Method for manufacturing an optical communication device

Patent metadata

Field	Value
Publication number	US-9755752-B2
Application number	US-201414153494-A
Country	US
Kind code	B2
Filing date	Jan 13, 2014
Priority date	Nov 5, 2013
Publication date	Sep 5, 2017
Grant date	Sep 5, 2017

Abstract

A method of manufacturing an optical communication device aligns an optical sub-assembly and an optical modulator on a carrier wafer. A first sub-mount supports the optical sub-assembly and a second sub-mount supports the optical modulator. Pre-defined break lines are placed on the carrier wafer to accommodate separation of the sub-assembly and the optical modulator. The first sub-mount connects the optical sub-assembly to a thermoelectric cooler by either an epoxy, a spacer layer, or both. The optical sub-assembly is aligned in the x/y/z directions relative to the second sub-mount in a position to match an optical height of the optical modulator in the z-direction, wherein the z-direction is a vertical direction relative to the carrier wafer.

First claim

What is claimed:

1. A method of manufacturing an optical communication device, comprising:
positioning a first thermally conductive sub-mount configured to accommodate an optical laser on a carrier wafer substantially adjacent to a first pre-defined break line in the carrier wafer;
positioning a second sub-mount configured to accommodate an optical modulator on the carrier wafer substantially adjacent to a second pre-defined break line in the carrier wafer;
aligning the first thermally conductive sub-mount in x/y/z directions relative to the second sub-mount in a position to match an optical height of the optical modulator in the z-direction, wherein the z-direction is a vertical direction relative to the carrier wafer;
securing the first thermally conductive sub-mount to a thermally conductive and electrically non-conductive spacer;
securing the thermally conductive and electrically non-conductive spacer to a thermo-electrical cooler in a position that defines a gap between the first thermally conductive sub-mount and the thermo-electrical cooler;
securing the second sub-mount to an optical device platform; and
removing a portion of the carrier wafer between the first thermally conductive and second sub-mounts.

2. The method of claim 1 , further comprising:
sealing the first thermally conductive sub-mount in a hermetic enclosure; and
providing a connector in communication with the second sub-mount in order to use the optical communication device in an optical network.

3. The method of claim 2 , further comprising:
ensuring proper coupling of laser beams sent from the first thermally conductive sub-mount to the second sub-mount; and
adding an optical flat in order to recover coupling loss between the first thermally conductive sub-mount and the second sub-mount.

4. The method of claim 1 , further comprising filling the gap with a non-conductive epoxy.

5. The method of claim 1 , further comprising adjusting a height of the spacer in the z direction for the aligning of the first thermally conductive sub-mount to the second sub-mount.

6. The method of claim 1 , wherein the aligning comprises an alignment in the z-direction via bond line control between the first thermally conductive sub-mount and the optical laser and the second sub-mount and the optical modulator.

7. The method of claim 1 , further comprising aligning the first thermally conductive sub-mount and the second sub-mount in the x and y directions that are horizontal directions relative to the carrier wafer using a jaw tool.

8. The method of claim 1 further comprising aligning the first thermally conductive sub-mount and second sub-mount in the x and y directions using an inverted pyramid alignment feature.

9. The method of claim 1 , wherein the first thermally conductive sub-mount is configured to accommodate four lasers.

10. The method of claim 9 , wherein the first thermally conductive sub-mount is further configured to accommodate an isolator.

11. The method of claim 1 , further comprising the step of using a ceramic filled epoxy to attach the portion of the first thermally conductive sub-mount configured to accommodate an optical laser to the thermo-electrical cooler in order to decrease the risk of electrical shortage at the first thermally conductive sub-mount.

Assignees

• Cisco Tech Inc

Inventors

• Pfnuer Stefan
• Kachru Ravi
• Fangman John
• Chakrabarti Utpal

Classifications

• G02B6/4236

  Fixing or mounting methods of the aligned elements · CPC title

• Y10T29/49778

  with aligning, guiding, or instruction · CPC title

• H01S5/0265

  Intensity modulators (intra-cavity modulators H01S5/0625) · CPC title

• Y10T29/53178

  Chip component · CPC title

• H04B10/503 Primary

  Laser transmitters · CPC title