Refractory metal plates with improved uniformity of texture
US-9095885-B2 · Aug 4, 2015 · US
US9767999B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9767999-B2 |
| Application number | US-201514751224-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 26, 2015 |
| Priority date | Aug 6, 2007 |
| Publication date | Sep 19, 2017 |
| Grant date | Sep 19, 2017 |
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A refractory metal plate is provided. The plate has a center, a thickness, an edge, a top surface and a bottom surface, and has a crystallographic texture (as characterized by through thickness gradient, banding severity; and variation across the plate, for each of the texture components 100//ND and 111//ND, which is substantially uniform throughout the plate.
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What is claimed is: 1. A refractory metal plate having a center, a thickness, an edge, a top surface and a bottom surface, the refractory metal plate having a crystallographic texture as characterized by through thickness gradient, banding severity; and variation across the plate, for each of the texture components 100//ND and 111//ND using electron back-scatter diffraction with a 15 μm step in both the horizontal and vertical directions for each measurement, wherein the average through-thickness gradient is less than or equal to 3% per mm for 100//ND and 111//ND. 2. The refractory metal plate of claim 1 , wherein the metal plate is at least 99.95% pure refractory metal. 3. The refractory metal plate of claim 2 , wherein the metal plate has a grain size that is less than 60 μm. 4. The refractory metal plate of claim 3 , wherein the metal plate is at least 99.995% pure refractory metal. 5. The refractory metal plate of claim 4 , wherein the refractory metal is tantalum. 6. The refractory metal plate of claim 4 , wherein the refractory metal is niobium. 7. The refractory metal plate of claim 1 , wherein the metal plate is manufactured by ingot metallurgy and the metal plate is a sputtering target. 8. The refractory metal plate of claim 1 , wherein the metal plate is manufactured by powder metallurgy and the metal plate is a sputtering target. 9. The refractory metal plate of claim 8 , wherein the metal plate is manufactured using a process including rolling the plate asymmetrically, wherein the asymmetric rolling is carried out on an inclined plane having an angle of incline between 2 and 20 degrees. 10. The refractory metal plate of claim 8 , wherein the metal plate has a texture as characterized by through-thickness gradient, where the average through-thickness gradient for the texture components 100//ND and 111//ND is less than or equal to 2% per mm. 11. The refractory metal plate of claim 8 , wherein the metal plate has an average banding severity of 6% or less for 100//ND and 111//ND. 12. The refractory metal plate of claim 11 , wherein the metal plate has an average banding severity of 5% or less for 100//ND and 111//ND. 13. The refractory metal plate of claim 12 , wherein the metal plate has an average variation across the plate of less than or equal to 4%. 14. The refractory metal plate of claim 1 , wherein the texture is determined from grains maps with grains separately identified for 100 and 111 within 15° of the normal direction. 15. A refractory metal plate having a center, a thickness, an edge, a top surface and a bottom surface, the refractory metal plate having a crystallographic texture as characterized by through thickness gradient; banding severity; and variation across the plate, for the texture components 100//ND and 111//ND using electron back-scatter diffraction with a 15 μm step in both the horizontal and vertical directions for each measurement, wherein the average banding severity is less than or equal to 6% for 100//ND and 111//ND; wherein the refractory metal plate is manufactured by ingot metallurgy. 16. The refractory metal plate of claim 15 , wherein the metal plate is at least 99.95% pure refractory metal, the metal plate has a grain size that is less than 60 μm, and the metal plate is a sputtering target. 17. The refractory metal plate of claim 16 , wherein the refractory metal is tantalum or niobium, the metal plate is a sputtering target, and the metal plate has a purity of at least 99.995% refractory metal. 18. A refractory metal plate having a center, a thickness, an edge, a top surface and a bottom surface, the refractory metal plate having a crystallographic texture as characterized by banding severity for the texture components 100//ND and 111//ND using electron back-scatter diffraction with a 15 μm step in both the horizontal and vertical directions for each measurement, wherein the average banding severity is less than or equal to 5% for 100//ND and 111//ND. 19. The refractory metal plate of claim 18 , wherein the metal plate is manufactured by powder metallurgy and the average through-thickness gradient is less than 2%/mm for 100//ND and 111//ND. 20. The refractory metal plate of claim 19 , wherein the refractory metal is tantalum or niobium, the metal plate is a sputtering target, and the metal plate has a purity of at least 99.995% refractory metal.
by using pressure rollers · CPC title
Surface roughening or texturing · CPC title
Lifting or lowering work for conveying purposes, e.g. tilting tables arranged immediately in front of or behind the pass (turn-over or like manipulating means as such B21B39/20) · CPC title
Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy · CPC title
Material · CPC title
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