Methods of attaching components on fabrics using metal braids

US9763326B1 · US · B1

Patent metadata
FieldValue
Publication numberUS-9763326-B1
Application numberUS-201414304029-A
CountryUS
Kind codeB1
Filing dateJun 13, 2014
Priority dateDec 9, 2013
Publication dateSep 12, 2017
Grant dateSep 12, 2017

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An electronics assembly includes one or more electronic components coupled to a fabric. Each electronic component includes one or more electrical connection points, such as a bond pad or solder bump. The electronics assembly also includes one or more electrically conductive wire braids, one electrically conductive wire braid coupled to one electrical connection point on an electronic component. The electrically conductive wire braid is stitched to the fabric by an electrically conductive wire, thereby providing an electrical connection between the electronic component and the electrically conductive wire via the electrically conductive wire braid.

First claim

Opening claim text (preview).

What is claimed is: 1. An electronics assembly comprising: a. a fabric; b. an electronic component comprising first and second electrical connection points; c. first and second electrically conductive wire braids, the first electrically conductive wire braid coupled to and in contact with the first electrical connection point of the electronic component and positioned between the fabric and the first electrical connection point, wherein a first direct electrical connection is formed between the first electrically conductive wire braid and the first electrical connection point, and the second electrically conductive wire braid coupled to and in contact with the second electrical connection point of the electronic component and positioned between the fabric and the second electrical connection point, wherein a second direct electrical connection is formed between the second electrically conductive wire braid and the second electrical connection point; d. first and second electrically conductive wires stitched to the fabric and to the respective first and second electrically conductive wire braids such that a first electrical connection is formed between the first electrically conductive wire and the first electrically conductive wire braid, wherein the first electrically conductive wire is stitched to the fabric and to the first electrically conductive wire braid without the first electrically conductive wire physically contacting the electronic component and the first electrical connection point and such that a second electrical connection is formed between the second electrically conductive wire and the second electrically conductive wire braid, wherein the second electrically conductive wire is stitched to the fabric and to the second electrically conductive wire braid without the second electrically conductive wire physically contacting the electronic component and the second electrical connection point; e. wherein each of the first and second electrically conductive wires comprises two separate wires, wherein the two separate wires comprise a metal wire and an insulation wire; f. wherein the fabric comprises an insulated wire including an inner metal magnet wire and an outer insulation layer; and g. wherein the first electrically conductive wire is electrically coupled to the inner metal magnet wire of the insulated wire. 2. The electronics assembly of claim 1 wherein each of the first and second electrical connection points comprises a bond pad physically contacting the electronic component. 3. The electronics assembly of claim 1 wherein each of the first and second electrical connection points comprises a solder bump physically contacting the electronic component. 4. The electronics assembly of claim 1 wherein each of the first and second electrical connection points is coupled to the respective first and second electrically conductive wire braids via a solder joint, a welded joint or an electrically conductive adhesive. 5. The electronics assembly of claim 1 wherein each of the first and second electrically conductive wire braids is coupled to the fabric using an adhesive. 6. The electronics assembly of claim 1 wherein each of the first and second electrically conductive wire braids is coupled to the fabric using respective first and second stitched non-electrically conductive threads. 7. The electronics assembly of claim 1 wherein each of the first and second electrically conductive wire braids is coupled to the fabric using respective first and second electrically conductive threads stitched to the fabric and to the respective first and second electrically conductive wire braids. 8. The electronics assembly of claim 1 wherein each of the first and second electrically conductive wire braids comprises a plurality of electrically conductive wires. 9. The electronics assembly of claim 8 wherein each of the plurality of electrically conductive wires comprise a metal wire made of one or more of copper, silver, nickel and their alloys. 10. The electronics assembly of claim 8 wherein each of the plurality of electrically conductive wires comprise an electrically conductive plating finish. 11. The electronics assembly of claim 8 wherein each of the plurality of electrically conductive wires comprise an electrically conductive polymer. 12. The electronics assembly of claim 1 wherein each of the first and second electrically conductive wire braids comprises a plurality of electrically conductive wires braided together. 13. The electronics assembly of claim 1 further comprising an encapsulation layer coupled to the electronics component, the first and second electrically conductive wire braids and the first and second electrically conductive wires. 14. The electronics assembly of claim 1 wherein the electronics assembly is wearable. 15. The electronics assembly of claim 1 wherein each of the first and second electrically conductive wire braids comprises a first end coupled to and in contact with the respective first and second electrical connection points of the electronic component and a second end that is stitched to the fabric using the respective first and second electrically conductive wires, further wherein the first end is further coupled to the fabric. 16. The electronics assembly of claim 1 wherein each of the first and second electrical connection points is located within a footprint of the electronic component. 17. A method of making an electronics assembly, the method comprising: a. attaching a first electrical connection point of an electronic component in contact with a first electrically conductive wire braid, thereby forming a direct first electrical connection between the first electrically conductive wire braid and the first electrical connection point, and attaching a second electrical connection point of the electronic component in contact with a second electrically conductive wire braid, thereby forming a direct second electrical connection between the second electrically conductive wire braid and the second electrical connection point; b. attaching the first and second electrically conductive wire braids to a fabric, wherein the first electrically conductive wire braid is positioned between the fabric and the first electrical connection point, and the second electrically conductive wire braid is positioned between the fabric and the second electrical connection point; d. stitching a first electrically conductive wire to the fabric and to the first electrically conductive wire braid such that a first electrical connection is formed between the first electrically conductive wire and the first electrically conductive wire braid, wherein the first electrically conductive wire is stitched to the fabric and to the first electrically conductive wire braid without the first electrically conductive wire physically contacting the electronic component and the first electrical connection point, and stitching a second electrically conductive wire to the fabric and to the second electrically conductive wire braid such that a second electrical connection is formed between the second electrically conductive wire and the second electrically conductive wire braid, wherein the second electrically conductive wire is stitched to the fabric and to the second electrically conductive wire braid without the second electrically conductive wire physically contacting the electronic component and the second electrical connection point; and e. wherein each of the first and second electrically conductive wires comprises two separate wires, the two separate wires comprise a metal wir

Assignees

Inventors

Classifications

  • Special orientation of pads, lands or terminals of component, e.g. radial or polygonal orientation · CPC title

  • with embedded cable or connector · CPC title

  • H05K1/111Primary

    Pads for surface mounting, e.g. lay-out · CPC title

  • H05K1/038Primary

    Textiles (used as reinforcing materials for organic insulating substrates H05K1/0366) · CPC title

  • Assembling printed circuits with electric components, e.g. with resistors · CPC title

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Frequently asked questions

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What does patent US9763326B1 cover?
An electronics assembly includes one or more electronic components coupled to a fabric. Each electronic component includes one or more electrical connection points, such as a bond pad or solder bump. The electronics assembly also includes one or more electrically conductive wire braids, one electrically conductive wire braid coupled to one electrical connection point on an electronic component.…
Who is the assignee on this patent?
Flextronics Ap Llc
What technology area does this patent fall under?
Primary CPC classification H05K1/111. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Sep 12 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 6 related publications on this page (citations in our corpus or others sharing the same primary CPC).