Joining dissimilar materials using an epoxy resin composition

Patent metadata

Field	Value
Publication number	US-9761374-B2
Application number	US-201615343468-A
Country	US
Kind code	B2
Filing date	Nov 4, 2016
Priority date	Nov 8, 2013
Publication date	Sep 12, 2017
Grant date	Sep 12, 2017

Abstract

An epoxy resin composition is disclosed for joining dissimilar materials. The identified epoxy resin compositions can fee used to seal metallic and non-metallic components of a capacitor. Specifically the epoxy resin composition can be applied to joints between a non-metallic capacitor bushing and a metallic tank cover and metallic terminal cap. Once the epoxy resin composition is cored, it can provide a seal that can withstand the stresses and environmental conditions to which a capacitor is subjected.

First claim

What is claimed is:

1. A capacitor tank comprising:
an insulating hushing comprising substantially glass, ceramic, polymer, or glazed material;
a metallic tank cover;
a casing attached to the metallic tank cover, the casing to contain a fluid comprising one or more aromatic compounds; and
a cured seal between the insulating bushing and the metallic tank cover,
wherein the cured seal comprises an epoxy resin composition,
wherein the epoxy resin composition comprises a curing agent and one or both of a phenol novolac epoxy and a bisphenol A epoxy, and
wherein the cured seal is exposed to the fluid comprising one or more aromatic compounds when the capacitor tank is completely assembled.

2. The capacitor tank of claim 1 , wherein the curing agent is an amine-containing hardener.

3. The capacitor tank of claim 1 , wherein the curing agent is cyanamide or dicyandiamide.

4. The capacitor tank of claim 1 , wherein the epoxy resin composition comprises a polymer content of at least about 50% polymer content.

5. The capacitor tank of claim 1 , wherein the one or more aromatic compounds are selected from the group consisting of diaryl ethanes, diaryl methanes, triaryl methanes, triaryl ethanes, biphenyls, monoaromatics and naphthalenes.

6. The capacitor tank of claim 1 , wherein the epoxy resin composition is cured by heating the epoxy resin composition to between about 80° C. to about 160° C. and holding the epoxy resin composition between about 80° C. to about 160° C. for about 30 minutes to about 120 minutes, or by induction heating for about 1 to about 10 minutes.

7. The capacitor tank of claim 1 , wherein the cured seal is hermetic.

8. The capacitor tank of claim 1 , wherein the cured seal resists breakage after 2000 hours of exposure to one or more of salt spray, ultraviolet light, and 100% relative humidity.

9. The capacitor tank of claim 1 , wherein the hardness of the seal decreases less than 2% after 120 days in the fluid comprising one or more aromatic compounds.

10. The capacitor tank of claim 1 , wherein the epoxy resin composition comprises a two-part system wherein a first part comprises an epoxy and a second part comprises a curing agent.

11. A capacitor tank comprising:
an insulating bushing;
a metallic tank cover;
a casing attached to the metallic tank cover, the casing to contain a dielectric fluid; and
a cured seal between the insulating bushing and the metallic tank cover,
wherein the cured seal comprises an epoxy resin composition,
wherein the epoxy resin composition comprises a curing agent and one or both of a phenol novolac epoxy and a bisphenol A epoxy, and
wherein the cured seal is exposed to the dielectric fluid when the capacitor tank is completely assembled.

12. The capacitor tank of claim 11 , wherein the curing agent is an amine-containing hardener.

13. The capacitor tank of claim 11 , wherein the curing agent is cyanamide or dicyandiamide.

14. The capacitor tank of claim 11 , wherein the epoxy resin composition comprises a polymer content of at least about 50% polymer content.

15. The capacitor tank of claim 11 , wherein the dielectric fluid comprises one or more aromatic compounds that are selected from the group consisting of diaryl ethanes, diaryl methanes, triaryl methanes, triaryl ethanes, biphenyls, monoaromatics and naphthalenes.

16. The capacitor tank of claim 11 , wherein the epoxy resin composition is cured by heating the epoxy resin composition to between about 80° C. to about 160° C. and holding the epoxy resin composition between about 80° C. to about 160° C. for about 30 minutes to about 120 minutes, or by induction heating for about 1 to about 10 minutes.

17. The capacitor tank of claim 11 , wherein the cured seal is hermetic.

18. The capacitor tank of claim 11 , wherein the cured seal resists breakage after 2000 hours of exposure to one or more of salt spray, ultraviolet light, and 100% relative humidity.

19. The capacitor tank of claim 11 , wherein the hardness of the seal decreases less than 2% after 120 days in the dielectric fluid.

20. The capacitor tank of claim 11 , wherein the epoxy resin composition, comprises a two-part system wherein a first part comprises an epoxy and a second part comprises a curing agent.

Assignees

• Cooper Technologies Co

Inventors

• Li Chao
• Rigby Stephen John
• Fellers Clay Lynwood
• Mason Marco James
• Azar Saboura Rokhsair

Classifications

• B32B37/12 Primary

  characterised by using adhesives · CPC title

• C08J5/124

  using adhesives based on a macromolecular component · CPC title

• H01G4/224 Primary

  Housing; Encapsulation · CPC title

• B32B7/12

  using interposed adhesives or interposed materials with bonding properties · CPC title

• B32B9/041

  of metal · CPC title