Sputtering target

Patent metadata

Field	Value
Publication number	US-9767998-B2
Application number	US-201214343031-A
Country	US
Kind code	B2
Filing date	Sep 6, 2012
Priority date	Sep 6, 2011
Publication date	Sep 19, 2017
Grant date	Sep 19, 2017

Abstract

A sputtering target including a sintered body:
the sintered body including: indium oxide doped with Ga or indium oxide doped with Al, and a positive tetravalent metal in an amount of exceeding 100 at. ppm and 1100 at. ppm or less relative to the total of Ga and indium, or Al and indium, the crystal structure of the sintered body substantially including a bixbyite structure of indium oxide.

First claim

The invention claimed is:

1. A sputtering target comprising a sintered body:
the sintered body comprising:
indium oxide doped with Ga, and
a positive tetravalent metal in an amount greater than 100 at. ppm and less than or equal to 1100 at. ppm relative to a total of Ga and indium,
a crystal structure of the sintered body consisting essentially of a bixbyite structure of the indium oxide, and
metal elements in the sintered body consisting essentially of In, Ga and the positive tetravalent metal,
wherein the sintered body does not comprise a crystal structure of GaInO 3 .

2. The sputtering target according to claim 1 , wherein an atomic ratio Ga/(Ga+In) of indium oxide doped with Ga, is 0.001 to 0.15.

3. The sputtering target according to claim 1 , wherein the positive tetravalent metal is one or two or more elements selected from Sn, Zr, Ti and Si.

4. The sputtering target according to claim 1 , wherein a bulk resistance of the sintered body is 5 mΩ cm or less.

5. The sputtering target according to claim 1 , wherein a relative density of the sintered body is 97% or more.

6. A method for producing the sputtering target according to claim 1 , comprising:
heating a formed body from 800° C. to a sintering temperature at a heating rate of 0.1 to 20° C./min; and
holding the heated formed body at the sintering temperature for 10 to 50 hours to allow it to be sintered;
wherein the sintering temperature is 1200° C. to 1650° C.

7. An oxide semiconductor thin film formed by a sputtering method using the sputtering target according to claim 1 .

8. A method for producing the oxide semiconductor thin film according to claim 7 , wherein deposition is conducted in an atmosphere of a mixed gas comprising a rare gas and one or more gases selected from a water vapor, an oxygen gas and a nitrous oxide gas.

9. The method for producing the oxide semiconductor thin film according to claim 8 , wherein deposition is conducted in an atmosphere of a mixed gas comprising a rare gas and at least water vapor.

10. The method for producing the oxide semiconductor thin film according to claim 9 , wherein an amount ratio of the water vapor contained in the atmosphere is 0.1% to 25% in terms of partial pressure.

11. The method for producing the oxide semiconductor thin film according to claim 8 comprising:
transporting substrates in sequence at positions opposing to 3 or more targets arranged in parallel with a prescribed interval in a vacuum chamber;
applying a negative potential and a positive potential alternately from an AC power source to each of the targets; and
causing plasma to be generated on a target by applying a potential from the AC power source while switching targets to which a potential is applied between two or more targets connected to this AC power source, thereby depositing a film on a substrate surface.

12. The method for producing the oxide semiconductor thin film according to claim 11 , wherein an AC power density of the AC power source is in a range of 3 W/cm 2 to 20 W/cm 2 .

13. The method for producing the oxide semiconductor thin film according to claim 11 , wherein a frequency of the AC power source is 10 kHz to 1 MHz.

14. A thin film transistor comprising the oxide semiconductor thin film formed by the method according to claim 8 as a channel layer.

15. The thin film transistor according to claim 14 , wherein a field effect mobility is 30 cm 2 /Vs or more.

16. The thin film transistor according to claim 14 , which comprises a protective film comprising SiNx, on the channel layer.

17. A display comprising the thin film transistor according to claim 14 .

18. The sputtering target according to claim 1 , wherein the sintered body comprising the positive tetravalent metal in an amount greater than 120 at. ppm and less than or equal to 700 at. ppm relative to a total of Ga and indium.

19. The sputtering target according to claim 1 , wherein the sputtering target contains In and Ga in an amount exceeding 99 wt % of all metal elements in the sputtering target other than the positive tetravalent metal.

Assignees

• Ebata Kazuaki
• Tomai Shigekazu
• Matsuzaki Shigeo
• Tsuruma Yuki
• Idemitsu Kosan Co

Inventors

• Ebata Kazuaki
• Tomai Shigekazu
• Matsuzaki Shigeo
• Tsuruma Yuki

Classifications

• H10P14/3434

  being oxide semiconductor materials (Group IIB-VIA semiconductor materials H10P14/3424) · CPC title

• H10P14/2922

  being non-crystalline insulating materials, e.g. glass or polymers · CPC title

• H10P14/22

  using physical deposition, e.g. vacuum deposition or sputtering · CPC title

• H01J37/3426 Primary

  Material · CPC title

• H01J37/34

  operating with cathodic sputtering (H01J37/36 takes precedence {; methods of cathodic sputtering C23C14/34}) · CPC title