Serviceable electrical box thermal management

US9763360B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9763360-B2
Application numberUS-201514814585-A
CountryUS
Kind codeB2
Filing dateJul 31, 2015
Priority dateMay 3, 2010
Publication dateSep 12, 2017
Grant dateSep 12, 2017

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

An electrical assembly may include an enclosure having a base portion to attach the enclosure to a panel and a heat dissipating portion opposite the base portion, a circuit board having a first thermal interface on a first side of the board, a second thermal interface on a second side of the board, and a thermally conductive portion to provide enhanced thermal conduction between the first thermal interface and the second thermal interface, a power electronic device having a thermal interface coupled to the first thermal interface of the circuit board, a heat spreader arranged to transfer heat to the heat dissipating portion of the enclosure, and a thermally conductive pad coupled between the second thermal interface of the circuit board and the heat spreader.

First claim

Opening claim text (preview).

The invention claimed is: 1. A junction box system comprising: an enclosure having a base portion and a heat dissipating portion opposite the base portion; a circuit board positioned in the enclosure, the circuit board having a first side and a second side, the first side facing the heat dissipating portion of the enclosure, the circuit board having one or more thermally conductive pads extending away from its first side; an electrical insulating sheet positioned between the heat dissipating portion of the enclosure and the first side of the circuit board, where at least one thermally conductive pad extends through an opening in the sheet; and a thermally conductive plate, the plate in contact with at least one thermally conductive pad, spaced apart from the heat dissipating portion of the enclosure, and the plate positioned between the sheet and the heat dissipating portion of the enclosure, wherein the thermally conductive plate has two long sides, where one of the long sides faces away from the circuit board and is spaced apart from the heat dissipating portion of the enclosure with an air gap between this facing away long side and the heat dissipating portion of the enclosure. 2. The junction box system of claim 1 wherein the base portion comprises a plastic material and includes one or more openings for input and output. 3. The junction box system of claim 1 further comprising terminals to receive connections for the printed circuit board from outside the enclosure. 4. The junction box system of claim 1 wherein the enclosure is weather sealed and wherein the circuit board has a plurality of thermally conductive pads. 5. The junction box system of claim 1 wherein the heat dissipating portion is a top removably sealed against the base portion. 6. The junction box system of claim 1 wherein the one or more thermally conductive pads are attached to the circuit board at locations having through vias and solderpads that provide thermally conductive connections to power electronic devices on the second side of the circuit board. 7. The junction box system of claim 1 wherein the plate is not formed as part of the same component as the heat dissipating portion of the enclosure. 8. A junction box system comprising: an enclosure having a base portion and a heat dissipating removable cover, the cover secured to the base in a sealing manner; a circuit board positioned in the enclosure, the circuit board having a first side and a second side, the first side facing the cover of the enclosure, the circuit board having a plurality of thermally conductive pads extending away from its first side; and an electrical insulating sheet positioned between the cover of the enclosure and the first side of the circuit board, where at least one of the thermally conductive pads extends through an opening in the sheet, the electrically insulating sheet serving to insulate between the circuit board and a thermally conductive plate; the thermally conductive plate in contact with one or more of the thermally conductive pads, the plate spaced apart from the cover, and the plate positioned between the sheet and the cover. 9. The junction box system of claim 8 wherein the base portion and the cover comprise a plastic material and the base includes one or more openings for input and output. 10. The junction box system of claim 8 wherein the electrical insulating sheet and the thermally conductive plate have penetrations for securing them through the circuit board and to the base portion of the enclosure. 11. The junction box system of claim 8 further comprising terminals to receive connections for the printed circuit board from outside the enclosure. 12. The junction box system of claim 8 wherein the enclosure is weather sealed. 13. The junction box system of claim 8 wherein the cover is a rectangular shaped cover removably sealed against the base portion. 14. The junction box system of claim 8 wherein the thermally conductive pads are attached to the circuit board at locations having through vias and solderpads that provide thermally conductive connections to power electronic devices on the second side of the circuit board. 15. A junction box system comprising: an enclosure having a base portion and a heat dissipating portion opposite the base portion; a circuit board positioned in the enclosure, the circuit board having a first side and a second side, the first side facing the heat dissipating portion of the enclosure, the circuit board having one or more thermally conductive pads extending away from its first side; an electrical insulating sheet positioned between the heat dissipating portion of the enclosure and the first side of the circuit board, where at least one thermally conductive pad extends through an opening in the sheet; and a thermally conductive plate, the plate in contact with at least one thermally conductive pad, the plate spaced apart from the heat dissipating portion of the enclosure, and the plate positioned between the sheet and the heat dissipating portion of the enclosure, wherein the electrical insulating sheet and the thermally conductive plate have penetrations for securing them through the circuit board and to the base portion of the enclosure.

Assignees

Inventors

Classifications

  • Housings · CPC title

  • H02S40/345Primary

    with cooling means associated with the electrical connection means, e.g. cooling means associated with or applied to the junction box (cooling means for PV cells H10F77/63, for PV modules H02S40/42) · CPC title

  • Electrical details of casings, e.g. terminals, passages for cables or wiring · CPC title

  • Mechanical details of casings (covers, lids, hoods or members for covering apertures H05K5/03) · CPC title

  • characterised by the heat transfer by conduction from the heat generating element to a dissipating body (arrangements for increasing/decreasing heat-transfer, e.g. fins details, F28F13/00) · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US9763360B2 cover?
An electrical assembly may include an enclosure having a base portion to attach the enclosure to a panel and a heat dissipating portion opposite the base portion, a circuit board having a first thermal interface on a first side of the board, a second thermal interface on a second side of the board, and a thermally conductive portion to provide enhanced thermal conduction between the first therm…
Who is the assignee on this patent?
Sunpower Corp
What technology area does this patent fall under?
Primary CPC classification H02S40/345. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Sep 12 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).