Method for manufacturing semiconductor structure and semiconductor structure thereof
US-2024381776-A1 · Nov 14, 2024 · US
US9769583B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9769583-B2 |
| Application number | US-201614994944-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jan 13, 2016 |
| Priority date | Jan 13, 2015 |
| Publication date | Sep 19, 2017 |
| Grant date | Sep 19, 2017 |
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The present invention discloses a vibration membrane assembly for a speaker, a method for producing a vibration membrane assembly and a speaker. The assembly comprises a vibration membrane and a vibration membrane carrier ring. The method comprises providing a first thermal molding die having a molding side, the molding side having a profile which is complementary to that of the second side of the vibration membrane assembly, putting the vibration membrane carrier ring onto the molding side of the first thermal molding die and laying a vibration membrane blank onto the vibration membrane carrier ring to bring the vibration membrane blank in contact with the vibration membrane carrier ring, applying a pressure to the vibration membrane blank against the vibration membrane carrier ring to nest and fix the vibration membrane blank on the vibration membrane carrier ring to form the vibration membrane assembly, removing the pressure off the vibration membrane blank and separating the vibration membrane assembly from the first thermal molding die.
Opening claim text (preview).
What is claimed: 1. A method for producing a vibration membrane assembly for a speaker, the assembly having a first side and a second side opposite to the first side, and comprising a vibration membrane and a vibration membrane carrier ring, the method comprising: providing a first thermal molding die having a molding side, the molding side having a profile which is complementary to that of the second side of the vibration membrane assembly; putting the vibration membrane carrier ring onto the molding side of the first thermal molding die; and laying a vibration membrane blank onto the vibration membrane carrier ring to bring the vibration membrane blank in contact with a top side of the vibration membrane carrier ring and wrapped around an outer periphery of the vibration membrane carrier ring; applying a pressure to the vibration membrane blank against the vibration membrane carrier ring to nest and fix the vibration membrane blank on the vibration membrane carrier ring to form the vibration membrane assembly; and removing the pressure off the vibration membrane blank and separating the vibration membrane assembly from the first thermal molding die. 2. The method according to claim 1 , wherein the pressure is applied by a gas around the vibration membrane blank. 3. The method according to claim 2 , wherein the step of applying a pressure to the vibration membrane blank against the vibration membrane carrier ring comprises: forming a gas chamber around the vibration membrane blank laid on the vibration membrane carrier ring; and applying a gas pressure to the vibration membrane blank against the vibration membrane carrier ring to nest and fix the vibration membrane blank on the vibration membrane carrier ring to form the vibration membrane assembly. 4. The method according to claim 1 , wherein the step of applying a pressure to the vibration membrane blank against the vibration membrane carrier ring comprises: providing a second thermal molding die which is able to form, in combination with the first thermal molding die, a cavity in coincidence with a whole profile of the vibration membrane assembly; and pressing together the first and the second thermal molding dies to thermally press the vibration membrane blank and the vibration membrane carrier ring in the cavity to nest and fix the vibration membrane blank on the vibration membrane carrier ring to form the vibration membrane assembly. 5. The method according to claim 4 , wherein after pressing together the first and the second thermal molding dies, at least one part of the vibration membrane blank is exposed from a gap between the first and the second thermal molding dies. 6. The method according to claim 1 , wherein the vibration membrane carrier ring is provided with at least one fixing grooves, and wherein during nesting and fixing the vibration membrane blank on the vibration membrane carrier ring, a part of the vibration membrane blank is thermally pressed into the fixing grooves to fix the vibration membrane blank to the vibration membrane carrier ring. 7. The method according to claim 6 , wherein the number of the fixing grooves is four and the fixing grooves are arranged on separate sides of the vibration membrane carrier ring. 8. The method according to claim 6 , wherein the fixing grooves have straight or wavy shaped edges. 9. The method according to claim 1 , wherein in the step of laying a vibration membrane blank onto the vibration membrane carrier ring, the vibration membrane blank is also brought in contact with at least a portion of a bottom side of the vibration membrane carrier ring opposite the top side. 10. The method according to claim 1 , wherein the first thermal molding die is provided with a membrane shaping structure for forming patterns and/or shapes on the vibration membrane blank. 11. The method according to claim 1 , wherein the vibration membrane blank is a foil.
Manufacturing aspects of the outer suspension of loudspeaker or microphone diaphragms or of their connecting aspects to said diaphragms · CPC title
Moulding aspects of diaphragm or surround · CPC title
Clamping rim of diaphragm or cone against seating · CPC title
for diaphragms or their outer suspension · CPC title
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