Refractory metal plates

US9767999B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9767999-B2
Application numberUS-201514751224-A
CountryUS
Kind codeB2
Filing dateJun 26, 2015
Priority dateAug 6, 2007
Publication dateSep 19, 2017
Grant dateSep 19, 2017

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A refractory metal plate is provided. The plate has a center, a thickness, an edge, a top surface and a bottom surface, and has a crystallographic texture (as characterized by through thickness gradient, banding severity; and variation across the plate, for each of the texture components 100//ND and 111//ND, which is substantially uniform throughout the plate.

First claim

Opening claim text (preview).

What is claimed is: 1. A refractory metal plate having a center, a thickness, an edge, a top surface and a bottom surface, the refractory metal plate having a crystallographic texture as characterized by through thickness gradient, banding severity; and variation across the plate, for each of the texture components 100//ND and 111//ND using electron back-scatter diffraction with a 15 μm step in both the horizontal and vertical directions for each measurement, wherein the average through-thickness gradient is less than or equal to 3% per mm for 100//ND and 111//ND. 2. The refractory metal plate of claim 1 , wherein the metal plate is at least 99.95% pure refractory metal. 3. The refractory metal plate of claim 2 , wherein the metal plate has a grain size that is less than 60 μm. 4. The refractory metal plate of claim 3 , wherein the metal plate is at least 99.995% pure refractory metal. 5. The refractory metal plate of claim 4 , wherein the refractory metal is tantalum. 6. The refractory metal plate of claim 4 , wherein the refractory metal is niobium. 7. The refractory metal plate of claim 1 , wherein the metal plate is manufactured by ingot metallurgy and the metal plate is a sputtering target. 8. The refractory metal plate of claim 1 , wherein the metal plate is manufactured by powder metallurgy and the metal plate is a sputtering target. 9. The refractory metal plate of claim 8 , wherein the metal plate is manufactured using a process including rolling the plate asymmetrically, wherein the asymmetric rolling is carried out on an inclined plane having an angle of incline between 2 and 20 degrees. 10. The refractory metal plate of claim 8 , wherein the metal plate has a texture as characterized by through-thickness gradient, where the average through-thickness gradient for the texture components 100//ND and 111//ND is less than or equal to 2% per mm. 11. The refractory metal plate of claim 8 , wherein the metal plate has an average banding severity of 6% or less for 100//ND and 111//ND. 12. The refractory metal plate of claim 11 , wherein the metal plate has an average banding severity of 5% or less for 100//ND and 111//ND. 13. The refractory metal plate of claim 12 , wherein the metal plate has an average variation across the plate of less than or equal to 4%. 14. The refractory metal plate of claim 1 , wherein the texture is determined from grains maps with grains separately identified for 100 and 111 within 15° of the normal direction. 15. A refractory metal plate having a center, a thickness, an edge, a top surface and a bottom surface, the refractory metal plate having a crystallographic texture as characterized by through thickness gradient; banding severity; and variation across the plate, for the texture components 100//ND and 111//ND using electron back-scatter diffraction with a 15 μm step in both the horizontal and vertical directions for each measurement, wherein the average banding severity is less than or equal to 6% for 100//ND and 111//ND; wherein the refractory metal plate is manufactured by ingot metallurgy. 16. The refractory metal plate of claim 15 , wherein the metal plate is at least 99.95% pure refractory metal, the metal plate has a grain size that is less than 60 μm, and the metal plate is a sputtering target. 17. The refractory metal plate of claim 16 , wherein the refractory metal is tantalum or niobium, the metal plate is a sputtering target, and the metal plate has a purity of at least 99.995% refractory metal. 18. A refractory metal plate having a center, a thickness, an edge, a top surface and a bottom surface, the refractory metal plate having a crystallographic texture as characterized by banding severity for the texture components 100//ND and 111//ND using electron back-scatter diffraction with a 15 μm step in both the horizontal and vertical directions for each measurement, wherein the average banding severity is less than or equal to 5% for 100//ND and 111//ND. 19. The refractory metal plate of claim 18 , wherein the metal plate is manufactured by powder metallurgy and the average through-thickness gradient is less than 2%/mm for 100//ND and 111//ND. 20. The refractory metal plate of claim 19 , wherein the refractory metal is tantalum or niobium, the metal plate is a sputtering target, and the metal plate has a purity of at least 99.995% refractory metal.

Assignees

Inventors

Classifications

  • by using pressure rollers · CPC title

  • Surface roughening or texturing · CPC title

  • Lifting or lowering work for conveying purposes, e.g. tilting tables arranged immediately in front of or behind the pass (turn-over or like manipulating means as such B21B39/20) · CPC title

  • Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy · CPC title

  • Material · CPC title

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What does patent US9767999B2 cover?
A refractory metal plate is provided. The plate has a center, a thickness, an edge, a top surface and a bottom surface, and has a crystallographic texture (as characterized by through thickness gradient, banding severity; and variation across the plate, for each of the texture components 100//ND and 111//ND, which is substantially uniform throughout the plate.
Who is the assignee on this patent?
Starck H C Inc
What technology area does this patent fall under?
Primary CPC classification H01J37/3426. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Sep 19 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).