Integrated circuit packaging system with support structure and method of manufacture thereof

Patent metadata

Field	Value
Publication number	US-9768102-B2
Application number	US-201213425768-A
Country	US
Kind code	B2
Filing date	Mar 21, 2012
Priority date	Mar 21, 2012
Publication date	Sep 19, 2017
Grant date	Sep 19, 2017

Abstract

A method of manufacture of an integrated circuit packaging system includes: forming a one-layer substrate with a symmetrical structure, the one-layer substrate having a redistribution pad and an insulation, the redistribution pad only at an insulation top side of the insulation; mounting an integrated circuit over the one-layer substrate; and forming an encapsulation over the integrated circuit.

First claim

What is claimed is:

1. A method of manufacture of an integrated circuit packaging system comprising:
forming a one-layer substrate with a symmetrical structure, the one-layer substrate having an attachment pad, a redistribution pad, a vertical connector, and an insulation, the redistribution pad having a vertical height greater than a vertical height of the attachment pad and only at an insulation top side of the insulation, and the vertical connector having a height greater than a height of the redistribution pad, coplanar with a bottom side of the insulation, directly on the redistribution pad, within the insulation, and having a bottom width greater than a top width;
mounting an integrated circuit over the one-layer substrate, the integrated circuit having an inactive side attached to the insulation top side of the insulation; and
forming an encapsulation over the integrated circuit.

2. The method as claimed in claim 1 wherein forming the one-layer substrate includes forming the one-layer substrate having the attachment pad coplanar with the insulation.

3. The method as claimed in claim 1 wherein mounting the integrated circuit includes mounting the integrated circuit over the one-layer substrate with the redistribution pad directly under the integrated circuit.

4. The method as claimed in claim 1 wherein forming the one-layer substrate includes forming the one-layer substrate having the attachment pad only at the insulation top side of the insulation.

5. The method as claimed in claim 1 wherein mounting the integrated circuit includes mounting the integrated circuit over the one-layer substrate with the attachment pad only outside a non-horizontal extent of the integrated circuit.

6. A method of manufacture of an integrated circuit packaging system comprising:
forming a one-layer substrate with a symmetrical structure, the one-layer substrate having an attachment pad, a redistribution pad, a vertical connector, and an insulation, the redistribution pad having a vertical height greater than a vertical height of the attachment pad and only at an insulation top side of the insulation, and the vertical connector having a height greater than a height of the redistribution pad, coplanar with a bottom side of the insulation, directly on the redistribution pad, within the insulation, and having a bottom width greater than a top width;
mounting an integrated circuit over the one-layer substrate, the integrated circuit having an inactive side attached to the insulation top side of the insulation; and
forming an encapsulation over the integrated circuit.

7. The method as claimed in claim 6 wherein forming the one-layer substrate includes forming the one-layer substrate having the attachment pad having an attachment pad top side coplanar with the insulation top side of the insulation.

8. The method as claimed in claim 6 wherein mounting the integrated circuit includes mounting the integrated circuit over the one-layer substrate with the redistribution pad and the vertical connector directly under the integrated circuit.

9. The method as claimed in claim 6 wherein forming the one-layer substrate includes forming the one-layer substrate having the attachment pad only at the insulation top side of the insulation, the attachment pad electrically connected to the redistribution pad.

10. The method as claimed in claim 6 wherein:
mounting the integrated circuit includes mounting the integrated circuit over the one-layer substrate with the attachment pad only outside a non-horizontal extent of the integrated circuit; and

further comprising:
attaching an internal connector to the integrated circuit and the attachment pad.

11. An integrated circuit packaging system comprising:
a one-layer substrate with a symmetrical structure, the one-layer substrate having an attachment pad, a redistribution pad, a vertical connector, and an insulation, the redistribution pad having a vertical height greater than a vertical height of the attachment pad and only at an insulation top side of the insulation, and the vertical connector having a height greater than a height of the redistribution pad, coplanar with a bottom side of the insulation, directly on the redistribution pad, within the insulation, and having a bottom width greater than a top width;
an integrated circuit over the one-layer substrate, the integrated circuit having an inactive side attached to the insulation top side of the insulation; and
an encapsulation over the integrated circuit.

12. The system as claimed in claim 11 wherein the one-layer substrate includes the attachment pad coplanar with the insulation.

13. The system as claimed in claim 11 wherein the integrated circuit is over the one-layer substrate with the redistribution pad directly under the integrated circuit.

14. The system as claimed in claim 11 wherein the one-layer substrate includes the attachment pad only at the insulation top side of the insulation.

15. The system as claimed in claim 11 wherein the integrated circuit is over the one-layer substrate with the attachment pad only outside a non-horizontal extent of the integrated circuit.

16. The system as claimed in claim 11 wherein the one-layer substrate includes the attachment pad having an attachment pad top side coplanar with the insulation top side of the insulation.

17. The system as claimed in claim 11 wherein the integrated circuit is over the one-layer substrate with the redistribution pad and the vertical connector directly under the integrated circuit.

18. The system as claimed in claim 11 wherein the one-layer substrate includes the attachment pad only at the insulation top side of the insulation, the attachment pad electrically connected to the redistribution pad.

19. The system as claimed in claim 11 wherein:
the integrated circuit is over the one-layer substrate with the attachment pad only outside a non-horizontal extent of the integrated circuit; and

further comprising:
an internal connector attached to the integrated circuit and the attachment pad.

Assignees

• Jeon Dong Ju
• Lee Koo Hong
• Kim Sung Soo
• Stats Chippac Pte Ltd

Inventors

• Jeon Dong Ju
• Lee Koo Hong
• Kim Sung Soo

Classifications

• H10W90/701

  characterised by the relative positions of pads or connectors relative to package parts · CPC title

• H10W74/117

  the substrate having spherical bumps for external connection · CPC title

• H10W70/095

  of vias therein · CPC title

• H10W70/635 Primary

  Through-vias · CPC title

• H01L2924/00014

  Electricity · mapped topic