Sealant composition for electronic device

Patent metadata

Field	Value
Publication number	US-9771500-B2
Application number	US-201615014231-A
Country	US
Kind code	B2
Filing date	Feb 3, 2016
Priority date	Sep 9, 2011
Publication date	Sep 26, 2017
Grant date	Sep 26, 2017

Abstract

The present invention provides a sealant composition for electronic device, in which the curing does not proceed when heated, which does not cause the problem of use in the mounting process of electronic device. The present invention relates to a sealant composition for electronic device comprising (a) a compound having two or more (meth)acryloyl groups and (c) a nitroxide compound and/or a thiocarbonylthio compound.

First claim

The invention claimed is:

1. A sealant composition for an electronic device comprising:
(a) a compound having two or more (meth)acryloyl groups selected from the group consisting of:
hexanediol dimethacrylate, hydroxyacryloyloxypropyl methacrylate, hexanediol diacrylate, urethane acrylate, epoxy acrylate, bisphenol A-type epoxy acrylate, modified epoxy acrylate, fatty acid-modified epoxy acrylate, amine-modified bisphenol A-type epoxy acrylate, allyl methacrylate, ethylene glycol dimethacrylate, diethylene glycol dimethacrylate, ethoxylated bisphenol A dimethacrylate, tricyclodecane dimethanol dimethacrylate, glycerine dimethacrylate, polypropylene glycol diacrylate, propoxylated ethoxylated bisphenol A diacrylate, 9,9-bis(4-(2-acryloyloxyethoxy)phenyl)fluorene, tricyclodecane diacrylate, dipropylene glycol diacrylate, polypropylene glycol diacrylate, propoxylated neopentyl glycol diacrylate, tricyclodecane dimethanol diacrylate, 1,12-dodecanediol dimethacrylate, trimethylolpropane trimethacrylate, dipentaerythtol polyacrylate, dipentaerythtol hexaacrylate, trimethylolpropane triacrylate, trimethylolpropane ethoxytriacrylate, polyether triacrylate, glycerine propoxy triacrylate, pentaerythritol tetraacrylate, pentaerythritolethoxy tetraacrylate, ditrimethylol propane tetraacrylate, monopentaerythritol acrylate, dipentaerythritol acrylate, tripentaerythritol acrylate, polypentaerythritol acrylate, and pentaerythritol triacrylate,
(b) 1 -20% by weight of a bismaleimide,

and
(c) a nitroxide compound and/or a thiocarbonylthio compound.

2. The composition according to claim 1 , further comprising a radical initiator.

3. The composition according to claim 1 , which is used as an underfill sealant.

4. The composition according to claim 1 , which is used in flip chip mounting.

5. An electronic device comprising a cured product of the composition according to claim 1 .

6. An electronic appliance comprising the electronic device according to claim 5 .

7. A nonconductive curable sealant composition for an electronic device comprising:
(a) a compound having two or more (meth)acryloyl groups, selected from the group consisting of:
hexanediol dimethacrylate, hydroxyacryloyloxypropyl methacrylate, hexanediol diacrylate, urethane acrylate, epoxy acrylate, bisphenol A-type epoxy acrylate, modified epoxy acrylate, fatty acid-modified epoxy acrylate, amine-modified bisphenol A-type epoxy acrylate, allyl methacrylate, ethylene glycol dimethacrylate, diethylene glycol dimethacrylate, ethoxylated bisphenol A dimethacrylate, tricyclodecane dimethanol dimethacrylate, glycerine dimethacrylate, polypropylene glycol diacrylate, propoxylated ethoxylated bisphenol A diacrylate, 9,9-bis(4-(2-acryloyloxyethoxy)phenyl)fluorene, tricyclodecane diacrylate, dipropylene glycol diacrylate, polypropylene glycol diacrylate, propoxylated neopentyl glycol diacrylate, tricyclodecane dimethanol diacrylate, 1,12-dodecanediol dimethacrylate, trimethylolpropane trimethacrylate, dipentaerythtol polyacrylate, dipentaerythtol hexaacrylate, trimethylolpropane triacrylate, trimethylolpropane ethoxytriacrylate, polyether triacrylate, glycerine propoxy triacrylate, pentaerythritol tetraacrylate, pentaerythritolethoxy tetraacrylate, ditrimethylol propane tetraacrylate, monopentaerythritol acrylate, dipentaerythritol acrylate, tripentaerythritol acrylate, polypentaerythritol acrylate, and pentaerythritol triacrylate,

