High density connector assembly
US-2021159619-A1 · May 27, 2021 · US
US9762200B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9762200-B2 |
| Application number | US-201514959846-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 4, 2015 |
| Priority date | Jul 15, 2008 |
| Publication date | Sep 12, 2017 |
| Grant date | Sep 12, 2017 |
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Systems and devices for providing differential input/output communication with a superconducting device are described. Each differential I/O communication is electrically filtered using a respective tubular filter structure incorporating superconducting lumped element devices and high frequency dissipation by metal powder epoxy. A plurality of such tubular filter structures is arranged in a cryogenic, multi-tiered assembly further including structural/thermalization supports and a device sample holder assembly for securing a device sample, for example a superconducting quantum processor. The interface between the cryogenic tubular filter assembly and room temperature electronics is achieved using hermetically sealed vacuum feed-through structures designed to receive flexible printed circuit board cable.
Opening claim text (preview).
We claim: 1. A method of fabricating an electrical filter device for use with differential signals, the method comprising: winding a first portion of a first length of continuous conductive wire about a first region of a dielectric substrate to form a first coil of conductive wire; winding a second portion of the first length of continuous conductive wire about a second region of the dielectric substrate to form a second coil of conductive wire; winding a first portion of a se…
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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