Passivation Layer and Method of Making a Passivation Layer
US-2015235917-A1 · Aug 20, 2015 · US
US9771654B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9771654-B2 |
| Application number | US-201214346890-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 24, 2012 |
| Priority date | Sep 26, 2011 |
| Publication date | Sep 26, 2017 |
| Grant date | Sep 26, 2017 |
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A multilayer structure including a substrate and a first stack of a layer of SiO 2 and a layer of material of the SiO x N y H z type positioned between the substrate and the layer of SiO 2 , in which the layer of SiO 2 and the layer of material of the SiO x N y H z type have thicknesses (e B , e A ) such that the thickness of the layer of SiO 2 is less than or equal to 60 nm, the thickness of the layer of material of the SiO x N y H z type (e B ) is more than twice the thickness (e A ) of the layer of SiO 2 , and the sum of the thicknesses of the layer of SiO 2 and of the layer of material of the SiO x N y H z type is between 100 nm and 500 nm, and in which z is strictly less than the ratio (x+y)/5, and advantageously z is strictly less than the ratio (x+y)/10.
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The invention claimed is: 1. A multilayer structure, comprising a substrate, and a first stack of a SiO 2 layer and a SiO x N y H z layer positioned between the substrate and SiO 2 layer, wherein the SiO 2 layer has a thickness of less than or equal to 60 nm, the SiO x N y H z layer has a thickness of more than twice the thickness of the SiO 2 layer, the thicknesses of the SiO 2 layer and the SiO x N y H z layer total from 100 nm to 500 nm, and z is strictly positive and is strictly less than a ratio (x+y)/5, wherein the value of x decreases from an interface between the SiO x N y H z layer and the SiO 2 layer towards the substrate, and the value of y increases from the interface between the SiO x N y H z layer and the SiO 2 layer towards the substrate, wherein x varies from 2 to 0 and y varies from 0 to 1, and wherein the SiO 2 layer and the SiO x N y H z layer are made of amorphous materials. 2. The multilayer structure according to claim 1 , wherein z is strictly less than a ratio (x+y)/10. 3. The multilayer structure according to claim 1 , wherein a material of the SiO 2 layer has a Young's modulus of greater than or equal to 30 GPa, and a material of the SiO x N y H z layer has a Young's modulus of less than or equal to 20 GPa. 4. The multilayer structure according to claim 1 , wherein the stack has a refractive index of greater than 1.5. 5. The multilayer structure according to claim 3 , wherein the stack is obtained by conversion of a liquid containing a perhydropolysilazane, where the stack has a transmittance corresponding to a Si—H bond of greater than 80% of a transmittance of the Si—H bond of the liquid containing the perhydropolysilazane before conversion, measured by infrared reflectance spectrometry in the case of a substrate made of polymer material. 6. The multilayer structure according to claim 5 , wherein the stack has a transmittance corresponding to the Si—H bond of greater than 90% of the transmittance of the Si—H bond of the inorganic precursor of the perhydropolysilazane before conversion, measured by infrared reflectance spectrometry in the case of a substrate made of polymer material. 7. The multilayer structure according to claim 3 , wherein the stack is obtained by conversion of an inorganic precursor of a perhydropolysilazane, where the stack has an absorbance corresponding to a Si—H bond of less than 20% of an absorbance of the Si—H bond of the inorganic precursor of the perhydropolysilazane before conversion, measured by infrared transmission spectrometry in the case of a silicon substrate. 8. The multilayer structure according to claim 7 , wherein the stack has an absorbance corresponding to the Si—H bond of less than 10% of the absorbance of the Si—H bond of the liquid containing the perhydropolysilazane before conversion, measured by infrared transmission spectrometry in the case of a silicon substrate. 9. The multilayer structure according to claim 1 , wherein the substrate is made of a polymer material. 10. The multilayer structure according to claim 1 , further comprising a layer of polymer material on the SiO 2 layer of the first stack on a face opposite the one in contact with the SiO x N y H z layer. 