Optical module

Patent metadata

Field	Value
Publication number	US-9762026-B2
Application number	US-201615240022-A
Country	US
Kind code	B2
Filing date	Aug 18, 2016
Priority date	Aug 21, 2015
Publication date	Sep 12, 2017
Grant date	Sep 12, 2017

Abstract

An optical module includes a semiconductor optical device in which an active layer located at one side, an electrode located at the same side, and a mirror that reflects light toward the side opposite the electrode are monolithically integrated, a sub-mount having one surface on which a first wiring pattern is formed, a substrate in which an optical waveguide and a grating coupler are formed in a surface layer of the substrate, a spacer having an upper surface on which a second wiring pattern is formed, and a wire. The sub-mount is mounted on the spacer. The first wiring pattern on the sub-mount faces part of the second wiring pattern on the spacer and is electrically connected thereto. The second wiring pattern on the spacer includes a pad being disposed in a region exposed from the sub-mount and being bonded to the wire.

First claim

What is claimed is:

1. An optical module comprising:
a semiconductor optical device in which an active layer so located as to be disposed at one side in a thickness direction, an electrode located at the same side where the active layer is located, and a mirror that reflects light having exited out of the active layer toward a side opposite the electrode are monolithically integrated with one another, the semiconductor optical device configured to cause the light to exit through the side opposite the electrode;
a sub-mount having a first wiring pattern formed on one surface thereof and on which the semiconductor optical device is surface mounted such that the electrode faces the first wiring pattern;
a substrate in which an optical waveguide and a grating coupler for introducing the light into the optical waveguide are formed in a surface layer of the substrate;
a spacer so mounted on the substrate apart from the grating coupler, having an upper surface on a side opposite the substrate, and having a second wiring pattern formed on the upper surface; and
a wire,
wherein the sub-mount is mounted on the spacer,
the first wiring pattern on the sub-mount faces part of the second wiring pattern on the spacer and is electrically connected thereto, and
the second wiring pattern on the spacer includes a pad being disposed in a region exposed from the sub-mount and being bonded to the wire.

2. The optical module according to claim 1 ,
wherein the sub-mount has an electrically conductive layer only on the surface on which the first wiring pattern is formed, and
the spacer has an electrically conductive layer only on the upper surface on which the second wiring pattern is formed.

3. The optical module according to claim 1 ,
wherein the spacer has a hole that passes through a lower surface facing the substrate and the upper surface, and
the semiconductor optical device is disposed in a space surrounded by an inner surface of the hole.

4. The optical module according to claim 3 ,
wherein the spacer has a shape that seamlessly surrounds the semiconductor optical device.

5. The optical module according to claim 1 ,
further comprising a temperature adjuster mounted on a surface of the sub-mount, the surface being opposite the surface on which the first wiring pattern is formed.

6. The optical module according to claim 5 ,
wherein the temperature adjuster is mounted on the sub-mount and in an area that overlies the spacer.

7. The optical module according to claim 1 ,
wherein a lens that focuses the light is further monolithically integrated with the semiconductor optical device.

8. The optical module according to claim 1 ,
further comprising an isolator that is disposed between the semiconductor optical device and the substrate and prevents return light.

9. The optical module according to claim 1 ,
further comprising a lens substrate which is disposed between the substrate and the spacer and on which a lens that focuses the light is formed.

Assignees

• Oclaro Japan Inc

Inventors

• Tamura Kohichi Robert
• Suzuki Takanori
• Akashi Mitsuo
• Tanaka Shigehisa
• Inoue Hiroaki
• Sasaki Hiroyasu

Classifications

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• H10W72/536

  the connected ends being ball-shaped · CPC title

• G02B6/34 Primary

  utilising prism or grating {(G02B6/293 takes precedence)} · CPC title

• G02B6/4271

  with thermo electric cooling · CPC title

• H01S5/0064

  Anti-reflection components, e.g. optical isolators · CPC title