(b) 1 -20% by weight of a bismaleimide compound;
(c) a nitroxide compound selected from the group consisting of 2,2,5-trimethyl-4-phenyl-3-azahexane-3-nitroxide, 2,2,6,6-tetramethyl-1-piperidinyloxy radical, 2,2,6,6-tetraethyl-1-piperidinyloxy radical, 2,2,6,6-tetramethyl-4-oxo-1-piperidinyloxy radical, 2,2,5,5-tetramethyl-1-pyrrolidinyloxy radical, 1,1,3,3-tetramethyl-2-isoindolinyloxy radical, and N,N-di-t-butylaminoxy radical;
(d) a thermal radical initiator;
(e) an electrically insulating inorganic filler;
wherein upon heat exposure of 80° C. for 15 minutes, the composition maintains processibility prior to curing.

8. The nonconductive curable sealant composition of claim 7 wherein the composition is solventless.

9. A nonconductive curable sealant composition for an electronic device comprising:
(a) a compound having two or more (meth)acryloyl groups selected from the group consisting of:
hexanediol dimethacrylate, hydroxyacryloyloxypropyl methacrylate, hexanediol diacrylate, urethane acrylate, epoxy acrylate, bisphenol A-type epoxy acrylate, modified epoxy acrylate, fatty acid-modified epoxy acrylate, amine-modified bisphenol A-type epoxy acrylate, allyl methacrylate, ethylene glycol dimethacrylate, diethylene glycol dimethacrylate, ethoxylated bisphenol A dimethacrylate, tricyclodecane dimethanol dimethacrylate, glycerine dimethacrylate, polypropylene glycol diacrylate, propoxylated ethoxylated bisphenol A diacrylate, 9,9-bis(4-(2-acryloyloxyethoxy)phenyl)fluorene, tricyclodecane diacrylate, dipropylene glycol diacrylate, polypropylene glycol diacrylate, propoxylated neopentyl glycol diacrylate, tricyclodecane dimethanol diacrylate, 1,12-dodecanediol dimethacrylate, trimethylolpropane trimethacrylate, dipentaerythtol polyacrylate, dipentaerythtol hexaacrylate, trimethylolpropane triacrylate, trimethylolpropane ethoxytriacrylate, polyether triacrylate, glycerine propoxy triacrylate, pentaerythritol tetraacrylate, pentaerythritolethoxy tetraacrylate, ditrimethylol propane tetraacrylate, monopentaerythritol acrylate, dipentaerythritol acrylate, tripentaerythritol acrylate, polypentaerythritol acrylate, and pentaerythritol triacrylate;
(b) 1 -20% by weight of a bismaleimide compound;
(c) a thiocarbonylthio compound selected from the group consisting of 2-cyano-2-propyl benzodithioate, 4-cyano-4-(phenylcarbonothioylthio)pentanoic acid, 2-cyano-2-propyl dodecyl trithiocarbonate, 4-cyano-4-[(dodecylsulfanylthiocarbonyl)sulfanyl]pentanoic acid, 2-(dodecylthiocarbonothioylthio)-2-methylpropionic acid, cyanomethyl dodecyl trithiocarbonate, cyanomethyl methyl(phenyl)carbamodithioate, bis(thiobenzoyl) disulfide, and bis(dodecylsulfanylthiocarbonyl) disulfide;
(d) a thermal radical initiator;
(e) an electrically insulating inorganic filler;
wherein upon heat exposure of 80° C. for 15 minutes, the composition maintains processibility prior to curing.

10. The composition of claim 9 , wherein the composition is solventless.

Assignees

• Henkel Ag & Co Kgaa

Inventors

• Horiguchi Yusuke
• Sato Kenichiro
• Sano Mieko

Classifications

• H10W74/15

  on active surfaces of flip-chip devices, e.g. underfills · CPC title

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/354

  comprising polymers · CPC title

• H10W74/127

  characterised by arrangements for sealing or adhesion · CPC title