Copper foil and method of manufacturing the same
US-2015152567-A1 · Jun 4, 2015 · US
Printed circuit board and method of manufacturing the same
US9769933B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9769933-B2 |
| Application number | US-201414514819-A |
| Country | US |
| Kind code | B2 |
| Filing date | Oct 15, 2014 |
| Priority date | Nov 29, 2013 |
| Publication date | Sep 19, 2017 |
| Grant date | Sep 19, 2017 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
A printed circuit board includes a substrate, and a wiring provided on the substrate. The wiring includes a copper-based metal wire provided on the substrate and a surface-treated layer provided on the copper-based metal wire. The copper-based metal wire includes mainly a copper. The surface-treated layer includes an amorphous layer including oxygen and a metal with a higher oxygen affinity than the copper.
First claim
Opening claim text (preview).
What is claimed is: 1. A printed circuit board, comprising: a substrate; and a wiring provided on the substrate, the wiring comprising a copper-based metal wire having an upper surface provided on the substrate, and a surface-treated layer coextensive with the upper surface, and comprising an amorphous layer comprising oxygen and a metal having a higher oxygen affinity than copper the metal consisting of zinc, wherein the surface-treated layer directly contacts the upper surface of the copper-based metal wire. 2. The printed circuit board according to claim 1 , wherein the surface-treated layer is provided on the upper surface, or the upper surface and a lower surface, of the copper-based metal wire. 3. The printed circuit board according to claim 1 , wherein the amorphous layer further comprises copper diffused from the copper-based metal wire. 4. The printed circuit board according to claim 1 , wherein the surface-treated layer further comprises a diffusion layer under the amorphous layer, and wherein the diffusion layer comprises a copper and a second metal with a higher oxygen affinity than the copper, or oxygen, a copper and a second metal with a higher oxygen affinity than copper. 5. The printed circuit board according to claim 1 , wherein the surface-treated layer has a thickness of not less than 3 nm and not more than 100 nm. 6. The printed circuit board according to claim 1 , wherein the amorphous layer consists essentially of oxygen, the metal consisting of zinc, and copper diffused into the amorphous layer from the copper-based metal wire.
Assignees
Inventors
Classifications
Metal foils · CPC title
Intermediate metal, e.g. before reinforcing of conductors by plating · CPC title
Using a reactive gas · CPC title
Oxidising metal · CPC title
the conductive material being removed chemically or electrolytically, e.g. by photo-etch process {(semi-additive methods H05K3/108)} · CPC title
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Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US9769933B2 cover?
- A printed circuit board includes a substrate, and a wiring provided on the substrate. The wiring includes a copper-based metal wire provided on the substrate and a surface-treated layer provided on the copper-based metal wire. The copper-based metal wire includes mainly a copper. The surface-treated layer includes an amorphous layer including oxygen and a metal with a higher oxygen affinity tha…
- Who is the assignee on this patent?
- Hitachi Metals Ltd
- What technology area does this patent fall under?
- Primary CPC classification H05K3/282. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Sep 19 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).