Curable resin composition, cured product thereof, and semiconductor device using the same

Patent metadata

Field	Value
Publication number	US-9758694-B2
Application number	US-201615006796-A
Country	US
Kind code	B2
Filing date	Jan 26, 2016
Priority date	Jan 26, 2015
Publication date	Sep 12, 2017
Grant date	Sep 12, 2017

Abstract

According to one aspect of the present invention, there is provided a curable resin composition including at least: a polysiloxane compound having, in a molecule thereof, at least two functional groups selected from the group consisting of silanol groups and alkoxysilyl groups as a component (A-1); and silica whose extract water has a pH of 6.1 or lower at 25° C. as a component (B), wherein the amount of the component (B) relative to the total amount of the components (A-1) and (B) is in a range of 70 to 97 mass %. This curable resin composition is able to, even when formed into various shapes and sizes, prevent foaming during curing and thus is suitable as an encapsulant material for a semiconductor element.

First claim

What is claimed is:

1. A curable resin composition comprising at least:
component (A-1): a polysiloxane compound having, in a molecule thereof, at least two functional groups selected from the group consisting of silanol groups and alkoxysilyl groups; and
component (B): silica whose extract water has a pH of 6.1 or lower at 25° C., the extract water being obtained by stirring 10 g of the silica in 200 ml of purified water at 80±3° C. for 1 hour to provide a sample liquid, and then, cooling the sample liquid to room temperature, wherein
the amount of the component (B) relative to the total amount of the components (A-1) and (B) is in a range of 70 to 97 mass %; and
the total amount of silanol and alkoxysilyl groups in the component (A-1) is in a range of 1 to 15 mmol/g.

2. The curable resin composition according to claim 1 , wherein the polysiloxane compound contained as the component (A-1) has at least a structural unit of the general formula [1]
[R 1 m SiO n/2 ]  [1]

where R 1 each independently represents a hydrogen atom, a C 1 -C 10 linear alkyl group, a C 3 -C 10 branched alkyl group, a C 3 -C 10 cyclic alkyl group, a C 2 -C 10 linear alkenyl group, a C 3 -C 10 branched alkenyl group, a C 3 -C 10 cyclic alkenyl group or a C 5 -C 10 aryl group; a part or all of hydrogen atoms of the alkyl group, the alkenyl group or the aryl group may be substituted by a halogen atom; a part of carbon atoms of the alkyl group, the alkenyl group or the aryl group may be replaced by at least one kind selected from the group consisting of a nitrogen atom, an oxygen atom and a silicon atom; the halogen atom is at least one kind selected from the group consisting of a fluorine atom, a chlorine atom, a bromine atom and an iodine atom; when there are a plurality of R 1 , R 1 can be of the same kind or different kinds; an oxygen atom of the structural unit of the general formula [1] is a siloxane bond-forming oxygen atom or a hydroxyl oxygen atom; and m and n each independently represent an integer of 1 to 4 and satisfy a relationship of m+n=4.

3. The curable resin composition according to claim 2 , wherein R 1 is a C 1 -C 10 linear alkyl group, a C 3 -C 10 branched alkyl group, a C 3 -C 10 cyclic alkyl group or a C 5 -C 10 aryl group.

4. The curable resin composition according to claim 2 , wherein R 1 is a methyl group or a phenyl group.

5. The curable resin composition according to claim 2 , wherein the polysiloxane compound contained as the component (A-1) has the structural unit of the general formula [1] and a structural unit of the general formula [2]
[SiO 4/2 ]  [2]

where an oxygen atom of the structural unit of the general formula [2] is a siloxane bond-forming oxygen atom or a hydroxyl oxygen atom.

6. The curable resin composition according to claim 1 , wherein the component (B) contains two or more kinds of silica.

7. The curable resin composition according to claim 6 , wherein the two or more kinds of silica are selected from the group consisting of crystalline silica, natural fused silica, synthetic fused silica, deflagration silica, fumed silica, sol-gel silica, flame fused silica and precipitated silica.

