the simulation board, is defined on the simulation board. 3. The heat dissipation simulator of claim 1 , wherein the thermal piece is a resistor.
Assignees
Inventors
Classifications
Design verification, e.g. using simulation, simulation program with integrated circuit emphasis [SPICE], direct methods or relaxation methods · CPC title
Thermal analysis or thermal optimisation · CPC title
- G06F30/39Primary
Circuit design at the physical level (physical level design for reconfigurable circuits G06F30/347) · CPC title
- G06F17/5068Primary
Physics · mapped topic
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Frequently asked questions
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- What does patent US9773084B2 cover?
- A heat dissipation simulator of a component on a printed circuit board (PCB) includes a simulation board and a simulated heat source. The simulation board includes an iron layer and a plastic layer. The simulated heat source includes a simulation chip, a thermal, and a heat sink. The simulation chip, the thermal piece, and the heat sink are mounted on the simulation board in that order. The hea…
- Who is the assignee on this patent?
- Hong Fu Jin Prec Ind (Shenzhen) Co Ltd, Hon Hai Prec Ind Co Ltd, Scienbizip Consulting(Shenzhen)Co Ltd
- What technology area does this patent fall under?
- Primary CPC classification G06F30/39. Mapped technology areas include Physics.
- When was this patent published?
- Publication date Tue Sep 26 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).