Method and apparatus for attaching chip to a textile

Patent metadata

Field	Value
Publication number	US-9758907-B2
Application number	US-28444008-A
Country	US
Kind code	B2
Filing date	Sep 22, 2008
Priority date	Sep 22, 2008
Publication date	Sep 12, 2017
Grant date	Sep 12, 2017

Abstract

Embodiments disclosed herein provide approaches for attaching scan control and other electronic chips to textiles, e.g., on a loom as part of a real-time manufacturing process.

First claim

What is claimed is:

1. An apparatus, comprising:
a first chip package portion of a chip package to be mounted to a textile, said first chip package portion having a connector with a first set of pads having gaps between the pads and a second set of pads to overlap the gaps of the first set of pads, in which the first chip package portion is to be mounted to a second chip package portion from an opposite side of the textile.

2. The apparatus of claim 1 , in which the first and second sets of pads include more pads than are to be coupled to wires in the textile.

3. The apparatus of claim 1 , in which the first chip package portion comprises a switch circuit to route selected ones of the first and second groups of pads to signal nodes.

4. The apparatus of claim 3 , in which the first chip package portion comprises a supply reference detect circuit to provide supply references from the first and second groups of pads.

5. The apparatus of claim 1 , in which the first set of pads are leading edge pads.

6. The apparatus of claim 1 , in which the first chip package portion comprises access ports for cutting wires to be mounted to the pads.

7. The apparatus of claim 1 , in which the first chip package and the second chip package portion are to be initially mechanically joined followed by a more secure joining.

8. An apparatus, comprising:
an electronic module package to mount to a textile, the electronic module package having first and second chip package portions, the first chip package portion having redundant pads for connection to wires in the textile, in which the first chip package portion and the second chip package portion mount to one another from opposite sides of the textile.

9. The apparatus of claim 8 , in which the redundant pads comprise a first group of aligned pads and a second group of aligned pads, wherein at least some of the pads in the second group overlap gaps between at least some of the pads in the first group.

Assignees

• Graumann David
• Bruneau David
• Intel Corp

Inventors

• Graumann David
• Bruneau David

Classifications

• D10B2503/04

  Floor or wall coverings; Carpets · CPC title

• D03D1/0088

  Fabrics having an electronic function · CPC title

• D10B2401/16

  antistatic; conductive · CPC title

• D10B2505/08

  Upholstery, mattresses · CPC title

• H05K2201/10977

  Encapsulated connections · CPC title