8. The curable resin composition according to claim 1 , wherein the silica contained as the component (B) has a median particle size of 0.02 to 500 μm.

9. The curable resin composition according to claim 1 , wherein the silica contained as the component (B) shows a plurality of frequency peaks in particle size distribution analysis.

10. The curable resin composition according to claim 1 , wherein the silica contained as the component (B) includes silica particles having a particle size of 3 μm or smaller.

11. The curable resin composition according to claim 1 , wherein the silica contained as the component (B) is chemically unmodified.

12. The curable resin composition according to claim 1 , further comprising at least one kind selected from the group consisting of an inorganic filler, a heat-resistant resin, a mold release agent, a pigment, a flame retardant, a curing catalyst and an anti-blocking agent.

13. The curable resin composition according to claim 12 , further comprising a coupling agent.

14. The curable resin composition according to claim 1 , wherein the curable resin composition has a spiral flow length of 5 to 180 cm as determined according to Japan Electrical Insulating and Advanced Performance Materials Industrial Association Standard T901 under the conditions of a temperature of 180° C., a molding pressure of 6.9 MPa and a molding time of 3 minutes.

15. A method for preparing the curable resin composition according to claim 1 , comprising mixing the component (A-1) with the component (B) such that the amount of the component (B) relative to the total amount of the component (A-1) and the component (B) is in a range of 70 to 97 mass %.

16. The method for preparing the curable resin composition according to claim 15 , wherein the curable resin composition is prepared by mixing the component (A-1), the component (B) and at least one kind selected from the group consisting of an inorganic filler, a heat-resistant resin, a mold release agent, a pigment, a flame retardant, a curing catalyst and an anti-blocking agent.

17. The method for preparing the curable resin composition according to claim 15 , wherein the curable resin composition is prepared by mixing the component (A-1), the component (B), at least one kind selected from the group consisting of an inorganic filler, a heat-resistant resin, a mold release agent, a pigment, a flame retardant, a curing catalyst and an anti-blocking agent, and a coupling agent.

18. A tableted product of the curable resin composition according to claim 1 .

19. A cured product of the curable resin composition according to claim 1 .

20. The cured product according to claim 19 , wherein the cured product has a thickness of 1 mm or greater.

21. The cured product according to claim 19 , wherein the cured product has a thickness of 2 mm or greater.

22. The cured product according to claim 19 , wherein the cured product has a thickness of 4 mm or greater.

23. A semiconductor device comprising:
a cured product of a curable resin composition; and
at least a semiconductor element that is encapsulated by the cured product, the curable resin composition comprising at least:
component (A-1): a polysiloxane compound having, in a molecule thereof, at least two functional groups selected from the group consisting of silanol groups and alkoxysilyl groups; and
component (B): silica whose extract water has a pH of 6.1 or lower at 25° C., the extract water being obtained by stirring 10 g of the silica in 200 ml of purified water at 80±3° C. for 1 hour to provide a sample liquid, and then, cooling the sample liquid to room temperature, wherein
the amount of the component (B) relative to the total amount of the components (A-1) and (B) is in a range of 70 to 97 mass %.

24. The semiconductor device according to claim 23 , wherein the semiconductor element is a power semiconductor element.

25. A method of encapsulating a semiconductor element, comprising:
curing a curable resin composition, the curable resin composition comprising at least:
component (A-1): a polysiloxane compound having, in a molecule thereof, at least two functional groups selected from the group consisting of silanol groups and alkoxysilyl groups; and
component (B): silica whose extract w

Assignees

• Central Glass Co Ltd

Inventors

• Oda Masafumi
• Nakatsuji Junya
• Sugita Yutaka
• Ogawa Tsuyoshi

Classifications

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W74/114

  by a substrate and the encapsulations · CPC title

• H10W70/465

  Bumps or wires · CPC title