Electric equipment and air conditioner
US-9516786-B2 · Dec 6, 2016 · US
Refrigerating apparatus
US9769955B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9769955-B2 |
| Application number | US-201314395644-A |
| Country | US |
| Kind code | B2 |
| Filing date | Apr 26, 2013 |
| Priority date | Apr 27, 2012 |
| Publication date | Sep 19, 2017 |
| Grant date | Sep 19, 2017 |
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- Title
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- Abstract
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- Assignees and inventors
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- Key dates
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- First independent claim
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- CPC / IPC classifications
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- Citations and related patents
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Abstract
Official abstract text for this publication.
A printed board on which a power module is mounted, a cooling pipe that is a refrigerant pipe of a refrigerant circuit, and a cooler attached to the power module and the cooling pipe are disposed in a casing. A support member by which the cooler is attached to the printed board and supported on the printed board, and a fixing member by which the printed board is fixed to the casing and supported on the casing are used.
First claim
Opening claim text (preview).
The invention claimed is: 1. A refrigerating apparatus, including: a refrigerant circuit which performs a refrigeration cycle by circulating a refrigerant; a printed circuit board on which a heat generating component is mounted; a cooler attached to the heat generating component and a refrigerant pipe of the refrigerant circuit, for cooling the heat generating component with the refrigerant flowing in the refrigerant pipe; and a casing in which at least the printed circuit board, the refrigerant pipe, and the cooler are disposed, the refrigerating apparatus comprising: a support member attaching the cooler to the printed circuit board in such manner that a load of the cooler is supported by the printed circuit board; and a fixing member fixing the printed circuit board to the casing in such manner that the printed circuit board is supported by the casing, wherein the casing supports the load of the cooler by operation of the fixing member which transfers the load of the cooler from the printed circuit board to the casing. 2. The refrigerating apparatus of claim 1 , wherein a plurality of electronic components including the heat generating component are mounted on the printed circuit board, and the plurality of electronic components are disposed on a first surface of the printed circuit board, and include a lead line which passes through the printed circuit board from the first surface to a second surface opposite to the first surface and a soldered portion which joins the lead line and the second surface together. 3. The refrigerating apparatus of claim 2 , wherein the support member is made of a metal material, and includes an attachment portion that is attached to the cooler on the first surface of the printed circuit board, a support portion that is continuous with the attachment portion, passes through the printed circuit board, and a soldered portion which joins the support portion and the second surface together. 4. The refrigerating apparatus of claim 3 , wherein the support portion passes through a ground layer of the printed circuit board. 5. The refrigerating apparatus of claim 4 , wherein the support portion includes a retaining portion which prevents the support portion from coming off from the printed circuit board. 6. The refrigerating apparatus of claim 5 , wherein the heat generating component and the support member are attached to a surface of the cooler facing the printed circuit board by screws inserted from the printed circuit board side, and a small hole is formed in the printed circuit board at a location corresponding to the screws. 7. The refrigerating apparatus of claim 5 , wherein the heat generating component and the support member are attached to a surface of the cooler facing the printed circuit board by screws inserted from the printed circuit board side, and a cut line for breaking the printed circuit board and forming a through hole is formed in the printed circuit board at a location corresponding to the screws. 8. The refrigerating apparatus of claim 4 , wherein the heat generating component and the support member are attached to a surface of the cooler facing the printed circuit board by screws inserted from the printed circuit board side, and a small hole is formed in the printed circuit board at a location corresponding to the screws. 9. The refrigerating apparatus of claim 4 , wherein the heat generating component and the support member are attached to a surface of the cooler facing the printed circuit board by screws inserted from the printed circuit board side, and a cut line for breaking the printed circuit board and forming a through hole is formed in the printed circuit board at a location corresponding to the screws. 10. The refrigerating apparatus of claim 3 , wherein the support portion includes a retaining portion which prevents the support portion from coming off from the printed circuit board. 11. The refrigerating apparatus of claim 10 , wherein the heat generating component and the support member are attached to a surface of the cooler facing the printed circuit board by screws inserted from the printed circuit board side, and a small hole is formed in the printed circuit board at a location corresponding to the screws. 12. The refrigerating apparatus of claim 10 , wherein the heat generating component and the support member are attached to a surface of the cooler facing the printed circuit board by screws inserted from the printed circuit board side, and a cut line for breaking the printed circuit board and forming a through hole is formed in the printed circuit board at a location corresponding to the screws. 13. The refrigerating apparatus of claim 3 , wherein the heat generating component and the support member are attached to a surface of the cooler facing the printed circuit board by screws inserted from the printed circuit board side, and a small hole is formed in the printed circuit board at a location corresponding to the screws. 14. The refrigerating apparatus of claim 3 , wherein the heat generating component and the support member are attached to a surface of the cooler facing the printed circuit board by screws inserted from the printed circuit board side, and a cut line for breaking the printed circuit board and forming a through hole is formed in the printed circuit board at a location corresponding to the screws. 15. The refrigerating apparatus of claim 2 , wherein the heat generating component and the support member are attached to a surface of the cooler facing the printed circuit board by screws inserted from the printed circuit board side, and a small hole is formed in the printed circuit board at a location corresponding to the screws. 16. The refrigerating apparatus of claim 2 , wherein the heat generating component and the support member are attached to a surface of the cooler facing the printed circuit board by screws inserted from the printed circuit board side, and a cut line for breaking the printed circuit board and forming a through hole is formed in the printed circuit board at a location corresponding to the screws. 17. The refrigerating apparatus of claim 1 , wherein the refrigerant pipe is a liquid pipe of the refrigerant circuit.
Assignees
Inventors
Classifications
by flowing liquids, e.g. forced water cooling · CPC title
Screws · CPC title
Solder dip coating, i.e. coating printed conductors, e.g. pads by dipping in molten solder or by wave soldering · CPC title
Application of molten solder, e.g. dip soldering · CPC title
- F24F1/24Primary
Cooling of electric components · CPC title
Patent family
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Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US9769955B2 cover?
- A printed board on which a power module is mounted, a cooling pipe that is a refrigerant pipe of a refrigerant circuit, and a cooler attached to the power module and the cooling pipe are disposed in a casing. A support member by which the cooler is attached to the printed board and supported on the printed board, and a fixing member by which the printed board is fixed to the casing and supporte…
- Who is the assignee on this patent?
- Daikin Ind Ltd
- What technology area does this patent fall under?
- Primary CPC classification F24F1/24. Mapped technology areas include Mechanical Engineering.
- When was this patent published?
- Publication date Tue Sep 19 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).