11. The multilayer structure according to claim 1 , comprising n stacks, wherein n is a positive integer greater than or equal to 1, each stack comprises a (SiO 2 ) i layer and a SiO xi N yi H zi layer, i is a positive integer of between 1 and n, the (SiO 2 ) i layers of each stack have a thickness of less than or equal to 60 nm, the SiO xi N yi H zi layers of each stack have a thickness of more than twice the thickness of the (SiO 2 ) i layers, the thicknesses of the (SiO 2 ) i layers and the SiO xi N yi H zi layers total from 100 nm to 500 nm, and z i is strictly less than a ratio (x i +y i )/5. 12. The multilayer structure according to claim 11 , wherein z i is strictly less than a ratio (x i +y i )/10, where x i , y i and z i may or may not be identical for different values of i. 13. The multilayer structure according to claim 12 , comprising at least one layer made of polymer material positioned between the (SiO 2 ) i layer of a stack and the SiO xi N yi H zi layer of the stack which follows directly. 14. The multilayer structure according to claim 13 , comprising n−1 layers made of polymer material, where each of the layers made of polymer material is positioned between two stacks. 15. The multilayer structure according to claim 4 , wherein the stack is obtained by conversion of a liquid containing a perhydropolysilazane, where the stack has a transmittance corresponding to a Si—H bond of greater than 80% of a transmittance of the Si—H bond of the liquid containing the perhydropolysilazane before conversion, measured by infrared reflectance spectrometry in the case of a substrate made of polymer material. 16. The multilayer structure according to claim 4 , wherein the stack is obtained by conversion of a liquid containing a perhydropolysilazane, where the stack has an absorbance corresponding to the Si—H bond of less than 20% of an absorbance of the Si—H bond of the liquid containing the perhydropolysilazane before conversion, measured by infrared transmission spectrometry in the case of a silicon substrate. 17. The multilayer structure according to claim 13 , wherein the substrate is a polymer material of a polyester selected from the group consisting of polyethylene terephthalate and polyethylene naphthalate. 18. The multilayer structure according to claim 13 , wherein the substrate is a polymer material of a polyolefin selected from the group consisting of polyethylene and polypropylene. 19. The multilayer structure according to claim 13 , wherein the substrate is a polymer material of a polyamide. 20. The multilayer structure according to claim 1 , wherein the SiO 2 layer and the SiO x N y H z layer are in close contact along their entire surfaces and wherein each of the layers contains only one material. 21. The multilayer structure according to claim 1 , wherein the thicknesses of the SiO 2 layer and the SiO x N y H z layer total from 100 nm to 250 nm. 22. A method for producing a multilayer structure according to claim 1 , the method comprising: depositing a liquid containing a perhydropolysilazane on a substrate; and converting by irradiation by VUV radiation with a wavelength of less than or equal to 220 nm and an ultraviolet radiation with a wavelength of greater than or equal to 220 nm in an atmosphere with an oxygen content of greater than 10 ppm and less than 500 ppm and a water content of less than or equal to 1,000 ppm, so as to form a stack of a SiO 2 layer and a SiO x N y H z layer. 23. The method according to claim 22 , further comprising further depositing a layer of polymer material after the converting. 24. The method according to claim 22 , further comprising repeating the depositing and converting. 25. A method for producing a multilayer structure according to claim 1 , the method comprising: depositing a liquid containing perhydropolysilazane on a substrate; converting by irradiation by ultraviolet radiation with a wavelength of greater than 220 nm in an atmosphere having an oxygen content and a water content of less than 10 ppm to obtain a converted layer; depositing a liquid containing the perhydropolysilazane on the converted layer; and converting by irradiation by VUV radiation with a wav
the compound being a silazane · CPC title
Radiation by light, e.g. photolysis or pyrolysis · CPC title
No layer or component greater than 5 mils thick · CPC title
Thickness [relative or absolute] · CPC title
Deposition of multilayers of inorganic material · CPC title
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