High flux diode packaging using passive microscale liquid-vapor phase change

Patent metadata

Field	Value
Publication number	US-9768584-B2
Application number	US-201615080507-A
Country	US
Kind code	B2
Filing date	Mar 24, 2016
Priority date	Mar 24, 2015
Publication date	Sep 19, 2017
Grant date	Sep 19, 2017

Abstract

A laser diode package includes a heat pipe having a fluid chamber enclosed in part by a heat exchange wall for containing a fluid. Wicking channels in the fluid chamber is adapted to wick a liquid phase of the fluid from a condensing section of the heat pipe to an evaporating section of the heat exchanger, and a laser diode is connected to the heat exchange wall at the evaporating section of the heat exchanger so that heat produced by the laser diode is removed isothermally from the evaporating section to the condensing section by a liquid-to-vapor phase change of the fluid.

First claim

We claim:

1. A laser diode package comprising:
a heat pipe having a fluid chamber enclosed in part by a heat exchange wall for containing a fluid, and wicking channels in the fluid chamber integrally formed on an inner surface of the heat exchange wall and adapted to wick a liquid phase of the fluid from a condensing section of the heat pipe to an adjacent evaporating section of the heat pipe; and
a laser diode connected to the heat exchange wall at the evaporating section of the heat pipe so that heat produced by the laser diode is removed isothermally from the evaporating section to the condensing section by a liquid-to-vapor phase change of the fluid.

2. The laser diode package of claim 1 ,
wherein the heat exchange wall has fins on an outer surface thereof for transferring heat to an external cooling fluid.

3. The laser diode package of claim 2 ,
wherein the fins are elongated structures arranged on the outer surface of the heat exchange wall to form cooling channels therebetween for channeling the external cooling fluid therethrough.

4. The laser diode package of claim 1 ,
wherein the heat exchange wall is a first planar substrate, and the fluid chamber is additionally enclosed in part by a second planar substrate and a spacer perimetrically connecting the first and second planar substrates together.

5. The laser diode package of claim 4 ,
wherein the second planar substrate is a second heat exchange wall with wicking channels integrally formed in the fluid chamber on an inner surface of the second heat exchange wall and adapted to wick a liquid phase of the fluid from the condensing section of the heat exchanger to the evaporating section of the heat exchanger.

6. The laser diode package of claim 1 ,
further comprising an external fluid housing operably connected to provide an external cooling fluid across an outer surface of the heat exchange wall.

7. A stacked laser diode array package comprising:
at least two laser diode package units, each comprising: (1) a heat exchanger having a fluid chamber enclosed by a first planar heat exchange wall, a second planar heat exchange wall, and a spacer perimetrically connecting the first and second planar substrates together for containing a fluid, and wicking channels integrally formed in the fluid chamber on inner surfaces of the first and second heat exchange walls and adapted to wick a liquid phase of the fluid from a condensing section of the heat exchanger to an adjacent evaporating section of the heat exchanger; and (2) a laser diode connected to the first planar heat exchange wall at the evaporating section of the heat exchanger so that heat produced by the laser diode is removed isothermally from the evaporating section to the condensing section by a liquid-to-vapor phase change of the fluid,
wherein the laser diode package units are stacked together so that each laser diode, except for one of the two laser diodes of the two outer units of the stack, are also connected to the second planar heat exchange wall at an evaporating section of the heat exchanger of an adjacent laser diode package unit so that heat produced by the laser diode is also removed isothermally from the evaporating section to the condensing section of the adjacent laser diode package unit by a liquid-to-vapor phase change of the fluid.

8. The stacked laser diode array package of claim 7 ,
wherein for each laser diode package unit the first and second planar heat exchange walls have fins on outer surfaces thereof for transferring heat to an external cooling fluid.

9. The stacked laser diode array package of claim 8 ,
wherein the fins are elongated structures arranged on the outer surfaces of the first and second heat exchange walls to form cooling channels therebetween for channeling the external cooling fluid therethrough.

10. The stacked laser diode array package of claim 7 ,
further comprising an external fluid housing operably connected to provide an external cooling fluid across outer surfaces of the first and second planar heat exchange walls of each heat exchanger.

Assignees

• L Livermore Nat Security Llc

Inventors

• Bandhauer Todd
• Deri Robert J
• Elmer John W
• Kotovsky Jack
• Patra Susant

Classifications

• H10W20/4421

  the principal metal being copper · CPC title

• H10W20/42

  Vias, e.g. via plugs · CPC title

• H01S5/02469 Primary

  Passive cooling, e.g. where heat is removed by the housing as a whole or by a heat pipe without any active cooling element like a TEC · CPC title

• H01S5/4025

  Array arrangements, e.g. constituted by discrete laser diodes or laser bar (H01S5/42 takes precedence) · CPC title

• H01S5/024

  Arrangements for thermal management · CPC title