Wireless communication device

Patent metadata

Field	Value
Publication number	US-9761923-B2
Application number	US-201313795367-A
Country	US
Kind code	B2
Filing date	Mar 12, 2013
Priority date	Jan 5, 2011
Publication date	Sep 12, 2017
Grant date	Sep 12, 2017

Abstract

A compact wireless communication includes a first radiating element and a second radiating element, which define and function as a dipole antenna, a feeder circuit including a wireless IC chip coupled with the first and second radiating elements, and a feeder substrate that is provided with the wireless IC chip. The first radiating element is provided to the feeder substrate. The second radiating element is provided to a substrate other than the feeder substrate.

First claim

What is claimed is:

1. A wireless communication device comprising:
a first radiating element and a second radiating element, which define and function as a dipole antenna;
a feeder circuit including first and second input/output electrodes, the first input/output electrode being connected with the first radiating element, and the second input/output electrode being connected with the second radiating element; and
a first substrate that is provided with the feeder circuit; wherein
the first radiating element is provided on a first surface on or in the first substrate;
the second radiating element is provided on a second surface on or in a second substrate which is separate and distinct from the first substrate;
the first surface and the second surface are different surfaces from one another; and
a communication path between the first input/output electrode and the first radiating element is different from a communication path between the second input/output electrode and the second radiating element.

2. The wireless communication device according to claim 1 , wherein a matching circuit provided on or in the first substrate is connected between the feeder circuit and the second radiating element.

3. The wireless communication device according to claim 1 , wherein the first substrate is a multilayer substrate, the first radiating element includes a coil pattern, and at least a portion of the coil pattern is built into the multilayer substrate.

4. The wireless communication device according to claim 1 , wherein the feeder circuit includes a wireless integrated circuit chip that processes a high-frequency signal.

5. The wireless communication device according to claim 1 , wherein the first and second radiating elements and the feeder circuit are connected with each other by any of magnetic field coupling, capacitive coupling, electric field coupling, electromagnetic field coupling and direct current coupling.

6. The wireless communication device according to claim 1 , wherein the first radiating element is built into the first substrate, the second substrate is a printed wiring board, and the second radiating element is located on the printed wiring board.

7. The wireless communication device according to claim 6 , wherein the first substrate is mounted on the second radiating element and the first substrate is connected to the second radiating element only via a feeder terminal.

8. The wireless communication device according to claim 1 , wherein the feeder circuit includes a wireless integrated circuit chip including the first and second input/output electrodes, the first input/output electrode is connected to the first radiating element and the second input/output electrode is connected to the second radiating element via a matching circuit.

9. The wireless communication device according to claim 8 , wherein the matching circuit includes first and second inductors and a capacitor, the first input/output electrode is connected to a connection point between the first inductor and the first radiating element, and the second input/output electrode is connected to a connection point between the first inductor and a parallel resonance circuit of the matching circuit.

10. The wireless communication device according to claim 8 , wherein the matching circuit includes a first series resonance circuit including a first inductor and a first capacitor and a second series resonance circuit including a second inductor and a second capacitor, and a third inductor is arranged to connect the first series resonance circuit and the second series resonance circuit.

11. The wireless communication device according to claim 10 , wherein the first and second inductors are wound in opposite directions and are electromagnetically coupled with each other.

12. The wireless communication device according to claim 7 , wherein the feeder terminal is built into the first substrate and another surface of the first substrate is fixed to the second radiating element so as to couple the feeder terminal and the second radiating element with each other through a capacitor.

13. The wireless communication device according to claim 7 , wherein the feeder terminal is provided at a lowermost layer of the first substrate.

14. The wireless communication device according to claim 4 , wherein the wireless integrated circuit chip is located at a center portion of the first substrate.

15. The wireless communication device according to claim 2 , wherein the first substrate includes a plurality of layers, the first radiating element is located in a top portion of the first substrate, and the matching circuit is located in a bottom portion of the first circuit.

16. The wireless communication device according to claim 1 , wherein a size of the second radiating element is larger than a size of the first radiating element.

17. A wireless communication device comprising:
a first radiating element and a second radiating element, which define and function as a dipole antenna;
a feeder circuit including first and second input/output electrodes, the first input/output electrode being connected with the first radiating element, and the second input/output electrode being connected with the second radiating element; and
a first substrate that is provided with the feeder circuit; wherein
the first radiating element is provided on a first surface on or in the first substrate;
the second radiating element is provided on a second surface on or in a second substrate which is separate and distinct from the first substrate;
the first surface and the second surface are different surfaces from one another; and
the first input/output electrode transmits and receives signals only from the first radiating element and the second input/output electrode transmits and receives signals only from the second radiating element.

Assignees

• Murata Manufacturing Co

Inventors

• Kimura Ikuhei
• Ikemoto Nobuo

Classifications

• G06K19/07784

  the inductive antenna consisting of a plurality of coils stacked on top of one another · CPC title

• H01Q9/16

  with feed intermediate between the extremities of the antenna, e.g. centre-fed dipole (H01Q9/44 takes precedence) · CPC title

• G06K19/07794

  the record carrier comprising a booster or auxiliary antenna in addition to the antenna connected directly to the integrated circuit · CPC title

• H01Q1/2225 Primary

  used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal · CPC title

• G06K19/07786

  the antenna being of the HF type, such as a dipole · CPC title