Modified phenolic resins and methods of making and using the same as reinforcing resins

US9765174B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9765174-B2
Application numberUS-201514710273-A
CountryUS
Kind codeB2
Filing dateMay 12, 2015
Priority dateMay 12, 2014
Publication dateSep 19, 2017
Grant dateSep 19, 2017

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  1. Title

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  2. Abstract

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  5. First independent claim

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

This invention relates to processes for preparing novolak resins and using the same as reinforcing resins. One process comprises reacting one or more alkylphenols with an aldehyde in the presence of a base to form a resole resin, wherein for each mole of alkylphenol at least 1.5 moles of aldehyde are reacted; and reacting the resole resin with one or more phenolic compounds in the presence of an acidic catalyst to form a novolac resin, wherein for each mole of alkylphenol at least 1.5 moles of the phenolic compounds are reacted. Another process comprises reacting one or more alkylphenols with an aldehyde in the presence of a base to form a resole resin, and reacting the resole resin with one or more phenolic compounds under an elevated temperature to form a novolac resin.

First claim

Opening claim text (preview).

What is claimed is: 1. A process for preparing a novolac resin, comprising: (a) reacting one or more alkylphenols having an alkyl group of 8-12 carbons with an aldehyde in the presence of a base to form a resole resin, wherein for each mole of alkylphenol at least 1.5 moles of aldehyde are reacted, and (b) reacting the resole resin with one or more phenolic compounds in the presence of an acidic catalyst to form a novolac resin, wherein for each mole of alkylphenol at least 1.5 moles of the phenolic compounds are reacted, wherein step (b) further comprises, after the step of reacting the resole resin with one or more phenolic compounds, adding additional aldehyde, wherein the novolac resin has a residual alkylphenol of less than 1% without being subjected to a distillation process. 2. The process of claim 1 , wherein at least one alkyl group in the alkylphenols is not C 8 . 3. The process of claim 1 , wherein one or more alkyl groups in the alkylphenols is C 8 or C 12 alkyl. 4. The process of claim 1 , wherein the phenolic compound is phenol. 5. The process of claim 4 , wherein the phenolic compound further comprises resorcinol. 6. The process of claim 5 , wherein the phenolic compound contains about 50-80 wt % phenol and about 20-50 wt % resorcinol. 7. The process of claim 1 , wherein the aldehyde is formaldehyde. 8. The process of claim 1 , wherein the step of reacting one or more alkylphenols with an aldehyde is conducted at a temperature ranging from 50 to 90° C. 9. The process of claim 1 , wherein the step of reacting the resole resin with one or more phenolic compounds is conducted at a temperature ranging from room temperature to 130° C. 10. A process for preparing a novolac resin, comprising: (a) reacting one or more alkylphenols having an alkyl group of 8-12 carbons with an aldehyde in the presence of a base to form a resole resin, wherein for each mole of alkylphenol at least 1.5 moles of aldehyde are reacted, (b) reacting the resole resin with one or more phenolic compounds at an elevated temperature to form a novolac resin, wherein for each mole of alkylphenol at least 1.5 moles of the phenolic compounds are reacted, wherein step (b) further comprises, after the step of reacting the resole resin with one or more phenolic compounds, neutralizing the resole resin with an acid and adding additional aldehyde, wherein the novolac resin has a residual alkylphenol of less than 1% without being subjected to a distillation process. 11. The process of claim 10 , wherein one or more alkyl groups in the alkylphenols is C 8 or C 12 alkyl. 12. The process of claim 10 , wherein the phenolic compound is phenol. 13. The process of claim 12 , wherein the phenolic compound further comprises resorcinol. 14. The process of claim 13 , wherein the phenolic compound contains about 50-80 wt % phenol and about 20-50 wt % resorcinol. 15. The process of claim 10 , wherein the aldehyde is formaldehyde. 16. The process of claim 10 , wherein the step of reacting one or more alkylphenols with an aldehyde is conducted at a temperature ranging from 50 to 90° C. 17. The process of claim 10 , wherein the step of reacting the resole resin with one or more phenolic compounds is conducted at a temperature ranging from 100° C. to 200° C. 18. The process of claim 1 , further comprising the step of subjecting the novolac resin to a distillation process. 19. The process of claim 10 , further comprising the step of subjecting the novolac resin to a distillation process.

Assignees

Inventors

Classifications

  • C08L15/00Primary

    Compositions of rubber derivatives (C08L11/00, C08L13/00 take precedence) · CPC title

  • C08G8/28Primary

    Chemically modified polycondensates · CPC title

  • Modified phenol-aldehyde condensates · CPC title

  • Compositions of unspecified rubbers · CPC title

  • C08G8/22Primary

    Resorcinol · CPC title

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What does patent US9765174B2 cover?
This invention relates to processes for preparing novolak resins and using the same as reinforcing resins. One process comprises reacting one or more alkylphenols with an aldehyde in the presence of a base to form a resole resin, wherein for each mole of alkylphenol at least 1.5 moles of aldehyde are reacted; and reacting the resole resin with one or more phenolic compounds in the presence of a…
Who is the assignee on this patent?
Si Group Inc
What technology area does this patent fall under?
Primary CPC classification C08L15/00. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Sep 19 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).