Flexible printed circuits with bend retention structures

Patent metadata

Field	Value
Publication number	US-9769920-B2
Application number	US-201414226593-A
Country	US
Kind code	B2
Filing date	Mar 26, 2014
Priority date	Mar 26, 2014
Publication date	Sep 19, 2017
Grant date	Sep 19, 2017

Abstract

An electronic device may be provided with printed circuits. Electrical components may be interconnected using signal paths formed from metal traces in the printed circuits. The printed circuits may include flexible printed circuits with bent configurations. The flexible printed circuits may be provided with integral bend retention structures. A bend retention structure may be formed from a polymer layer, a solder layer, a stiffener formed from metal or polymer that is attached to flexible printed circuit layers with adhesive, a conformal plastic coating that covers exposed metal traces at a bend, a metal stiffener with screw holes, a shape memory alloy, a portion of a flexible printed circuit dielectric substrate layer with a reduced elongation at yield value, or combinations of these structures. The bend retention structure maintains a bend in a bent flexible printed circuit.

First claim

What is claimed is:

1. A flexible printed circuit having a bend, comprising:
flexible printed circuit layers including metal traces; and
a bend retention structure that is attached to the flexible printed circuit layers at the bend and that retains the flexible printed circuit layers in a bent configuration to maintain the bend, wherein the bend retention structure includes a polymer layer with a flattened wrinkle that is attached to the flexible printed circuit layers with a layer of adhesive.

2. An electronic device, comprising:
a display;
a printed circuit; and
a flexible printed circuit with a bend, wherein the flexible printed circuit is coupled between the display and the printed circuit and wherein the flexible printed circuit includes a bend retention structure that maintains the bend, the flexible printed circuit includes a polyimide substrate layer, and the flexible printed circuit includes an opening in the polyimide substrate layer that is filled with a polymer that has a lower elongation at yield value than the polyimide substrate layer.

3. The electronic device defined in claim 2 wherein the flexible printed circuit includes metal traces on the polyimide substrate layer and the bend retention structure comprises a layer of cured adhesive on an outer surface of the flexible printed circuit.

Assignees

• Apple Inc

Inventors

• Ely Colin M
• Shedletsky Anna-Katrina
• Rothkopf Fletcher R
• Lynch Stephen Brian

Classifications

• H05K3/0061

  onto a metallic substrate, e.g. a heat sink (heat sinks for electric apparatus H05K7/20) · CPC title

• H05K2201/09109

  Locally detached layers, e.g. in multilayer · CPC title

• H05K1/0281 Primary

  Reinforcement details thereof · CPC title

• H05K2201/0187

  with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties · CPC title

• H05K2201/10128

  Display · CPC title