Polymer composition for microelectronic assembly

Patent metadata

Field	Value
Publication number	US-9765200-B2
Application number	US-201313965287-A
Country	US
Kind code	B2
Filing date	Aug 13, 2013
Priority date	Nov 23, 2010
Publication date	Sep 19, 2017
Grant date	Sep 19, 2017

Abstract

Embodiments in accordance with the present invention encompass polymer compositions that are useful in the assembly of microelectronic components onto a variety of substrate materials. Such polymer compositions providing for both holding the microelectronic components at desired positions on a substrate, providing fluxing for the solder bonding of such components to the substrate and remaining in place as an underfill for such components.

First claim

What is claimed is:

1. A polymer composition comprising:
a polycarbonate having repeating units derived from a diol monomer of formula A, B or C:

and
a diol monomer selected from the group consisting of:

wherein n is independently 0, 1 or 2;
each of R 1 , R 2 , R 3 and R 4 is independently selected from hydrogen or a hydrocarbyl group;
each of R 5 and R 6 are independently selected from —(CH 2 ) p —OH, where p is 0, 1, 2 or 3;
each of X and X′ is independently selected from —CH 2 —, —CH 2 —CH 2 — and —O—, where each X′ is, if present, oriented the same or opposite the orientation of X; and where said polycarbonate having a molecular weight (Mw) from 5,000 to 300,000;
a carrier solvent;
and
a fluxing agent; and wherein said polymer is thermally stable in the temperature range from about 200° C. to 260° C. and provides for holding a microelectronic component at a desired position on a substrate and remaining in place as an underfill.

2. The polymer composition of claim 1 , where p is 1, 2 or 3; and X and X′ are independently —CH 2 — or —CH 2 —CH 2 —.

3. The polymer composition of claim 1 , where p is 1; n is 0 or 1; and X is —CH 2 — or —CH 2 —CH 2 —; and X′, if present, is —CH 2 —.

4. The polymer composition of claim 1 where the fluxing agent is selected from formaldehyde, formic acid, 2-nitrobenzoic acid, malonic acid, citric acid, malic acid and succinic acid.

5. The polymer composition of claim 4 , where the fluxing agent is formic acid.

6. The polymer composition of claim 1 where the polycarbonate formed from diol monomers is one of a 1,3-polycyclohexyl carbonate or a poly(isosorbyl carbonate).

7. The polymer composition of claim 6 where formic acid comprises from 0.5 to 10.0 wt. % based on the total weight of the polymer.

8. The polymer composition of claim 1 where the polycarbonate further comprises repeating units derived from norbornane diol monomers, norbornane dimethanol monomers represented by Formulae D1, D1′, E1, E1′, F1 and F1′:

where R 7 and R 10 are independently selected from alkyl, cycloalkyl, heteroalkyl, heterocycloalkyl, aryl, heteroaryl and aralkyl.

9. The polymer composition of claim 1 where the diol monomer of formula III is 1,3-cyclohexanediol.

10. The polymer composition of claim 1 where the diol monomer of formula XII is isosorbide.

11. The polymer composition of claim 1 where the polymer is 15 to 80 wt % of the polymer composition.

12. The polymer composition of claim 1 where the carrier solvent is selected from cyclohexanone, cyclopentanone, diethylene glycol dimethyl ether, gamma-butyrolactone (GBL), N,N-dimethylacetamide, N,N-dimethylformamide, anisole, acetone, methyl 3-methoxypropionate, tetrahydrofuran (THF) and mixtures thereof.

13. The polymer composition of claim 12 , where the carrier solvent is GBL.

14. A method for forming a microelectronic component assembly comprising:
providing a first substrate having first contact regions disposed over a first surface;
providing a second substrate having second contact regions disposed over a second surface;
providing solder preforms disposed over one or more of the first contact regions or one or more of the second contact regions;
forming a layer of polymer film of the polymer composition of claim 1 overlying and encapsulating the solder preforms;
contacting the first surface of the first substrate to the second surface of the second substrate where the layer of polymer is disposed therebetween, the first contact regions are aligned with the second contact regions and where a preassembly structure is formed; and
heating the preassembly structure to a temperature effective to (1) cause the solder preforms to physically and electrically couple the one or more of the first contact regions to the one or more of the second contact regions and to (2) form a polymer underfill physically coupled to the first and second substrates.

15. The method of claim 14 where forming a layer of polymer overlying and encapsulating the solder preforms comprises forming such layer overlying an active surface of a microelectronic device having solder balls disposed on contact pads.

16. The method of claim 14 where said polymer composition comprises formic acid as the fluxing agent.

Assignees

• Promerus Llc

Inventors

• Apanius Christopher
• Bell Andrew
• Langsdorf Leah
• Tsang W C Peter

Classifications

• H10W74/47

  comprising organic materials, e.g. plastics or resins · CPC title

• H01L2924/0002

  Electricity · mapped topic

• H05K13/0046

  Electricity · mapped topic

• H01L2924/01322

  Electricity · mapped topic

• C08L69/00 Primary

  Compositions of polycarbonates; Compositions of derivatives of polycarbonates · CPC title