Dual purpose press-bar and heat sink for high data transfer integrated circuit card reader

US9760742B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9760742-B2
Application numberUS-201514752626-A
CountryUS
Kind codeB2
Filing dateJun 26, 2015
Priority dateJun 26, 2015
Publication dateSep 12, 2017
Grant dateSep 12, 2017

How to read this patent

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Various embodiments provide a dual purpose press-bar and heat sink for an integrated circuit card (ICC) reader. The dual purpose press-bar and heat sink provides two functions. First, the dual purpose press-bar and heat sink conducts and dissipates internal heat generated by a high data transfer ICC inserted in to the ICC reader. Second, the dual purpose press-bar and heat sink ensures that contact pads of the high data transfer ICC create reliable electrical connections with ICC contacts of the ICC reader. As such, the dual purpose press-bar and heat sink simultaneously dissipates heat from a high data transfer ICC and ensures that a high data transfer ICC maintains proper electrical connections with ICC contacts of an ICC reader.

First claim

Opening claim text (preview).

The invention claimed is: 1. A card reader device, comprising: a support member; a plurality of card contacts coupled to and extending from the support member, each of the plurality of card contacts being in electrical contact with a contact pad on a first surface of a card; a circuit board in electrical contact with the card contacts, the plurality of card contacts being coupled to the circuit board by the support member; and an encasing member including: first and second side portions, the support member being positioned between the first and second side portions; mounting members extending from the first and second side portions and towards the circuit board, the mounting members mounting the encasing member to the circuit board; an elevated portion directly attached to the first and second side portions, the elevated portion substantially covering the support member and the plurality of card contacts, the elevated portion being spaced from a second surface, opposite to the first surface, of the card; first and second engaging portions directly attached to the first and second side portions, respectively, the first and second engaging portions affixing the encasing member to the support member, the support member being sandwiched between the elevated portion and the first and second engaging portions; a heat sink overlaying the plurality of card contacts, the heat sink projecting from the elevated portion towards the support member and the plurality of card contacts, the heat sink being in physical contact with the second surface of the card; first and second openings in the elevated portion, the first opening being positioned lateral to a first side of the heat sink, the second opening being positioned lateral to a second side, opposite to the first side, of the heat sink; and first and second plurality of air flow apertures in the elevated portion, the first plurality of air flow apertures being positioned lateral to a third side of the heat sink, the second plurality of air flow apertures being positioned lateral to a fourth side, opposite to the third side, of the heat sink, the first side portion being spaced from the third side of the heat sink by the first plurality of air flow apertures, the second side portion being spaced from the fourth side of the heat sink by the second plurality of air flow apertures, the first and second openings and the first and second plurality of air flow apertures exposing the second surface of the card to provide an air flow channel that flows between the first and second plurality of air flow apertures, adjacent to the heat sink, and on the second surface of the card. 2. The card reader device of claim 1 , wherein the encasing member and the heat sink are metal, and the support member is plastic. 3. The card reader device of claim 1 , wherein the encasing member includes retention clips in physical contact with the second surface of the card and exert a force on the second surface of the card. 4. The card reader device of claim 1 , wherein the encasing member includes a first rib and a second rib, the first rib and the second rib projecting from the elevated portion towards the support member, the first rib and the second rib being in physical contact with the second surface of the card, the heat sink being positioned between the first rib and the second rib. 5. The card reader device of claim 1 , wherein the heat sink includes a first face and a second face opposite of the first face, the second face being in physical contact with the second surface of the card. 6. The card reader device of claim 5 , wherein the heat sink further includes four sides, the four sides each being physically coupled to the encasing member. 7. The card reader device of claim 1 , wherein the support member includes holding portions configured to guide the card. 8. A card reader device, comprising: a support member; a plurality of card contacts, each of the plurality of card contacts configured to make electrical connections with a circuit board and a contact pad on a first surface of a card, the plurality of card contacts being held secure to the circuit board by the support member; and an encasing member including: first and second side portions, the support member being positioned between the first and second side portions; mounting members extending from the first and second side portions to the circuit board, the mounting members configured to mount the encasing member to the circuit board; an elevated portion directly attached to the first and second side portions, the elevated portion substantially covering the support member and the plurality of card contacts, the elevated portion configured to be spaced from a second surface, opposite to the first surface, of the card; first and second engaging portions directly attached to the first and second side portions, respectively, the first and second engaging portions affixing the encasing member to the support member, the first and second engaging portions being spaced from the elevated portion by the support member; a heat sink overlaying the plurality of card contacts, the heat sink projecting from the elevated portion towards the support member and the plurality of card contacts, the heat sink including a face and four sides, the face configured to make physical contact with a second surface of the card, the four sides each being physically coupled to the elevated portion; first and second openings in the elevated portion, the first opening being positioned lateral to a first side of the four sides, the second opening being positioned lateral to a second side, opposite to the first side, of the four sides; and first and second plurality of air flow apertures in the elevated portion, the first plurality of air flow apertures being positioned lateral to a third side of the four sides, the second plurality of air flow apertures being positioned lateral to a fourth side, opposite to the third side, of the four sides, the first side portion being spaced from the third side of the heat sink by the first plurality of air flow apertures, the second side portion being spaced from the fourth side of the heat sink by the second plurality of air flow apertures, the first and second openings and the first and second plurality of air flow apertures exposing the second surface of the card to provide an air flow channel that flows between the first and second plurality of air flow apertures, adjacent to the heat sink, and on the second surface of the card. 9. The card reader device of claim 8 , wherein the encasing member and the heat sink are metal, and the support member is plastic. 10. The card reader device of claim 8 , wherein the encasing member includes retention clips configured to make physical contact with the second surface of the card and exert a force on the second surface of the card. 11. The card reader device of claim 8 , wherein the encasing member includes a first rib and a second rib, the first rib and the second rib projecting from the elevated portion towards the support member, the first rib and the second rib configured to make physical contact with the second surface of the card, the heat sink being positioned between the first rib and the second rib. 12. A card reader device, comprising: a support member; a plurality of card contacts, each of the plurality of card contacts configured to make electrical connections with a circuit board and a contact pad on a first surface of a card, the plurality of card contacts being held secure to the circuit board by the support member; and an encasing member overlying the support member and the plurality of card contacts, the encasing membe

Assignees

Inventors

Classifications

  • External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings · CPC title

  • Heatsink mounted on the surface of the printed circuit board [PCB] · CPC title

  • for reading/sensing record carriers having surface contacts · CPC title

  • G06K7/0056Primary

    housing of the card connector · CPC title

  • means for pressing the connector contacts in the direction of the card contacts to assure trustworthy electrical connection between card and connector · CPC title

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Frequently asked questions

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What does patent US9760742B2 cover?
Various embodiments provide a dual purpose press-bar and heat sink for an integrated circuit card (ICC) reader. The dual purpose press-bar and heat sink provides two functions. First, the dual purpose press-bar and heat sink conducts and dissipates internal heat generated by a high data transfer ICC inserted in to the ICC reader. Second, the dual purpose press-bar and heat sink ensures that con…
Who is the assignee on this patent?
Echostar Technologies Llc
What technology area does this patent fall under?
Primary CPC classification G06K7/0056. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Sep 12 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).