Copper/ceramic bonded body and insulating circuit substrate
US-2024203819-A1 · Jun 20, 2024 · US
US9764530B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9764530-B2 |
| Application number | US-201414250665-A |
| Country | US |
| Kind code | B2 |
| Filing date | Apr 11, 2014 |
| Priority date | Apr 12, 2013 |
| Publication date | Sep 19, 2017 |
| Grant date | Sep 19, 2017 |
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A configuration for joining a ceramic layer has a thermal insulating material to a metallic layer. The configuration includes an interface layer made of metallic material located between the ceramic layer and the metallic layer, which includes a plurality of interlocking elements on one of its sides, facing the ceramic layer, the ceramic layer comprising a plurality of cavities aimed at connecting with the corresponding interlocking elements of the interface layer. The configuration also includes a brazing layer by means of which the interface layer is joint to the metallic layer. The invention also refers to a method for obtaining such a configuration.
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The invention claimed is: 1. A method for obtaining a configuration for joining a ceramic layer including a thermal insulating material to a metallic layer using an interface layer made of metallic material, the interface layer being located between the ceramic layer and the metallic layer, and including a plurality of interlocking elements on a side that faces the ceramic layer, the plurality of interlocking elements being connectable to a plurality of cavities in the ceramic layer; the method comprising: joining the ceramic layer to the metallic layer by producing the interlocking elements in the metallic material interface layer through a laser metal forming process. 2. The method according to claim 1 , wherein the ceramic layer is manufactured with cavities comprising overhangs, the ceramic layer being further scanned with an optical device, such that a reference position of each one of the cavities together with an identification number corresponding to the number of the part is saved, after which an automated laser metal forming operation is performed, where a powder nozzle fed with powder and gas is positioned at the reference positions where the interlocking elements have to be located, the powder being locally molten with a focus laser beam, allowing the locally molten metallic powder to fill the cavities produced. 3. The method according to claim 2 , wherein the positioning of the powder nozzle is made with a robot or with a CNC (computer numerical control). 4. The method according to claim 1 , wherein, in a first step, a pulse laser machining operation is performed to create the cavities on the surface of the ceramic layer, a second step of automated laser metal forming operation being then performed, a powder nozzle fed with powder and gas being positioned at the reference positions where the interlocking elements have to be located, the powder being locally re-molten with a focus laser beam, allowing the locally molten metallic powder to fill the cavities produced. 5. The method according to claim 4 , wherein the pulse laser machining operation uses nanosecond pulses or picosecond pulses. 6. The method according to claim 1 , wherein the metallic filler material used in the laser metal forming process of the interface layer comprises high temperature Ni-based braze powders with high service temperature capability and good oxidation resistance, the Ni-based braze powders including braze alloys. 7. The method according to claim 1 , wherein a powder blend of high strength superalloy and high temperature braze material are used in the laser metal forming process of the interface layer. 8. The method according to claim 1 , wherein the ceramic layer interlocking with the interface layer are directly joined to the metallic layer, such that a defined offset between the two surfaces is ensured, with a super solidus brazing of the ceramic layer and the interface layer together with the metallic layer. 9. The method according to claim 1 , further comprising a closed loop control of the laser powder melting operation, such that a pyrometer is integrated into the laser powder nozzle, continuously measuring the temperature of the local melt pool. 10. The method according to claim 1 , wherein the ceramic layer is used as a starting preform for an additive manufacturing process, used to build the interface layer between the ceramic layer and the metallic layer by Selective Laser Melting (SLM) inside a work chamber with controlled atmosphere, such that the ceramic layer comprises the protruding metallic filler material shaping the interlocking elements.
Layered products essentially comprising ceramics, e.g. refractory products · CPC title
Build-up welding · CPC title
taking account of the properties of the material involved · CPC title
with interposition of special material to facilitate connection of the parts · CPC title
using optical means · CPC title
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