Apparatus for treating a gas in a conduit

Patent metadata

Field	Value
Publication number	US-9767990-B2
Application number	US-201615188504-A
Country	US
Kind code	B2
Filing date	Jun 21, 2016
Priority date	May 29, 2014
Publication date	Sep 19, 2017
Grant date	Sep 19, 2017

Abstract

Apparatus for treating a gas in a conduit of a substrate processing system are provided. In some embodiments, an apparatus for treating a gas in a conduit of a substrate processing system includes: a dielectric tube configured to be coupled to a conduit of a substrate processing system to allow a flow of gases through the dielectric tube, wherein the dielectric tube has a conical sidewall; and a radio frequency (RF) coil wound about an outer surface of the conical sidewall of the dielectric tube. In some embodiments, the RF coil is hollow and includes coolant fittings to couple the hollow RF coil to a coolant supply.

First claim

The invention claimed is:

1. An apparatus for treating a gas in a conduit of a substrate processing system, comprising:
a dielectric tube configured to be coupled to a conduit of a substrate processing system to allow a flow of gases through the dielectric tube, wherein the dielectric tube has a conical sidewall; and
a radio frequency (RF) coil wound about an outer surface of the conical sidewall of the dielectric tube.

2. The apparatus of claim 1 , wherein the RF coil is hollow and includes a first coolant fitting and a second coolant fitting to facilitate flow of a coolant through the RF coil.

3. The apparatus of claim 1 , wherein the dielectric tube is fabricated from alumina, sapphire, or quartz.

4. The apparatus of claim 1 , further comprising:
a first end flange coupled to a first end of the dielectric tube; and
a second end flange coupled to a second end of the dielectric tube, wherein each of the first and second end flanges are configured to couple the dielectric tube in-line with a conduit.

5. The apparatus of claim 4 , wherein the conical sidewall of the dielectric tube terminates with a straight end portion at the first end of the dielectric tube and a straight end portion at the second end of the dielectric tube, and wherein the first and second end flanges are coupled to the dielectric tube at the straight end portions.

6. The apparatus of claim 4 , wherein at least one of the first and second end flanges further comprise a coolant channel to facilitate circulating a coolant through the at least one of the first and second end flanges.

7. The apparatus of claim 1 , further comprising:
a deformable layer disposed between the RF coil and the dielectric tube to enhance contact between the RF coil and the dielectric tube.

8. The apparatus of claim 7 , wherein the deformable layer comprises silicon rubber or thermal grease.

9. The apparatus of claim 1 , wherein the RF coil has a flattened circular cross-section, and wherein a flattened portion of the RF coil is disposed facing the dielectric tube.

10. The apparatus of claim 1 , further comprising:
one or more first terminals coupled to the RF coil and one or more second terminals coupled to the RF coil to facilitate coupling RF power to the RF coil.

11. The apparatus of claim 10 , wherein the one or more first terminals comprise a plurality of first terminals, wherein the one or more second terminals comprise a plurality of second terminals, and wherein ones of the plurality of first terminals and the plurality of second terminals are located at different locations along the RF coil to facilitate coupling RF energy through a different number of turns of the RF coil.

12. The apparatus of claim 1 , further comprising:
an RF power source coupled to a first end of the RF coil to provide RF power to the RF coil.

13. An apparatus for treating a gas in a conduit of a substrate processing system, comprising:
a dielectric tube configured to be coupled to a conduit of a substrate processing system to allow a flow of gases through the dielectric tube, wherein the dielectric tube has a conical sidewall;
a radio frequency (RF) coil wound about an outer surface of the conical sidewall of the dielectric tube, wherein the RF coil is hollow and includes a first coolant fitting coupled and a second coolant fitting coupled to the RF coil to facilitate flow of a coolant through the RF coil;
one or more first terminals and one or more second terminals coupled to the RF coil to facilitate coupling RF power to the RF coil;
a first end flange coupled to a first end of the dielectric tube; and
a second end flange coupled to a second end of the dielectric tube, wherein each of the first and second end flanges are configured to couple the dielectric tube in-line with a conduit.

14. The apparatus of claim 13 , further comprising:
a deformable layer disposed between the RF coil and the dielectric tube to enhance contact between the RF coil and the dielectric tube, wherein the deformable layer comprises silicon rubber or thermal grease.

15. The apparatus of claim 13 , wherein the RF coil has a flattened circular cross-section, and wherein a flattened portion of the RF coil is disposed facing the dielectric tube.

16. The apparatus of claim 13 , wherein the one or more first terminals comprise a plurality of first terminals, wherein the one or more second terminals comprise a plurality of second terminals, and wherein ones of the plurality of first terminals and the plurality of second terminals are located at different locations along the RF coil to facilitate coupling RF energy through a different number of turns of the RF coil.

17. A substrate processing system, comprising:
a process chamber;
an exhaust conduit coupled to the process chamber to allow a flow of exhaust gases from the process chamber;
a vacuum pump coupled to the exhaust conduit to evacuate exhaust gases from the process chamber through the exhaust conduit;
a dielectric tube coupled to the exhaust conduit to allow a flow of the exhaust gases through the dielectric tube, wherein the dielectric tube has a conical sidewall; and
a radio frequency (RF) coil wound about an outer surface of the conical sidewall of the dielectric tube.

18. The substrate processing system of claim 17 , wherein the exhaust conduit is a foreline.

19. The substrate processing system of claim 17 , wherein the dielectric tube is disposed between the process chamber and the vacuum pump.

20. The substrate processing system of claim 17 , further comprising:
an RF power source coupled to a first end of the RF coil to provide RF power to the RF coil.

Assignees

• Applied Materials Inc

Inventors

• Zeng Jibing
• West Brian T
• Wang Rongping
• Gajendra Manoj A

Classifications

• H01J37/32807

  Construction (includes replacing parts of the apparatus) · CPC title

• H01J37/32568

  Relative arrangement or disposition of electrodes; moving means · CPC title

• H01J37/32467

  Material · CPC title

• H05H1/30

  using applied electromagnetic fields, e.g. high frequency or microwave energy (H05H1/28 takes precedence) · CPC title

• H01J37/32522

  Temperature · CPC title