Plate stack for a cooling device in installation devices

US9761392B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9761392-B2
Application numberUS-201414772412-A
CountryUS
Kind codeB2
Filing dateMar 6, 2014
Priority dateMar 6, 2013
Publication dateSep 12, 2017
Grant dateSep 12, 2017

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A plate stack in a cooling device for hot gases generated in electric installation devices, preferably in low-voltage power switches. The plate stack is arranged in the flow path of the hot switching gases into a window, the plate stack having identical plates made of a material with a high heat conductivity. Each of the plates is provided with spacer elements which correspond to the spacing of the plates, and the plates are arranged in the stack such that the orientation of the plates changes one after the other.

First claim

Opening claim text (preview).

The invention claimed is: 1. A plate stack, arranged in a switching gas cooling apparatus of an electrical switching device, the plate stack comprising: identical plates comprising a metallic material having high heat conductivity, the plates being stacked with a uniform plate spacing, wherein the plates have spacer elements formed thereon corresponding to the plate spacing and wherein a height of each individual spacer element defines an entire vent height between the plates, wherein the plates are arranged in the stack such that their orientation changes successively, wherein the spacer elements are in the form of deepened stampings in a planar surface of each plate, and wherein the spacer elements are arranged radially asymmetrically on each plate 180° about one of a) an axis that is perpendicular to the planar surface of the plate and b) an axis that is parallel to the planar surface. 2. The plate stack of claim 1 , wherein the plates comprise steel or copper. 3. The plate stack of claim 2 , wherein the spacer elements are shaped as knobs, cones, truncated cones, cylinders, or webs. 4. The plate stack of claim 3 , wherein the spacer elements are formed only on one surface of the plates. 5. The plate stack of claim 4 , wherein the spacer elements are formed in the surface of the plates and/or on an edge of one or more of the plates. 6. The plate stack of claim 4 , wherein the spacer elements are formed in the surface of one or more of the plates. 7. The plate stack of claim 6 , wherein the spacer elements are formed on the edge of one or more of the plates. 8. The plate stack of claim 4 , wherein the spacer elements are formed on the edge of one or more of the plates. 9. The plate stack of claim 2 , wherein the plates further comprise a heat conductive ceramic. 10. The plate stack of claim 1 , wherein the spacer elements are shaped as knobs, cones, truncated cones, cylinders, or webs. 11. The plate stack of claim 1 , further comprising: a sealing element on an edge of at least one of the plates, and wherein the sealing element is formed integrally with the plate. 12. The plate stack of claim 11 , wherein the sealing element is formed as a deepened stamping. 13. The plate stack of claim 11 wherein a height of the sealing element is greater than a size of the plate spacing. 14. The plate stack of claim 1 , wherein dimensions and quantity of the plates are adapted to a window in the switching gas cooling apparatus. 15. The plate stack of claim 1 , wherein the plates comprise steel. 16. The plate stack of claim 1 , wherein the plates comprise copper.

Assignees

Inventors

Classifications

  • Ventilating; Cooling; Heating (for operating electrothermal relays H01H61/013) · CPC title

  • Cooling of switch parts (cooling of contacts H01H1/62) · CPC title

  • Metal parts · CPC title

  • H01H33/10Primary

    Metal parts · CPC title

  • H01H9/342Primary

    Venting arrangements for arc chutes · CPC title

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What does patent US9761392B2 cover?
A plate stack in a cooling device for hot gases generated in electric installation devices, preferably in low-voltage power switches. The plate stack is arranged in the flow path of the hot switching gases into a window, the plate stack having identical plates made of a material with a high heat conductivity. Each of the plates is provided with spacer elements which correspond to the spacing of…
Who is the assignee on this patent?
Eaton Electrical Ip Gmbh & Co
What technology area does this patent fall under?
Primary CPC classification H01H33/10. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Sep 12 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).