Polymer composition

Patent metadata

Field	Value
Publication number	US-9765218-B2
Application number	US-201414546438-A
Country	US
Kind code	B2
Filing date	Nov 18, 2014
Priority date	May 25, 2012
Publication date	Sep 19, 2017
Grant date	Sep 19, 2017

Abstract

The present invention provides a polymer composition having a low water absorption (i.e. being dampproof), excellent electrical insulation, high adhesion to various substrates, and excellent thermal stability. The present invention relates to a polymer composition comprising (A) a dimer acid-based polyamide and (B) an olefin-based-modified polymer, wherein the olefin-based-modified polymer (B) comprises a chemical structure derived from an olefin and a chemical structure derived from an amide.

First claim

The invention claimed is:

1. A polymer composition comprising:
50 to 90 wt % of (A) a dimer acid-based polyamide,
10 to 50 wt % of (B) an olefin-based polymer,
wherein the olefin-based polymer (B) is a grafted polymer produced by polymerizing an olefin, a (meth)acrylic acid ester and an acid anhydride, and grafting a polyamide on a copolymer thereby obtained, and
optionally additives selected from the group consisting of tackifier resin, antioxidant, UV absorber, wax, filler, plasticizer and combinations thereof, wherein the sum of (A) and (B) and additives equals 100 wt %.

2. A hot melt composition comprising the polymer composition as defined in claim 1 .

3. An electronic component comprising the hot melt composition as defined in claim 2 .

4. A polymer composition according to claim 1 , wherein the polyamide used to produce olefin-based polymer (B) is selected from polyamide 6, polyamide 11, polyamide 12 and combinations thereof.

5. A polymer composition according to claim 1 , wherein the acid anhydride comprises maleic anhydride.

6. A polymer composition according to claim 1 , wherein the dimer acid-based polyamide (A) is a polymer produced by a reaction of an acid component comprising the dimer acid with a diamine component.

7. A polymer composition according to claim 1 , wherein the olefin is ethylene, propylene or combinations thereof.

8. A polymer composition according to claim 1 , comprising 60-90 wt % of (A) dimer based polyamide and 10-40 wt % of (B) olefin based polymer and optionally additives, wherein the sum of (A) and (B) and additives equals 100 wt %.

9. A polymer composition according to claim 1 consisting of:
60-90 wt % of the (A) dimer acid-based polyamide and
10-40 wt % of the (B) olefin-based polymer.

10. A polymer composition according to claim 1 , consisting of:
50 to 90 wt % of the (A) a dimer acid-based polyamide,
10 to 50 wt % of the (B) an olefin-based polymer, and
optionally additives selected from the group consisting of antioxidant, UV absorber, wax, filler, plasticizer and combinations thereof,
wherein the sum of (A) and (B) and additives equals 100 wt %.

11. A polymer composition according to claim 1 , wherein the olefin-based polymer (B) comprises 50 to 95 wt % of olefin and 5 to 50 wt % of polyamide, each by weight of the olefin-based polymer (B).

12. A polymer composition according to claim 1 , wherein the olefin-based polymer (B) is a grafted polymer produced by polymerizing an alpha olefin homopolymer, a (meth)acrylic acid ester and an acid anhydride, and grafting a polyamide on a copolymer thereby obtained.

Assignees

• Henkel Ag & Co Kgaa

Inventors

• Isobe Yukio

Classifications

• C08L87/005

  Block or graft polymers not provided for in groups C08L1/00 - C08L85/04 · CPC title

• C08F255/02

  on to polymers of olefins having two or three carbon atoms · CPC title

• C09J177/08

  from polyamines and polymerised unsaturated fatty acids · CPC title

• C08L2203/206

  use in coating or encapsulating of electronic parts · CPC title

• C09J151/06

  grafted on to homopolymers or copolymers of aliphatic hydrocarbons containing only one carbon-to-carbon double bond · CPC title