Preferably oriented nanotwinned Au film, method of preparing the same, and bonding structure comprising the same

Patent metadata

Field	Value
Publication number	US-9758886-B2
Application number	US-201514641614-A
Country	US
Kind code	B2
Filing date	Mar 9, 2015
Priority date	Aug 14, 2014
Publication date	Sep 12, 2017
Grant date	Sep 12, 2017

Abstract

The present invention is related to a preferably oriented nanotwinned Au film, a method of preparing the same, and a bonding structure comprising the same. The nanotwinned Au film has a thickness direction. The nanotwinned Au film is stacked along a [220] crystallographic axis orientation in the thickness direction. At least 50% by volume of the nanotwinned Au film is composed of a plurality of nanotwinned Au grains which are adjacent to each other, arranged in a direction perpendicular to the thickness direction, and stacked along a [111] crystallographic axis orientation.

First claim

What is claimed is:

1. A preferably oriented nanotwinned Au film stacked along a [220] crystallographic axis orientation in a thickness direction of the film;
wherein at least 50% by volume of the nanotwinned Au film is composed of a plurality of nanotwinned Au grains which are adjacent to each other, arranged in a direction perpendicular to the thickness direction, and stacked along a [111] crystallographic axis orientation.

2. The preferably oriented nanotwinned Au film of claim 1 , wherein the nanotwinned Au film has a thickness of 0.05-1000 μm.

3. The preferably oriented nanotwinned Au film of claim 1 , wherein the nanotwinned Au grains have a short axis of 1-200 nm in length.

4. The preferably oriented nanotwinned Au film of claim 1 , wherein at least 50% of the area of any cross-section perpendicular to the thickness direction of the nanotwinned Au film is a [220] crystallographic plane.

5. A bonding structure having a preferably oriented nanotwinned Au film, comprising: a first substrate having a first Au film; and a second substrate having a second Au film; wherein at least one of the first Au film and the second Au film is the preferably oriented nanotwinned Au film of claim 1 , and the first Au film and the second Au film are connected to each other and have a bonding interface.

6. The bonding structure of claim 5 , wherein each of the first Au film and the second Au film has a thickness of 0.05-1000 μm.

7. The bonding structure of claim 5 , wherein each of the first substrate and the second substrate is from the group consisting of: a semiconductor chip, a circuit board, a conductive substrate, and a variety of electronic components.

Assignees

• Univ Nat Chiao Tung

Inventors

• Chen Chih
• Chiu Wei-Lan
• Chou Yi-Chia

Classifications

• B32B15/018

  one layer being formed of a noble metal or a noble metal alloy · CPC title

• C25D5/50

  by heat-treatment · CPC title

• C25D3/48 Primary

  of gold · CPC title

• C25D21/10

  Agitating of electrolytes; Moving of racks · CPC title

• C22C5/02

  Alloys based on gold · CPC title