Polymer microparticle-dispersed resin composition and method for producing same

US9765207B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9765207-B2
Application numberUS-201113997745-A
CountryUS
Kind codeB2
Filing dateDec 28, 2011
Priority dateJan 5, 2011
Publication dateSep 19, 2017
Grant dateSep 19, 2017

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  1. Title

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  2. Abstract

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  5. First independent claim

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Abstract

Official abstract text for this publication.

The present invention provides a means for improving the elastic modulus (rigidity), heat resistance, toughness, and impact resistance of a resin to provide these properties in a good balance. The present invention provides a polymer microparticle-dispersed resin composition containing 100 parts by weight of a resin and 0.1 to 150 parts by weight of polymer microparticles each containing at least two layers: a crosslinked polymer layer and a coating polymer layer, the resin composition having a particle dispersity of the polymer microparticles in the resin of not lower than 50%, the crosslinked polymer layer including 50% by weight to 99% by weight of at least one monomer having a Tg, as determined as a homopolymer, of not lower than 0° C., and 50% by weight to 1% by weight of at least one monomer having a Tg, as determined as a homopolymer, of lower than 0° C.

First claim

Opening claim text (preview).

The invention claimed is: 1. A polymer microparticle-dispersed resin composition, comprising: 100 parts by weight of a resin which is at least one selected from the group consisting of curable monomers, polymerizable monomers, curable oligomers and polymerizable oligomers; and 0.1 parts by weight to 150 parts by weight of polymer microparticles each comprising at least two layers including a crosslinked polymer layer and a coating polymer layer, the resin composition having a particle dispersity of the polymer microparticles in the resin of not lower than 50%, wherein the particle dispersity is determined by equation (1): Particle dispersity (%)=(1−( B 1 /B 0 ))×100  (equation 1) where B 0 is the number of unbound polymer microparticles and the number of aggregates consisting of two or more polymer microparticles in contact with each other in a sample under measurement, and B 1 is the number of aggregates consisting of two or more polymer microparticles in contact with each other, the crosslinked polymer layer comprising 65% by weight to 99% by weight of at least one monomer having a Tg, as determined as a homopolymer, of not lower than 80° C., and 35% by weight to 1% by weight of at least one monomer having a Tg, as determined as a homopolymer, of lower than 0° C., wherein the monomer having a Tg, as determined as a homopolymer, of lower than 0° C. forms an acrylic polymer rubber. 2. The polymer microparticle-dispersed resin composition according to claim 1 , wherein the crosslinked polymer layer comprises at least 2 layers comprising a first crosslinked polymer layer comprises at least a crosslinked polymer layer comprising not less than 60% by weight of the monomer having a Tg, as determined as a homopolymer, of not lower than 80° C., and a second crosslinked polymer layer comprising not less than 60% by weight of the monomer having a Tg, as determined as a homopolymer, of lower than 0° C., wherein the monomer having a Tg, as determined as a homopolymer, of lower than 0° C. forms an acrylic polymer rubber. 3. The polymer microparticle-dispersed resin composition according to claim 1 , wherein the coating polymer layer comprises a monomer containing a polymerizable or curable functional group, and the functional group is at least one selected from the group consisting of an epoxy group, an oxetane group, a hydroxyl group, a carbon-carbon double bond, an amino group, an imide group, a carboxylic acid group, a carboxylic acid anhydride group, a cyclic ester group, a cyclic amide group, a benzoxazine group, and a cyanate ester group. 4. The polymer microparticle-dispersed resin composition according to claim 1 , wherein the polymer microparticles have a number average particle size of 10 to 1000 nm. 5. The polymer microparticle-dispersed resin composition according to claim 1 , wherein the curable or polymerizable monomers or oligomers are organic compounds containing a polymerizable or curable functional group. 6. The polymer microparticle-dispersed resin composition according to claim 5 , wherein the functional group is at least one selected from the group consisting of an epoxy group, an oxetane group, a hydroxyl group, a carbon-carbon double bond, an amino group, an imide group, a carboxylic acid group, a carboxylic acid anhydride group, a cyclic ester group, a cyclic amide group, a benzoxazine group, and a cyanate ester group. 7. A method for preparing of the polymer microparticle-dispersed resin composition according to claim 1 , a first step of mixing an aqueous medium dispersion containing the polymer microparticles dispersed in an aqueous medium with an organic solvent having a water solubility at 20° C. of at least 5% by mass but not more than 40% by mass, and further mixing the mixture with excess water, thereby providing loose aggregates of the polymer microparticles; a second step of separating and recovering the aggregates of the polymer microparticles from the liquid phase, and mixing the aggregates with an organic solvent again, thereby providing a dispersion of the polymer microparticles; and a third step of mixing the dispersion of the polymer microparticles with a resin, and evaporating the organic solvent. 8. A prepreg, comprising: the polymer microparticle-dispersed resin composition according to claim 1 ; and reinforcing fibers. 9. A fiber reinforced composite material, comprising a resin and reinforcing fibers, the material being obtained by curing the polymer microparticle-dispersed resin composition according to claim 1 .

Assignees

Inventors

Classifications

  • Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs · CPC title

  • Characterised by the use of epoxy resins; Derivatives of epoxy resins · CPC title

  • C08L19/02Primary

    Latex · CPC title

  • C08J3/005Primary

    Processes for mixing polymers · CPC title

  • Latex (C08L9/04, C08L9/08 take precedence) · CPC title

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What does patent US9765207B2 cover?
The present invention provides a means for improving the elastic modulus (rigidity), heat resistance, toughness, and impact resistance of a resin to provide these properties in a good balance. The present invention provides a polymer microparticle-dispersed resin composition containing 100 parts by weight of a resin and 0.1 to 150 parts by weight of polymer microparticles each containing at lea…
Who is the assignee on this patent?
Furukawa Yoshio, Kaneka Corp
What technology area does this patent fall under?
Primary CPC classification C08L19/02. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Sep 19 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).