Thermal control

Patent metadata

Field	Value
Publication number	US-9766287-B2
Application number	US-201414520571-A
Country	US
Kind code	B2
Filing date	Oct 22, 2014
Priority date	Oct 22, 2014
Publication date	Sep 19, 2017
Grant date	Sep 19, 2017

Abstract

An example test system includes: a heating mechanism; a cooling mechanism; an instrument module having one or more interfaces to receive signals from a device under test (DUT), where the instrument module includes one or more electrical components to affect the signals, where the instrument module is between the heating mechanism and the cooling mechanism, and where the heating mechanism and the cooling mechanism are each configured to operate to maintain the instrument module within a target temperature range.

First claim

What is claimed is:

1. A test system comprising:
a heating mechanism;
a cooling mechanism; and
an instrument module comprising one or more interfaces to receive signals from a device under test (DUT), the DUT being external to the instrument module, the instrument module comprising one or more electrical components to affect the signals, the instrument module being between the heating mechanism and the cooling mechanism;
wherein the heating mechanism is configured to apply heat to a top surface of the instrument module, and the cooling mechanism is configured to cool a bottom surface of the instrument module, the heating mechanism and the cooling mechanism are configured to operate to maintain the instrument module within a target temperature range, and the top and bottom surfaces are relative to ground.

2. The test system of claim 1 , wherein the top surface and the bottom surface face in opposite directions, the heating mechanism being on a side of the top surface and the cooling mechanism being on a side of the bottom surface.

3. The test system of claim 1 , wherein the heating mechanism comprises a resistive heating mechanism, the resistive heating mechanism comprising conductive traces contained in the resistive heating mechanism to generate heat.

4. The test system of claim 3 , wherein the resistive heating mechanism comprises:
a heater containing the conductive traces; and
a gasket structure for holding the instrument module, the gasket structure being thermally-conductive and comprising one or more waveguides to conduct heat relative to the instrument module, the gasket structure being between the heater and part of the instrument module.

5. The test system of claim 1 , wherein the heating mechanism comprises a Peltier-based device.

6. The test system of claim 1 , wherein the cooling mechanism comprises a cooling plate, the cooling plate comprising one or more conduits containing liquid coolant.

7. The test system of claim 6 , wherein the cooling mechanism comprises one or more pedestals, each of the pedestals to provide a thermally-conductive path between the cooling plate and a corresponding electrical component on the instrument module to draw heat from the corresponding electrical component.

8. The test system of claim 6 , further comprising:
a gasket structure containing the one or more pedestals, the gasket structure being thermally conductive and holding the instrument module; and
a thermal interface material;
wherein the thermal interface material is between the cooling plate and the instrument module.

9. The test system of claim 6 , wherein the cooling mechanism comprises a Peltier-based device.

10. The test system of claim 1 , further comprising:
a temperature sensor to sense a temperature at the instrument module; and
a control system to control the heating mechanism based on the temperature sensed.

11. The test system of claim 10 , wherein the control system comprises a proportional-integral-derivative (PID) controller to drive the heating mechanism based on the temperature sensed, the PID controller performing pulse-width modulation (PWM) to drive the heating mechanism.

12. The test system of claim 10 , wherein the temperature sensor is a thermistor that is on the instrument module.

13. The test system of claim 1 , wherein the cooling mechanism comprises a cooling plate, the cooling plate comprising one or more conduits containing liquid coolant, and wherein the test system further comprises:
a temperature sensor to sense a temperature of the liquid coolant; and
a control system to control the temperature of the liquid coolant based on the temperature sensed.

14. The test system of claim 1 , wherein the cooling mechanism comprises a cooling plate, the cooling plate comprising one or more conduits containing liquid coolant, and wherein the test system further comprises:
a temperature sensor to sense a temperature at the instrument module;
a first control system to control the heating mechanism based on the temperature sensed; and
a second control system to control the a temperature of the liquid coolant based on the temperature sensed, the first and second control systems being separate control systems.

15. The test system of claim 1 , further comprising gasket structures creating an enclosure for holding the instrument module, the gasket structures providing shielding against electromagnetic radiation.

16. The test system of claim 1 , wherein the instrument module comprises a microwave instrument.

17. The test system of claim 1 , wherein the instrument module comprises one or more interfaces to exchange signals with one or more DUTs.

18. The test system of claim 1 , further comprising:
a thermistor to sense a temperature associated with the instrument module, the thermistor providing one or more signals representing an average source path temperature for the one or more electrical components; and
a proportional-integral-derivative (PID) controller to control the heating mechanism to a setpoint programmed into the PID controller based on the one or more signals.

19. The test system of claim 1 , wherein the top surface and the bottom surface face in different directions.

Assignees

• Teradyne Inc

Inventors

• Narasaki John Kenji
• Thompson Kevin A

Classifications

• H10W40/00

  Arrangements for thermal protection or thermal control (integrated devices comprising arrangements for thermal protection H10D89/60) · CPC title

• G01R31/2874 Primary

  related to temperature · CPC title

• H01L23/34

  Electricity · mapped topic