Common mode filter and manufacturing method thereof

Patent metadata

Field	Value
Publication number	US-9762201-B2
Application number	US-201514716849-A
Country	US
Kind code	B2
Filing date	May 19, 2015
Priority date	May 19, 2014
Publication date	Sep 12, 2017
Grant date	Sep 12, 2017

Abstract

Disclosed are a common mode filter and a manufacturing method thereof. The common mode filter in accordance with an aspect of the present invention includes: a substrate; a filter layer including a coil and a dielectric layer and disposed on the substrate and configured to remove a signal noise; and a magnetic layer being laminated on the filter layer, and a surface of the filter layer being joined with the magnetic layer can be formed to be flat by having the coil embedded in a surface of the filter layer being joined with the magnetic layer in such a way that one surface of the coil is exposed.

First claim

What is claimed is:

1. A common mode filter comprising:
a substrate;
a filter layer comprising a coil and a dielectric layer, the filter layer being disposed on the substrate and configured to remove a signal noise; and
a magnetic layer laminated on a surface of the filter layer,
wherein the coil is embedded in the surface of the filter layer on which the magnetic layer is laminated so that one surface of the coil is exposed, and
wherein the exposed one surface of the coil is depressed below the surface of the filter layer on which the magnetic layer is laminated.

2. The common mode filter of claim 1 , wherein both the filter layer and the exposed one surface of the coil are in contact with the magnetic layer.

3. The common mode filter of claim 1 , wherein the magnetic layer is made of a composite material sheet containing a magnetic substance.

4. The common mode filter of claim 3 , wherein the composite material sheet is composed of an epoxy resin and the magnetic substance is ferrite powder dispersed in the epoxy resin.

5. A method of manufacturing a common mode filter, the method comprising:
forming a coil on one surface of a core;
forming a filter layer by laminating a dielectric layer on the one surface of the core so that the dielectric layer covers the coil;
removing the core from the filter layer;
removing a portion of the coil exposed at a surface of the filter layer from which the core was removed so that an exposed surface of the coil is depressed below the surface of the filter layer from which the core was removed;
laminating a magnetic layer on the surface of the filter layer from which the core was removed; and
joining a substrate to a surface of the filter layer on an opposite side of the filter layer from the surface of the filter layer from which the core was removed.

6. The method of claim 5 , wherein the magnetic layer is made of a composite material sheet containing a magnetic substance.

Assignees

• Samsung Electro Mech

Inventors

• Park Seung-Wook
• Sim Won-Chul
• Lee Hong-Ryul

Classifications

• H01F27/2804

  Printed windings · CPC title

• H03H2001/0085

  Multilayer, e.g. LTCC, HTCC, green sheets · CPC title

• H01F41/041

  Printed circuit coils (apparatus or processes for manufacturing printed circuits in general H05K3/00) · CPC title

• H03H3/013

  for obtaining desired frequency or temperature coefficient ({H03H3/0076} H03H3/04, H03H3/10 take precedence) · CPC title

• Y10T156/10

  Methods of surface bonding and/or assembly therefor · CPC title