Method and apparatus for providing a ground and a heat transfer interface on a printed circuit board

Patent metadata

Field	Value
Publication number	US-9763317-B2
Application number	US-201313803828-A
Country	US
Kind code	B2
Filing date	Mar 14, 2013
Priority date	Mar 14, 2013
Publication date	Sep 12, 2017
Grant date	Sep 12, 2017

Abstract

In one embodiment, a printed circuit board (PCB) assembly includes a PCB, the PCB being arranged to define a through-hole therein, the through-hole having a surface, wherein the PCB includes a top surface and a bottom surface. The PCB assembly also includes a slug arrangement and a surface mount component. The slug arrangement is formed from an electrically and thermally conductive material and includes at least a first portion and a second portion. At least a part of the first portion is positioned in the through-hole, and the second portion is coupled to the bottom surface. The surface mount component is positioned over the through-hole and the top surface, and has a first surface configured to contact the first portion.

First claim

What is claimed is:

1. A method comprising:
obtaining a printed circuit board (PCB), the PCB including a top surface and a bottom surface, wherein the PCB has an opening defined therein;
obtaining a slug arrangement, the slug arrangement being formed from an electrically and thermally conductive material, the slug arrangement including at least a first portion and a second portion,
coupling the slug arrangement to the PCB, wherein coupling the slug arrangement to the PCB includes positioning at least a section of the first portion within the opening, adjusting the slug arrangement to compensate for a variation in the thickness of the PCB, and creating a first solder interface between the first portion and the PCB; and
coupling a surface mount element to the slug arrangement, the surface mount element having a first surface, wherein coupling the surface mount element to the slug arrangement includes creating a second solder interface between the first surface and the first portion.

2. The method of claim 1 wherein coupling the slug arrangement to the PCB further includes creating a third solder interface between the second portion and the bottom surface.

3. The method of claim 1 wherein coupling the slug arrangement to the PCB further includes creating a third solder interface between the second portion and the PCB.

4. The method of claim 1 further including:
mechanically coupling the PCB to the slug arrangement.

5. The method of claim 1 wherein the surface mount element is a radio frequency (RF) power amplifier, the first surface being a ground paddle of the RF amplifier, the method further including positioning the ground paddle over the opening, and wherein creating the second solder interface between the first surface and the first portion includes creating the second solder interface between the ground paddle and an upper surface of the first portion.

6. The method of claim 1 wherein the electrically and thermally conductive material is one selected from a group including copper, aluminum, and copper-plated aluminum.

7. The method of claim 1 wherein the slug arrangement further includes a third portion, the third portion being coupled to the bottom surface with an adhesive material.

8. The method of claim 1 wherein the opening is a plated through-hole.

9. The method of claim 1 wherein the thermally conductive material is a plastic substrate.

10. The method of claim 1 wherein the thermally conductive material is a metal substrate.

11. A method comprising:
obtaining a printed circuit board (PCB), the PCB including a top surface and a bottom surface, wherein the PCB has a through-hole defined therein;
obtaining a slug arrangement, the slug arrangement being formed from an electrically and thermally conductive material, the slug arrangement including at least a first portion and a second portion, the first portion being a cap portion and the second portion being a plate portion;
coupling the slug arrangement to the PCB, wherein coupling the slug arrangement to the PCB includes positioning at least a section of the first portion within the through-hole and creating a first solder interface between the first portion and the PCB;
coupling a surface mount element to the slug arrangement, the surface mount element having a ground paddle, wherein coupling the surface mount element to the slug arrangement includes creating a second solder interface between the ground paddle and the first portion;
causing the slug arrangement to contact a thermally conductive material arranged to absorb heat transferred from the surface mount element through the slug arrangement, wherein causing the slug arrangement to contact the thermally conductive material includes causing the plate portion to contact the thermally conductive material; and
mechanically fastening the slug arrangement to the PCB, wherein mechanically fastening the slug arrangement to the PCB includes using at least one screw to mechanically couple the slug arrangement to the PCB.

12. A method comprising:
obtaining a printed circuit board (PCB), the PCB including a top surface and a bottom surface, wherein the PCB has a through-hole defined therein;
obtaining a slug arrangement, the slug arrangement being formed from an electrically and thermally conductive material, the slug arrangement including at least a first portion and a second portion, wherein the slug arrangement further includes a vertical compensation element;
coupling the slug arrangement to the PCB, wherein coupling the slug arrangement to the PCB includes positioning at least a section of the first portion within the through-hole and creating a first solder interface between the first portion and the PCB;
coupling a surface mount element to the slug arrangement, the surface mount element having a ground paddle, wherein coupling the surface mount element to the slug arrangement includes creating a second solder interface between the ground paddle and the first portion;
causing the slug arrangement to contact a thermally conductive material arranged to absorb heat transferred from the surface mount element through the slug arrangement; and
adjusting the slug arrangement using the vertical compensation element to compensate for a variation in the thickness of the PCB.

13. The method of claim 1 further including coupling the slug arrangement to a thermally conductive material arranged to absorb heat transferred through the slug arrangement.

14. The method of claim 1 wherein the slug arrangement includes a vertical compensation element, and adjusting the slug arrangement to compensate for the variation in the thickness of the PCB includes adjusting the vertical compensation element.

Assignees

• Cisco Tech Inc

Inventors

• Mass James A
• Artman David Lynn
• Frank Timothy A

Classifications

• H05K1/0243

  Printed circuits associated with mounted high frequency components · CPC title

• B23K2101/36

  Electric or electronic devices · CPC title

• H05K2201/10416

  Metallic blocks or heatsinks completely inserted in a PCB · CPC title

• H05K1/0204 Primary

  using means for thermal conduction connection in the thickness direction of the substrate (H05K1/0207 takes precedence) · CPC title

• B23K1/0016

  Soldering of electronic components · CPC title