Electrolytic capacitor retention device

Patent metadata

Field	Value
Publication number	US-9763328-B1
Application number	US-201615067439-A
Country	US
Kind code	B1
Filing date	Mar 11, 2016
Priority date	Mar 11, 2016
Publication date	Sep 12, 2017
Grant date	Sep 12, 2017

Abstract

A retention structure which provides both soldering and vibration stabilization of a capacitor as the capacitor is mounted to a printed circuit board (PCB) of an electronic module. An aperture is part of the PCB to stabilize and prevent the capacitor from rolling during manufacturing. Once secured to the PCB, Room Temperature Vulcanization (RTV), or similar adhesive bead, is placed onto a rigidizer or base plate (typically a casted or aluminum sheet plate). Once the capacitor is soldered in place and fixated on the PCB, the assembly is then placed onto the rigidizer such that the PCB is attached to the rigidizer using an adhesive, and the RTV bead contacts and is deformed by the capacitor, connecting the capacitor to the rigidizer to provide vibration stabilization support. The electronic module includes a cover, and optional dampening/constraint pads are attached to the cover of the electrolytic capacitor for additional vibration stabilization.

First claim

What is claimed is:

1. An apparatus, comprising:
an electronic module, including:
a capacitor;
at least one lead connected to the capacitor;
a printed circuit board, the capacitor connected to the printed circuit board with the at least one lead;
an aperture formed as part of the printed circuit board such that when capacitor is attached to the printed circuit board, at least a portion of the capacitor extends through the aperture;
a base plate; and
an adhesive disposed on the base plate;
a cavity formed as part of the base plate, wherein the adhesive is disposed in the cavity;

wherein the capacitor contacts the adhesive when the printed circuit board is attached to the base plate such that the adhesive connects the capacitor to the base plate and a portion of the capacitor extends into the cavity when the printed circuit board is connected to the base plate, such that the adhesive connects the capacitor to the base plate.

2. The apparatus of claim 1 , wherein the at least one lead further comprises:
a first lead connected to a first end of the capacitor; and
a second lead connected to a second end of the capacitor, the first lead and the second lead are connected to the printed circuit board.

3. The apparatus of claim 1 , wherein the capacitor, printed circuit board, and the base plate vibrate at substantially the same frequency.

4. The apparatus of claim 1 , wherein a width of the capacitor is greater than a width of the aperture.

5. The apparatus of claim 1 , further comprising: a cover; and a constraint pad connected to the cover; wherein the constraint pad contacts the capacitor when the cover is connected to the base plate, and the constraint pad applies force to the capacitor to support the capacitor.

6. The apparatus of claim 1 , further comprising:
a second adhesive disposed between the printed circuit board and the base plate;
wherein the printed circuit board is attached to the base plate using the second adhesive.

7. An electronic module having a retention structure for attaching a capacitor to a printed circuit board and a base plate, the electronic module comprising:
a capacitor having a first end and a second end;
a first lead connected to the first end of the capacitor;
a second lead connected to the second end of the capacitor;
a printed circuit board, the capacitor connected to the printed circuit board with the first lead and the second lead;
an aperture formed as part of the printed circuit board, the capacitor being attached to the printed circuit board such that at least a portion of the capacitor extends through the aperture;
a base plate;
a cavity formed as part of the base plate; and
an adhesive disposed in the cavity;
wherein the printed circuit board is attached to the base plate such that a portion of the capacitor extends into the cavity and contacts the adhesive, connecting the capacitor to the base plate.

8. The electronic module of claim 7 , wherein the aperture is in substantial alignment with the cavity.

9. The electronic module of claim 7 , wherein the capacitor, printed circuit board, and the base plate vibrate at substantially the same frequency.

10. The electronic module of claim 7 , further comprising:
a first edge formed as part of the aperture; and
a second edge formed as part of the aperture;
wherein a width of the capacitor is greater than a width of the aperture, and the capacitor is in contact with the first edge and the second edge when the capacitor is connected to the printed circuit board.

11. The electronic module of claim 7 , further comprising: a cover; and a constraint pad connected to the cover; wherein the constraint pad contacts the capacitor when the cover is connected to the base plate, and the constraint pad applies force to the capacitor to support the capacitor.

12. The electronic module of claim 7 , further comprising:
a second adhesive disposed between the printed circuit board and the base plate;
wherein the printed circuit board is attached to the base plate using the second adhesive.

13. A method for mounting a capacitor in an electronic module according claim 7 , comprising the steps of:
providing a capacitor;
providing a printed circuit board;
providing at least one lead;
providing an aperture formed as part of the printed circuit board;
providing a base plate; and
providing an adhesive;
placing the adhesive on the base plate;
connecting the capacitor to the printed circuit board using the at least one lead, such that at least a portion of the capacitor extends through the aperture;
connecting the printed circuit board to the base plate such that the capacitor contacts the adhesive, and the adhesive connects the capacitor to the base plate.

14. The method for mounting a capacitor in an electronic module of claim 13 , further comprising the steps of: providing a first lead, the at least one lead including the first lead; and providing a second lead, the at least one lead including the second lead; connecting the capacitor to the printed circuit board using the first lead and the second lead.

15. The method for mounting a capacitor in an electronic module of claim 13 , further comprising the steps of: providing a cavity formed as part of the base plate; placing the adhesive in the cavity such that when the printed circuit board is connected to the base plate, the aperture is positioned such that at least a portion of the capacitor extends into the cavity.

16. The method for mounting a capacitor in an electronic module of claim 13 , further comprising the steps of providing the capacitor, the printed circuit board, and the base plate to vibrate at substantially the same frequency.

17. The method for mounting a capacitor in an electronic module of claim 13 , further comprising the steps of providing the width of the capacitor to be greater than the width of the aperture.

18. The method for mounting a capacitor in an electronic module of claim 13 , further comprising the steps of: providing a cover; and
providing a constraint pad connected to the cover;
connecting the cover to the base plate such that constraint pad contacts and applies force to the capacitor, and the constraint pad supports the capacitor.

19. The method for mounting a capacitor in an electronic module of claim 13 , further comprising the steps of: providing a second adhesive disposed between the printed circuit board and the base plate; connecting the printed circuit board to the base plate using the second adhesive.

Assignees

• Continental automotive systems inc

Inventors

• Zito Donald J
• Currier David Wayne
• Meny Keith A
• Martinez Hernandez Leobardo
• Dalbke Russ
• Lechowicz Peter

Classifications

• H01G9/08

  Housing; Encapsulation · CPC title

• H01G9/008

  Terminals · CPC title

• H01G9/06

  Mounting in containers · CPC title

• H05K1/184

  associated with components inserted in holes through the PCBs and wherein terminals of the components are connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes · CPC title

• H05K2201/10015

  Non-printed capacitor · CPC title