Three-dimension formation composition, method of manufacturing three-dimensional structure, and three-dimensional structure

US9765193B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9765193-B2
Application numberUS-201515112050-A
CountryUS
Kind codeB2
Filing dateJun 30, 2015
Priority dateJul 1, 2014
Publication dateSep 19, 2017
Grant dateSep 19, 2017

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

There are provided a method of manufacturing a three-dimensional structure, and three-dimension formation composition, by each which a three-dimensional structure can be manufactured with high dimensional accuracy, and provided a three-dimensional structure manufactured with high dimensional accuracy. There is provided a method of manufacturing a three-dimensional structure, in which the three-dimensional structure is manufactured by laminating a layer, the method including: forming the layer using a three-dimension formation composition containing particles, a binding resin, and a water-based solvent; removing the water-based solvent from the layer by heating the layer; and applying a binding solution containing a binder to the layer, in which the binding resin has an ammonium salt of a carboxyl group as a functional group.

First claim

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The invention claimed is: 1. A three-dimension formation composition, comprising: particles; a binding resin; and a water-based solvent, wherein the binding resin has an ammonium salt of a carboxyl group as a functional group, and the weight average molecular weight of the binding resin is 50000 to 200000. 2. The three-dimension formation composition according to claim 1 , wherein the binding resin contains one or two or more selected from the group consisting of a reaction product of an olefin-maleic anhydride copolymer with ammonia, a polyacrylic acid ammonium salt, an ammonium salt of carboxymethyl cellulose, a polystyrene carboxylic acid ammonium salt, an ammonium salt of an acrylamide-acrylic acid copolymer, and an alginic acid ammonium salt. 3. The three-dimension formation composition according to claim 1 , wherein the binding resin has a structure of acid anhydride which is formed by heating. 4. The three-dimension formation composition according to claim 1 , wherein the binding resin has a cyclic chemical structure which is formed by heating. 5. The three-dimension formation composition according to claim 4 , wherein the binding resin has a five-membered or six-membered cyclic structure which is formed by heating. 6. The three-dimension formation composition according to claim 1 , wherein the binding resin has an amide group (—CONH 2 ) together with the ammonium salt of a carboxyl group in a molecule. 7. The three-dimension formation composition according to claim 1 , further comprising: a compound having an amide group (—CONH 2 ) in addition to the binding resin. 8. The three-dimension formation composition according to claim 7 , wherein the compound having an amide group is polyacrylamide. 9. A method of manufacturing a three-dimensional structure, in which the three-dimensional structure is manufactured by laminating a layer, the method comprising: forming the layer using a three-dimension formation composition containing particles, a binding resin, and a water-based solvent; removing the water-based solvent from the layer by heating the layer; and applying a binding solution containing a binder to the layer, wherein the binding resin has an ammonium salt of a carboxyl group as a functional group. 10. The method of manufacturing a three-dimensional structure according to claim 9 , wherein, in the removing of the water-based solvent, the layer is heated to a temperature equal to or higher than the glass transition temperature of the binding resin. 11. The method of manufacturing a three-dimensional structure according to claim 9 , wherein, in the removing of the water-based solvent, the heating temperature is 30 degrees Celsius to 140 degrees Celsius. 12. The method of manufacturing a three-dimensional structure according to claim 9 , further comprising: removing the particles, which are not bound by the binder, after repeating the forming of the layer, the removing of the water-based solvent, and the applying of the binding solution, wherein the pH of a removing solution used in the removing of the unbound particles is 9 or more. 13. The method of manufacturing a three-dimensional structure according to claim 9 , further comprising: removing the particles, which are not bound by the binder, after repeating the forming of the layer, the removing of the water-based solvent, and the applying of the binding solution, wherein, in the removing of the unbound particles, ammonia is used. 14. A three-dimensional structure, which is manufactured by the method of manufacturing a three-dimensional structure according to claim 9 .

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Inventors

Classifications

  • Characterised by the use of natural rubber · CPC title

  • Silica · CPC title

  • Processes of additive manufacturing · CPC title

  • using liquids, e.g. solvents, swelling agents (spectacle cases, e.g. for cleaning contact lenses A45C11/04; disinfecting or sterilising contact lenses A61L12/00, using liquid substances A61L2/20; cleaning involving the use of liquid in general B08B3/00; for hydrating contact lenses B29D11/00067) · CPC title

  • Structures for supporting 3D objects during manufacture and intended to be sacrificed after completion thereof · CPC title

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What does patent US9765193B2 cover?
There are provided a method of manufacturing a three-dimensional structure, and three-dimension formation composition, by each which a three-dimensional structure can be manufactured with high dimensional accuracy, and provided a three-dimensional structure manufactured with high dimensional accuracy. There is provided a method of manufacturing a three-dimensional structure, in which the …
Who is the assignee on this patent?
Seiko Epson Corp
What technology area does this patent fall under?
Primary CPC classification C08J5/00. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Sep 19 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).