Electric equipment having movable portion, and its manufacture

Patent metadata

Field	Value
Publication number	US-9767966-B2
Application number	US-201414202437-A
Country	US
Kind code	B2
Filing date	Mar 10, 2014
Priority date	Sep 30, 2011
Publication date	Sep 19, 2017
Grant date	Sep 19, 2017

Abstract

On seed metal layer of first metal, pedestal and counter electrode are formed of second metal by plating, adjacent to free space region. The free space region is filled with first sacrificial layer. By using resist pattern, second sacrificial metal layer is formed, extending from the first sacrificial layer to a portion of the pedestal, and lower structure of third metal is formed on the second sacrificial layer, by contiguous plating, exposing a portion of the pedestal not formed with the second sacrificial layer, the third metal having composition and thermal expansion coefficient equivalent to the second metal. Upper structure of fourth metal having composition and thermal expansion coefficient equivalent to the second and third metals is formed on the pedestal and the lower structure by plating. The first and second sacrificial layers are removed, leaving an electric equipment with a movable portion.

First claim

What we claim are:

1. A method for manufacturing an electric equipment, comprising:
forming a first seed layer of a first metal material above a substrate;
after said forming the first seed layer, forming a support by plating using a first mask having a first opening defining a support area, the support including a pedestal portion of a second metal material at a location above the first seed layer and adjacent to a first space region;
after said forming the support, forming in the first space region a first sacrificial layer different in etching characteristic from the second metal material;
after said forming the first sacrificial layer, forming a second sacrificial layer of a metal material extending from the first sacrificial layer to and on a portion of a surface of the pedestal portion;
after said forming the second sacrificial layer, forming by plating using a second mask having a second opening exposing the second sacrificial layer, above the second sacrificial layer, a lower structure of a third metal material having a composition and a thermal expansion coefficient equivalent to a composition and thermal expansion coefficient of the second metal material;
after said forming the lower structure, exposing a surface of the pedestal portion not provided with the second sacrificial layer, and forming by plating using a third mask having a third opening extending from the pedestal portion to part of the lower structure, an upper structure of a fourth metal material having a composition and a thermal expansion coefficient equivalent to composition and thermal expansion coefficient of the second metal material and the third metal material; and
after said forming the upper structure, removing the first sacrificial layer and the second sacrificial layer, wherein
said substrate serves as substrate of the electric equipment manufactured.

2. The method for manufacturing the electric equipment, according to claim 1 , further comprising:
before forming the first sacrificial layer, forming a second seed layer covering a surface exposed to the first space region, and a portion of an upper surface of the pedestal portion adjacent to the first space region;
wherein the first sacrificial layer is made of a metal material, and is formed by plating; and
forming the second sacrificial layer by plating, on the first sacrificial film and on the second seed layer on the upper surface of the pedestal portion.

3. The method for manufacturing the electric equipment, according to claim 2 , wherein
the first sacrificial layer is made of a dielectric material, and is formed to fill the first space region; and
when the second sacrificial layer is formed, the second seed layer extending from the first sacrificial layer to and on a portion of a surface of the pedestal portion is formed, and the second sacrificial layer is formed by plating on the second seed layer.

4. The method for manufacturing the electric equipment, according to claim 2 , wherein
the second seed layer is removed together with the first sacrificial layer and the second sacrificial layer.

5. The production method according to claim 1 , further comprising:
before forming the second sacrificial layer, forming a resist pattern defining a plating region,
wherein the second sacrificial layer and the lower structure are formed by successive plating commonly using the resist pattern.

6. The method for manufacturing the electric equipment, according to claim 1 , wherein when the pedestal portion is formed by plating, a counter electrode structure is formed by plating in a region spaced apart from the pedestal portion by a predetermined distance, and further comprising:
thereafter removing unnecessary portion of the first seed layer.

7. The method for manufacturing the electric equipment, according to claim 6 , wherein
when the first seed layer is formed, forming an adhesion layer and a seed layer by sputtering on the substrate; and
when the unnecessary portion of the first seed layer is removed, masking a portion of a region between the pedestal portion and the counter electrode structure using a resist pattern, removing the first seed layer exposed and the adhesion layer below the first seed layer, and removing the resist pattern to expose a control electrode.

8. The method for manufacturing the electric equipment, according to claim 6 , the electric equipment having a variable capacitance, further comprising:
after forming the pedestal portion and the counter electrode structure by plating, forming an insulation film covering a region of the counter electrode structure facing the lower structure.

9. The method for manufacturing the electric equipment, according to claim 6 , the electric equipment having a switch, wherein the switch in which the lower structure faces the counter electrode structure via an air gap.

10. The method for manufacturing the electric equipment, according to claim 1 , wherein the lower structure of the third metal material is formed above the pedestal portion.

11. The method for manufacturing the electric equipment, according to claim 10 , wherein the lower structure forms a cantilever structure supported by the pedestal portion through the upper structure after removing the first and second sacrificial layers.

12. The method for manufacturing the electric equipment, according to claim 1 , wherein the lower structure of the third metal material is plated on the second sacrificial layer formed on the first sacrificial layer and the pedestal portion.

Assignees

• Fujitsu Ltd

Inventors

• Inoue Hiroaki
• Mi Xiaoyu

Classifications

• H01H1/0036 Primary

  Switches making use of microelectromechanical systems [MEMS] (for electromagnetic relays H01H50/005; for electrostatic relays H01H59/0009) · CPC title

• H01G5/16

  using variation of distance between electrodes · CPC title

• B81B3/0097

  Devices comprising flexible or deformable elements not provided for in groups B81B3/0002 - B81B3/0094 · CPC title

• B81B2203/0118

  Cantilevers · CPC title

• B81B2201/018

  Switches not provided for in B81B2201/014 - B81B2201/016 · CPC title