Method of manufacturing a resin-laminated board

US9757893B1 · US · B1

Patent metadata
FieldValue
Publication numberUS-9757893-B1
Application numberUS-201715646831-A
CountryUS
Kind codeB1
Filing dateJul 11, 2017
Priority dateJun 29, 2011
Publication dateSep 12, 2017
Grant dateSep 12, 2017

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A method of manufacturing a resin-laminated board by preparing a pair of first and second split molds each of which is provided with a cavity; positioning two sheet materials made of a thermoplastic resin between the first and second split molds with the cavities of the first and second split molds opposed to each other; forming a plurality of recesses by recessing a first sheet material toward a second sheet material with use of a plurality of protrusions provided to the first split mold; and welding bottoms of the recesses to the second sheet material by clamping the pair of first and second split molds to obtain a resin-laminated board with a hollow structure. A mold includes a plurality of piece members, disposed at the cavity of the first split mold; and includes the protrusions and male screws provided to base ends of the protrusions.

First claim

Opening claim text (preview).

The invention claimed is: 1. A method of manufacturing a resin-laminated board, comprising: preparing a pair of first and second split molds each of which is provided with a cavity; positioning two sheet materials made of a thermoplastic resin between the first and second split molds with the cavities of the first and second split molds opposed to each other; forming a plurality of recesses by recessing a first sheet material toward a second sheet material with use of a plurality of protrusions provided to the first split mold; and welding bottoms of the recesses to the second sheet material by clamping the pair of first and second split molds to obtain a resin-laminated board with a hollow structure, wherein a mold in use is configured to include a plurality of piece members: disposed at the cavity of the first split mold; and configured to include the protrusions and male screws provided to base ends of the protrusions, wherein the male screws are screwed into female screw holes provided to the first split mold, wherein a sealed space is formed between the first sheet material and the cavity of the first split mold, and wherein the first sheet member is shaped to follow the protrusions by vacuum suctioning the sealed space through a gap between the cavity of the first split mold and the base ends of the protrusions and through a gap between the female screw holes and the male screws.

Assignees

Inventors

Classifications

  • Composite web or sheet · CPC title

  • Exchangeable mould parts, e.g. cassette moulds, mould inserts (moulds with exchangeable mould parts for injection moulding B29C45/2673; mounting of exchangeable mould inserts for injection moulding B29C45/2675) · CPC title

  • characterised by a layer comprising a deformed thin sheet {, i.e. the layer having its entire thickness deformed out of the plane}, e.g. corrugated, crumpled (B32B29/08 takes precedence) · CPC title

  • multi-channelled · CPC title

  • outside the article · CPC title

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What does patent US9757893B1 cover?
A method of manufacturing a resin-laminated board by preparing a pair of first and second split molds each of which is provided with a cavity; positioning two sheet materials made of a thermoplastic resin between the first and second split molds with the cavities of the first and second split molds opposed to each other; forming a plurality of recesses by recessing a first sheet material toward…
Who is the assignee on this patent?
Kyoraku Co Ltd, Kyoraku Co Ltd
What technology area does this patent fall under?
Primary CPC classification B29C51/267. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Sep 12 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).